Fingerprint identification chip packaging structure and manufacturing method thereof
A chip packaging structure and fingerprint recognition technology, which is applied in character and pattern recognition, fingerprint/palmprint acquisition/organization, semiconductor/solid-state device manufacturing, etc. It can solve the problems of unfavorable thinning of electronic devices and thick packaging of fingerprint recognition chips. , to achieve the effect of reducing production cost, reducing package thickness, and reducing package thickness
Pending Publication Date: 2021-10-12
FU TAI HUA IND SHENZHEN +1
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
However, the arrangement of the substrate makes the overall packaging thickness of the fingerprint identification chip thicker, which is not conducive to the thinning of electronic devices using the fingerprint identification chip.
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[0025] In order to more clearly understand the above objects, features and advantages of the present invention, the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.
[0026] In the following description, many specific details are set forth in order to fully understand the present invention, and the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understo...
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The invention provides a fingerprint identification chip packaging structure, and the structure comprises a packaging layer which comprises a fingerprint identification chip, a plurality of conductive columns, and a packaging material wrapping the fingerprint identification chip and the conductive columns; the rewiring layer is arranged on one side of the packaging layer, is close to the front surface of the fingerprint identification chip and comprises a plurality of leads, and the fingerprint identification chip is electrically connected with the corresponding conductive columns through the leads; and the pins are arranged on one side, far away from the rewiring layer, of the packaging layer, the pins are in one-to-one correspondence with the conductive columns, and each pin is electrically connected with one conductive column. The invention further provides a manufacturing method of the fingerprint identification chip packaging structure. According to the fingerprint identification chip packaging structure, the structure of the substrate does not need to be added, so that the overall packaging thickness of the fingerprint identification chip packaging structure is reduced, the light and thin development of the fingerprint identification chip packaging structure is facilitated, and meanwhile, the manufacturing cost is reduced.
Description
technical field [0001] The invention relates to the technical field of chip packaging, in particular to a fingerprint identification chip packaging structure and a manufacturing method thereof. Background technique [0002] Fingerprint identification technology is widely used in electronic devices such as display devices, attendance equipment, and door locks. In the prior art, when the fingerprint recognition chip is packaged, in order to avoid damage such as breakage of the fingerprint recognition chip with a small thickness during the packaging process, the fingerprint recognition chip is often packaged on a substrate, which can be a printed circuit board. The chip is electrically connected with the substrate. That is, the fingerprint identification chip is packaged together with the printed circuit board (substrate). When in use, the fingerprint identification chip packaged with the substrate is connected to a motherboard (such as a TFT substrate of a liquid crystal dis...
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IPC IPC(8): H01L23/31H01L23/48H01L23/528H01L21/50H01L21/56G06K9/00
CPCH01L23/3114H01L23/48H01L23/528H01L21/50H01L21/561H01L21/568H01L24/02H01L2224/0231H01L2224/0237H01L2224/02373H01L23/3128H01L2224/96H01L24/19H01L24/20H01L24/96G06V40/1329H01L2224/19H01L2224/83191H01L24/83H01L24/32H01L24/24H01L23/562H01L2224/29023H01L2224/2919H01L2224/831H01L2224/32225H01L2224/24175H01L24/29G06V40/1306
Inventor 吕香桦潘盈洁倪庆羽
Owner FU TAI HUA IND SHENZHEN