MEMS microphone and back plate thereof

A back plate and microphone technology, applied in the field of microphones, can solve the problems of MEMS microphones with high electrical signal noise, and achieve the effects of reducing loss, improving output efficiency, and increasing conductive area

Pending Publication Date: 2021-10-22
瑶芯微电子科技(上海)有限公司
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AI-Extracted Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a MEMS microphone...
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Method used

As shown in Figure 3 and Figure 6, the present invention provides a kind of MEMS microphone back pole plate, wherein, described back pole plate comprises support back plate 10, back pole 30, electrode 40 and back pole plate pad 50, Wherein, the support backplane 10 includes a first part 101 and a second part 102, the first part 101 is integrally connected with the second part 102, the second part 102 is used to support the first part 101, the The middle area of ​​the first part 101 is provided with a middle area 1011, the middle area 1011 is divided into an open area 1011a and a non-open area 1011b, and the open area 1011a is provided with a number of sound inlet holes 20 penetrating through the support backplane 10 , the non-perforated area 1011b is not provided with the sound inlet 20; the outer edge of the non-apertured area 1011b is provided with a groove 103, and the groove 103 runs through the support back plate 10; the back pole 30 is located on the lower surface of the support backplane 10, and the sound inlet hole 20 is arranged corresponding to the support backplane 10; the electrode 40 is arranged on the surface of the groove 103 and the upper surface of the support backplane 10 A partial area of ​​the back electrode 30 is used to transmit electrical signals in the back electrode 30 ; It should be noted that the back electrode 30 on the lower surface of the non-aperture region 1011b is not provided with any openings, which significantly increases the conductive area of ​​the back electrode 30, so that charges do not accumulate near the conductive region 301, Therefore, the noise in the electrical signal is reduced, and the transmission efficiency of the electrical signal is improved.
In sum, the present invention provides a kind of MEMS microphone back plate, described back plate comprises support back plate, back pole, electrode and back plate pad, wherein, described support back plate comprises first part and a second part, the first part is integrally connected with the second part, the second part is used to support the first part, the middle area of ​​the first part is provided with a middle area, and the middle area is an opening area and a non-perforated area, the perforated area is provided with a number of sound inlet holes passing through the support backboard, the non-perforated area is not provided with the sound inlet holes; the edge of the non-perforated area is provided with Groove, the groove runs through the support backplane; the back pole is located on the lower surface of the support backplane, and the sound inlet hole is set corresponding to the support backplane; the electrode is arranged on the support backplane The surface of the groove and a part of the upper surface of the supporting backplane are used to transmit electrical signals in the backplane; the backplane pads are arranged on the upper surface of the supporting backplane, and are connected to the electrodes connect. The MEMS mi...
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Abstract

The invention provides an MEMS microphone and a back pole plate thereof. The back pole plate comprises a supporting back plate, a back pole, an electrode and a back pole plate bonding pad, the supporting back plate is provided with a middle area, the middle area is divided into an opening area and a non-opening area. The opening area is provided with a plurality of sound inlet holes penetrating through the supporting back plate. The non-opening area is not provided with the sound inlet holes. a groove is formed in the outer side of the edge of the non-perforated area and penetrates through the supporting back plate; the back electrode is located on the lower surface of the supporting back plate, and the sound inlet hole is formed in the position, corresponding to the supporting back plate, of the back electrode; the electrode is arranged on the surface of the groove and a partial area of the upper surface of the supporting back plate and is used for transmitting an electric signal in the back electrode; and the back polar plate bonding pad is arranged on the upper surface of the supporting back plate and is connected with the electrode. According to the MEMS microphone back pole plate, electric noise can be reduced, and the output efficiency of electric signals can be improved.

Application Domain

MicrophonesLoudspeakers +1

Technology Topic

Mems microphoneEngineering +4

Image

  • MEMS microphone and back plate thereof
  • MEMS microphone and back plate thereof
  • MEMS microphone and back plate thereof

Examples

  • Experimental program(1)

Example Embodiment

[0049] The embodiments of the present invention will be easily understood by those skilled in the
[0050] It should be noted that the illustrations provided in the present embodiment will only illustrate the basic contemplative of the present invention in a schematic manner, and only the components, shapes, shapes, and in accordance with the components of the present invention are shown in the illustration. Size drawn, the shape, quantity, location relationship, and proportion of each component can be changed at the premise of implementing this technical solution, and its component layout may also be more complicated.
[0051] like figure 1 A top view of a wreath arrangement of a conventional MEMS microphone. There are several incubator 20 in the wrapping plate, and several of the acoustic holes 20 are all connected to the wide plate and are evenly distributed in the preset region (middle region) 1011 of the wilt plate. The aperture of each of the input sound holes 20 is the same, and each of the input sound holes 20 is equal to equal spacing.
[0052] See figure 2 The wrap plate is formed to form a parallel plate capacitor structure and the diaphragm 80 senses the distance between the diaphragm 80 and the wrap pad, and the capacitance capacity change is changed. Further, the change in capacitance changes into a variation of the voltage signal by the integrated circuit chip is converted. The conductive region 301 is a region in contact with the electrode 40 at the bottom of the groove 103, is a portion for transmitting an electrical signal, which is electrically connected to the electrode 40 in the recess 103, and epitaxial The electrode 40 on the upper surface of the support back plate 10 is coupled to the backup plate pad 50 to transmit an electrical signal to the backup plate pad 50. One side of the conductive region 301 is located on the edge of the central region 1011, figure 1 A place in A. A large amount of electric charge in the widget 30 gathers at A, resulting in an increase in noise in the electrical signal. The inventors have been studied, which is due to the occupation of the transmitted electrical signal in the bearing hole 20, and as the current density increases, the degree of movement of the particles is more intense, the noise in the electrical signal It will also increase. Based on this analysis, the inventors consider reducing electrical noise by increasing the conductive area near A, and the specific embodiments are as follows.
[0053] like image 3 and Image 6 As shown, the present invention provides a MEMS microphone widop, wherein the backup plate includes a support back plate 10, a back electrode 30, an electrode 40, and a pad pad 50, wherein the support back plate 10 includes The first portion 101 and the second portion 102 are integrally connected to the second portion 102, the second portion 102 for supporting the first portion 101, and the first portion 101 intermediate region is provided with a central region. 1011, the central region 1011 is divided into an open cell 1011a and the non-open hole region 1011b, and the opening region 1011a is provided with a plurality of intake holes 20 through the support back plate 10, the non-open hole 1011b The input sound hole 20 is provided; the outer side of the edge of the non-open hole region 1011b is provided with a groove 103, the groove 103 penetrating the support back plate 10; the back electrode 30 is located at the support back plate 10 The lower surface is provided with the support back plate 10, and the electrode 40 is disposed on the surface of the groove 103 and a portion of the support back plate 10 for transmission. The electrical signal in the back electrode 30; the wrap pad 50 is disposed on the upper surface of the support back plate 10 and is connected to the electrode 40. In addition, the lower surface of the non-open hole region 1011b does not provide any opening, significantly increasing the conductive area of ​​the back electrode 30, and collects the charge in the vicinity of the conductive region 301. Thereby, the noise in the electrical signal is reduced, and the transmission efficiency of the electrical signal is improved.
[0054]As an example, the shape of the central region 1011 can be common shapes, such as circles (such as image 3 Disted), rounded rectangular (eg Figure 4 Disted) or positive polygons (such as Figure 5 Indicated.
[0055] As an example, the shape of the non-open hole region 1011b can be selected from the selection (eg image 3 Disted), rounded trapezoidal (eg Figure 4 Disted), parallelogram (eg Figure 5 One of the features shown.
[0056] It should be noted that in other embodiments, the shape of the central portion 1011 and the shape of the non-open hole region 1011b can also be selected from other shapes as needed, and the scope of the invention should not be excessively limiting.
[0057] like image 3 As shown, a wrap plate provided in the embodiment of the present invention, the central portion 1011 is circular, and the shape of the non-open hole region 1011b is a fan shape.
[0058] like Figure 4 As shown, a wrap plate provided in the embodiment of the present invention is provided, and the shape of the central region 1011 is a rounded tetragonal shape, and the shape of the non-open hole region 1011b is a rounded trapezoid.
[0059] like Figure 5 As shown, a wrap plate provided in the embodiment of the present invention, the shape of the central region 1011 is a positive hexagon, the shape of the non-opening region 1011b being parallelogram.
[0060] As an example, the area of ​​the non-open hole region 1011b comprises from 5% to 15% in the area of ​​the central portion 1011, which can both transmit the electrical signal transmission unaffected to avoid more noise, and can be avoided. Sound waves are greatly hindered by the wrapper, the MEMS microphone can receive normal sound signals.
[0061] As an example, the area of ​​the central region 1011 should also be appropriate, ensuring that the acoustic wave energy is smooth through the widopide plate without affecting the normal operation of the device. The central region 1011 area comprises from 70% to 90% in the upper surface area of ​​the support back plate 10. Preferably, the central regional area 1011 comprises 80% of the area of ​​the support back plate 10.
[0062] As an example, several of the acoustic acoustic holes 20 are arranged intervals each other, and the value of the interval distance is 5 μm to 20 μm. Preferably, a number of values ​​of several of the acoustic acoustic holes 20 from each other is 10 μm.
[0063] As an example, the shape of the acoustic acoustic hole 20 is selected from one of a circular, elliptical, and a polygon, or may be selected from other shapes.
[0064] It should be noted that in other embodiments, the shape of the acoustic hole 20 can also be selected from other shapes as needed, as long as the size is suitable, the acoustic wave can be passed smoothly, and the present invention should not be limited herein. protected range.
[0065] As an example, when the shape of the acoustic hole 20 is circular, the aperture range is 5 μm to 30 μm, and it is ensured that the sound wave is not affected by the feed hole 20 into the microphone.
[0066] As an example, such as image 3 As shown, the groove 103 is adjacent the outer edge of the non-open hole region 1011B, and the corresponding side of the conductive region 301 is in contact with the non-open area 1011b in a certain position B, and the position B can be The intermediate of the outer edge of the non-open hole region 1011b. In this way, the conductive region 301 is ensured with the intersection B in the non-intake acoustic hole region 1011b, and the distance is farther away from the acoustic hole 20, which is increased. The conductive area, no charge aggregation, so that the electrical noise is lowered, and the output efficiency of the electrical signal is improved.
[0067] like Image 6 As shown, the present invention also provides a MEMS microphone that will be applied to the MEMS microphone using any of the above technical solutions, the MEMS microphone including substrate 70, diaphragm 80, and the above technical solution. One of the MEMS microphone wlides, wherein the substrate 70 forms a support structure, and an opening is provided; the diaphragm 80 is spaced apart from the base 70 and is connected to the substrate 70; The back polar plate is located above the substrate 70 and the diaphragm 80, and there is a preset interval between the diaphragm 80. Further, conventional structures in the MEMS microphone may also include blocking blocks 60, wrinkle structural 90, discharge holes 100, brackets 110, and cavities 120, etc., will not be described herein.
[0068] As an example, the second portion 102 in the support back plate 10 is located on the substrate 70 and in contact with the substrate 70, the second portion 102 supports the first portion 101, so that the first portion 101 The upper part of the diaphragm 80 is across.
[0069] As an example, the working step of the MEMS microphone of the present invention includes:
[0070] S1, the acoustic wave is conducted to the diaphragm 80 through several of the MEMS microphone widgets.
[0071] S2, the diaphragm 80 is bent with a sound wave such that the distance between the imbulent film 80 and the widop is changed, and a capacitance change is generated;
[0072] S3, the dedicated integrated circuit chip connected to the MEMS microphone amplifies this capacitance and converts it into an electrical signal output.
[0073] In summary, the present invention provides a MEMS microphone wide plate including a support back plate, a welp electrode, an electrode, and a welded pad, wherein the support back plate comprises a first portion and a second. Part, the first portion is integrally coupled with the second portion, the second portion for supporting the first portion, the first part intermediate region is provided with a central region, and the central part is distinguished into a hole region and a non-open The hole region is provided with a plurality of intacity holes that penetrate through the support back plate, the non-open hole region, and a groove is provided outside the edge of the non-open area. The groove penetrates through the support backplane; the back electrodes are located below the support backplane, and the support back plate is provided in accordance with the support back plate; the electrode is disposed on the groove surface. And the partial region of the support back plate is used to transmit an electrical signal in the back pole; the backup plate is disposed on the upper surface of the support back plate and is connected to the electrode. The MEMS microphone of the present invention has the advantageous effect: by reducing the intake hole in the vicinity of the electrical signal transmission area in the wlode plate, thereby increasing the electrically conductive area of ​​the transmission electrical signal in the widget, thereby reducing electricity Noise reduces the loss of the wroop electrical signal during transmission, and improves the output efficiency of the electrical signal. Therefore, the present invention effectively overcomes the disadvantages of the prior art with a high degree of utilization value.
[0074] The above embodiments are exemplified only to illustrate the principles and their efficacy of the present invention, rather than limiting the invention. Anyone who is familiar with this technique can modify or change the above-described embodiment without violating the spirit and scope of the invention. Thus, all the artists in the art will have all the equivalent modifications or changes that are not departed from the spirit and technical idea disclosed in the present invention, and should be included in the claims of the invention.

PUM

PropertyMeasurementUnit
Aperture5.0 ~ 30.0µm

Description & Claims & Application Information

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Classification and recommendation of technical efficacy words

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