Miniature programmable surge protection device and manufacturing process thereof

Abstract

The invention discloses a miniature programmable surge protection device and a manufacturing process thereof. The manufacturing process comprises the following steps of: diffusing a layer of concentrated phosphorus on the back surface of an N-type monocrystalline silicon wafer; performing heavy phosphorus re-diffusion at high temperature to form a cathode region of a diode and a collector region of a triode in the device; performing liquid boron source diffusion on the front surface of the silicon wafer to form a diode boron supplementing region with a certain depth; doping the base region of the triode through ion implantation boron; forming a short base region of the thyristor and a base region boron supplementing region of the triode on the front surface through front surface liquid boron source diffusion; forming an emitter region of the triode on the triode base region through ion implantation phosphorus; photoetching a lead window in the front surface, and forming a scribing groove in the edge; depositing a layer of polycrystalline silicon on the surface through LPCVD; carrying out photoetching to form a lead wire hole; and metalizing the front surface and the back surface to obtain a chip. The chip prepared by adopting the manufacturing process has the advantages of miniaturization, high anti-surge capability, low cost, high reliability and the like.

Description

technical field [0001] The invention relates to the technical field of chip manufacturing, in particular to a manufacturing process of a micro programmable surge protection device. Background technique [0002] As the latest generation of semiconductor anti-surge devices, programmable surge protection devices are more and more widely used, especially playing an increasingly important role in the lightning protection of communication ports. However, the chip area of ​​this series of products on the market is relatively large at present, and the packaging is all in the shape of SOP-8, and the volume is large, which is contrary to the current trend of miniaturization of electronic devices. With the continuous shrinking of the volume of communication equipment, the size of each electronic device is further reduced. The size has become the research direction of the R&D personnel, especially in some occasions where the anti-surge capability is not high, and this field has always b...

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Problems solved by technology

However, the chip area of ​​this series of products on the market is relatively large at present, and the packaging is all in the shape of SOP-8, and the volume is large, which is contrary to the current trend of miniaturization of electronic devices. With the continuous shrinking of the volume of communication equipment, the size of each electronic device is further reduced. Volume has become the research direction of R&D personnel, especially in some occasions where the anti-surge capability is not high, which has always been blank in this field

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