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Benzocyclobutene-containing functionalized organosilicon compound and preparation method thereof

A benzocyclobutene functional, organosilicon compound technology, applied in the field of chemical materials to achieve the effects of excellent thermal stability, low cost and high yield

Pending Publication Date: 2021-10-19
TIANNUO PHOTOELECTRIC MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the prior art, there are many reports on benzocyclobutene resin at home and abroad, such as: US5882836, US5217568, US5136069; Journal of Polymer Science, Part A: Polymer Chemistry, 2011,49,381-391; Chinese patent CNL200710111698.4, etc., The benzocyclobutene resin prepared by using BCB intermediates through silicon hydrogen, HECK or Grignard reaction shows good electrical and thermal properties, but with the development of high frequency and high speed, the current 5G / 6G needs Dielectric loss at 10 -4 For low-dielectric materials of this magnitude, the dielectric constant of the existing foreign commercialized DVSBCB resin is 2.65 and the dielectric loss is 10. -3 -10 -2 , high-frequency and high-speed conditions limit the application of materials in the semiconductor industry

Method used

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  • Benzocyclobutene-containing functionalized organosilicon compound and preparation method thereof
  • Benzocyclobutene-containing functionalized organosilicon compound and preparation method thereof
  • Benzocyclobutene-containing functionalized organosilicon compound and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0033] Methyl, tris (dimethyl, benzocyclobutenyl silyl ethyl) silane (MTBCBSES), its chemical formula:

[0034]

[0035] The preparation method of MTBCBSES: In a dry anaerobic bottle equipped with a magnetic stirrer, add 5g of methyltrivinylsilane, 25g of 4-DMHSBCB, and a molar concentration of 0.025M (catalyst) H 2 PtCl 6 200 μL of tetrahydrofuran solution and 60 mL of toluene, the mixture was reacted at 70°C under nitrogen atmosphere for 40 hours, and the reaction raw material methyltrivinylsilane was monitored by thin layer chromatography to see if the reaction was complete. After the reaction is over, cool the reacted material to room temperature, add ethanol with 10 times the mass of the reacted material, precipitate, and filter; the solid (i.e., precipitate) obtained after filtration is placed in a vacuum drying oven at a pressure of -0.09 to - Dry at 0.095 MPa and 90° C. for 12 hours to obtain a paste-like product, that is, methyl, tris(dimethyl, benzocyclobutenylsi...

Embodiment 2

[0038] Phenyl, tris(dimethyl,benzocyclobutenylsilylethyl)silane (PTBCBSES), its chemical structure:

[0039]

[0040] The preparation method of PTBCBSES: In a dry anaerobic bottle equipped with a magnetic stirrer, add 8 g of phenyltrivinylsilane, 30 g of 4-DMHSBCB, and a molar concentration of 0.025M (catalyst) H 2 PtCl 6200 μL of tetrahydrofuran solution and 60 mL of toluene, the mixture was reacted at 90° C. for 60 hours under a nitrogen atmosphere, and the reaction raw material phenyltrivinylsilane was monitored by thin-layer chromatography to see if the reaction was complete. After the reaction is over, cool the reacted material to room temperature, add ethanol with 10 times the mass of the reacted material, precipitate, and filter; the solid (i.e., precipitate) obtained after filtration is placed in a vacuum drying oven at a pressure of -0.09 to - Dry at 0.095 MPa and 90° C. for 12 hours to obtain a paste product, that is, phenyl, tris(dimethyl, benzocyclobutenylsilyl...

Embodiment 3

[0043] Methyl, tris (dimethyl, benzocyclobutenylsilylpropyl) silane (MTBCBSPS), its chemical formula:

[0044]

[0045] The preparation method of MTBCBSPS: In a dry anaerobic bottle equipped with a magnetic stirrer, add 5-8g of methyltriallylsilane, 20-30g of 4-DMHSBCB, and a molar concentration of 0.025M (catalyst) H 2 PtCl 6 200 μL of tetrahydrofuran solution and 60 mL of toluene, the mixture was reacted at 80° C. for 24 hours under a nitrogen atmosphere, and the reaction raw material methyltriallylsilane was monitored by thin-layer chromatography to see if the reaction was complete. After the reaction is over, cool the reacted material to room temperature, add ethanol with 10 times the mass of the reacted material, precipitate, and filter; the solid (i.e., precipitate) obtained after filtration is placed in a vacuum drying oven at a pressure of -0.09 to - Dry at 0.095 MPa and 90° C. for 12 hours to obtain a paste-like product, that is, methyl, tris(dimethyl, benzocyclob...

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Abstract

The invention relates to the technical field of chemical materials, in particular to a benzocyclobutene-containing functionalized organosilicon compound and a preparation method of the compound. The structure of the compound is as shown in a formula (I) which is described in the specification. In the formula (I), n is equal to an integer in a range of 2-8; and R is one selected from (a) a substituted or unsubstituted C1-C6 alkyl group and (b) a substituted or unsubstituted aryl group. The compound disclosed by the invention or a polymer obtained by copolymerizing the compound with other compounds containing unsaturated bonds has excellent thermal stability, mechanical properties and dielectric properties, and can be used as a high-temperature-resistant material, a high-performance composite material, an electronic packaging material, an aeronautical material and the like; and the compound is applied to interlayer packaging of 5G / 6G high-frequency PCBs and chips and the like. The preparation method is simple, raw materials are cheap and easy to obtain, yield is high, cost is low, and large-scale production and application are easy.

Description

technical field [0001] The invention relates to the technical field of chemical materials, in particular to a benzocyclobutene functionalized organosilicon compound and a preparation method thereof. Background technique [0002] Benzocyclobutene (BCB for short) materials have excellent high and low temperature resistance, low dielectric, low loss, good air tightness, and radiation resistance, especially excellent film-forming properties and moisture resistance. , has been widely used in the field of electronic packaging. The BCB monomer is transformed into a conjugated diene structure after heating, and a highly crosslinked polymer is obtained through free radical polymerization and Diels-Alder reaction. Tetramethyldivinylsiloxane bridged benzocyclobutene (DVSBCB for short) (US5882836) developed by Dow Chemical Company is shown in the following formula. [0003] [0004] Its chemical structural formula is shown in the formula: this kind of resin has low dielectric const...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07F7/08C08G61/02
CPCC07F7/0805C07F7/0829C08G61/02C08G2261/11C08G2261/12
Inventor 朱焰焰胡欢王超郑杰
Owner TIANNUO PHOTOELECTRIC MATERIAL
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