Semiconductor refrigeration mobile phone support
A mobile phone bracket, semiconductor technology, applied in refrigerators, refrigeration and liquefaction, telephone structure and other directions, can solve the problems of inability to cool mobile phones, poor cooling effect, etc.
Pending Publication Date: 2021-10-22
HENAN HONGCHANG ELECTRONICS
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- Summary
- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0003] In the prior art, the mobile phone holder described above cannot cool down the mobile phone from the front (screen side) of the mobile phone, but can only cool down the mobile phone from the bottom of the mobile phone, which has the disadvantage of poor cooling effect
Method used
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Embodiment Construction
[0021] The technical solution of the present invention will be further described below in conjunction with the accompanying drawings.
[0022] Such as figure 1 , 2 , 3, the semiconductor cooling mobile phone bracket includes a bottom panel 1, and two clips are installed on the bottom panel, these two clips are respectively a left clip 2 and a right clip 3, the bottom panel A cooling element 4 is installed below, and the side of the cooling element can lower the temperature after the power supply is connected, and the lower temperature side is the low temperature side, and it is characterized in that: the low temperature side is equipped with an air flow chamber 5, and the air flow chamber 5 is installed on the low temperature side. The chamber has an air inlet 51 and an air outlet 52, and a blower 6 is installed in the air flow chamber, and the blower can deliver the cold air in the air flow chamber to the air outlet;
[0023] The inside of the clip has a mobile phone contac...
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The invention relates to the technical field of mobile phone products, in particular to a semiconductor refrigeration mobile phone support which comprises a bottom panel and two clamping pieces installed on the bottom panel, an air flow chamber is installed in the low-temperature side and provided with an air inlet and an air supply outlet, an air feeder is installed in the air flow chamber, and the air feeder can convey cold air in the air flow chamber to the air supply outlet; the inner side of each clamping piece is provided with a mobile phone contact part which is in contact with a mobile phone, an extension part is also arranged on the mobile phone contact part, the extension part exceeds a screen on the mobile phone during use, the extension part is provided with a first air blowing hole, the first air blowing hole faces the screen on the mobile phone, and the air supply outlet is communicated with the first air blowing hole through a pipeline. The semiconductor refrigeration mobile phone support has the advantages that the mobile phone can be cooled from the front side of the mobile phone, and the cooling effect is good.
Description
technical field [0001] The invention relates to the technical field of mobile phone supplies, in particular to a mobile phone bracket. Background technique [0002] The mobile phone bracket is a part for supporting the mobile phone, and it includes a bottom panel, and two clips are installed on the bottom panel, and these two clips are respectively the left clip and the right clip, and the bottom clip described in use The top of the panel touches the back of the mobile phone, and the clips are stuck on the left and right sides of the mobile phone. In order to keep the mobile phone in a low temperature state, a cooling part is installed under the bottom panel. After connecting the power supply, the cooling part will The side can reduce the temperature and transfer the cold energy to the bottom panel. The low-temperature bottom panel can reduce the temperature of the mobile phone placed on it, which is more conducive to protecting the mobile phone. [0003] In the prior art, ...
Claims
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IPC IPC(8): H05K7/20F25B21/02H04M1/11
CPCH05K7/20145H05K7/20209H05K7/20218F25B21/02H04M1/11
Inventor 陈建民赵丽萍张文涛惠小青蔡水占钱俊有张建中任保国韩笑冯玉杰王军霞
Owner HENAN HONGCHANG ELECTRONICS