Semiconductor stacked component and preparation method thereof

Abstract

The present invention relates to a semiconductor stacked component and a preparation method thereof. The method comprising: forming first and second protruding parts on four sides of first and second semiconductor chips respectively, forming a first groove in the upper surface of each of the first semiconductor chips, forming a first convex block on each first protruding part in the first semiconductor chip, forming a second groove in the upper surface of each second semiconductor chip, forming a first concave cavity on each second protruding part in the second semiconductor chip, and bonding second semiconductor chips to the first semiconductor chips, so that each first bump in each first semiconductor chip is embedded into the corresponding first cavity in the corresponding second semiconductor chip, and an air gap is formed between the corresponding first semiconductor chip and the corresponding second semiconductor chip.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a semiconductor stacking component and a preparation method thereof. Background technique [0002] In the existing semiconductor stacking components, usually a plurality of semiconductor chips are stacked together through bonding materials, and then the stacked semiconductor chips are packaged with molding materials or underfill materials to form a semiconductor stack package structure. However, in the actual application process of the existing semiconductor stack package, since the semiconductor chip will generate heat during operation, heat transfer will occur between adjacent semiconductor chips, which will lead to mutual influence between adjacent semiconductor chips. In particular, when different types of semiconductor chips are stacked together, the performance of the semiconductor chips will be unstable, thereby affecting their service life. Contents of the inventi...

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Problems solved by technology

However, in the actual application process of the existing semiconductor stack package, since the semiconductor chip will generate heat during operation, heat transfer will occur between adjacent semiconductor chips, which will lead to mutual influence between adjacent semiconductor chips. Especially when different types of semiconductor chips are stacked together, the performance of the semiconductor chip will be unstable, which will affect its service life

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