A hollow integrated circuit package

Abstract

The invention discloses a hollow integrated circuit package, the structure of which comprises a cooling cavity, a cover plate, and an anti-oxidation pin. Connection, the anti-oxidation pin includes a pin fixing device, a sealing block, and a shrinking plate. When the ejector block is ejected, under the fixation of the deflection shaft, the ejector block is in contact with the outside of the pin, which is beneficial to seal the pin, prevent moisture from entering, and improve the yield of the package. When the package is impacted, the spring will push the anti-fall block The locking head is fixed by deflecting to the left, and at the same time, the impact force of the pin is absorbed by the bending cover. When the impact pulls the fixed block outward, the tension belt fixed by the fixed column pulls the fixed block back, preventing the pin It is separated from the package, which improves the stability of the integrated circuit package.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit packaging, and more specifically, relates to a hollow integrated circuit packaging. Background technique [0002] The integrated circuit integrates a large number of transistors to realize logical operations by connecting and disconnecting electrical signals. After the design and production of the integrated circuit is completed, the circuit needs to be packaged by packaging technology to protect the dust collection circuit from physical collision and anti-corrosion. The integrated circuit will generate a lot of heat during the operation. In order to let this internal heat dissipate, the hollow integrated circuit packaging technology is now used. By setting a hollow structure at the bottom, the heat transfer oil is filled inside to speed up the heat diffusion of the integrated circuit. However, since the output of the electrical signal of the integrated circuit needs to be connected to ...

AI Technical Summary

Problems solved by technology

[0002] The integrated circuit integrates a large number of transistors to realize logic operations by connecting and disconnecting electrical signals. After the design and production of the integrated circuit is completed, the circuit needs to be packaged by packaging technology to protect the dust collection circuit from physical collision and corrosion. The integrated circuit will generate a lot of heat during operation. In order to dissipate this internal heat, the hollow integrated circuit packaging technology is now used. By setting a hollow structure at the bottom and filling the inside with heat-conducting oil to speed up the heat dissipation of the integrated circuit, However, since the output of the integrated circuit electrical signal needs to be connected to the circuit board through the pins, and the solder joints between the pins and the package cover should not be too large, when the circuit board is hit, the connection between the pins and the package cover is easy to fall off, resulting in integrated The signal of the circuit stops outputting, and in the weather with high humidity, the integrated circuit is easy to absorb the moisture in the gap due to the low metal temperature during the installation process. After installation, the water molecules and carbon dioxide will generate alkali under the action of the current. Copper carbonate can easily lead to poor contact between the pin and the circuit board, reducing the yield of the package

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