Semiconductor device and assembly thereof
A technology of semiconductors and devices, which is applied in the field of semiconductor devices and their components, can solve problems such as improving the structure of semiconductor devices, and achieve the effects of avoiding failure caused by overheating, improving reliability, and having a wide range of applications
Pending Publication Date: 2021-10-29
SHANGHAI UNIV
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Problems solved by technology
[0009] Therefore, there are various deficiencies and defects in the way of temperature measurement in semiconductor devices in the field, and the structure in semiconductor devices has not been improved so that it can easily and conveniently obtain its internal single-point or even multi-point temperature when it is put into use. temperature information
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[0027] In order to illustrate the technical solutions of the embodiments of the present application more clearly, the following briefly introduces the accompanying drawings that are used in the description of the embodiments. Obviously, the accompanying drawings in the following description are only some examples or embodiments of the present application. For those of ordinary skill in the art, without any creative effort, the present application can also be applied to the present application according to these drawings. other similar situations. Unless obvious from the locale or otherwise specified, the same reference numbers in the figures represent the same structure or operation.
[0028] As shown in this application and in the claims, unless the context clearly dictates otherwise, the words "a", "an", "an" and / or "the" are not intended to be specific in the singular and may include the plural. Generally speaking, the terms "comprising" and "comprising" only imply that th...
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The invention provides a semiconductor device and an assembly thereof, the semiconductor device comprises a plurality of first light guide structures and at least one second light guide structure which are embedded in the semiconductor device, and the plurality of first light guide structures and the at least one second light guide structure are connected with each other and are arranged at intervals; the second light guide structure is suitable for converting the temperature information into a changing light signal; and the first light guide structures are adapted to constrain the light signal to form a linear, broken-line or curved measurement light path, and one end of at least one of the plurality of first light guide structures is adapted to provide temperature information by providing the light signal in the measurement light path. According to the semiconductor device and the assembly thereof, single-point or multi-point temperature measurement in a single semiconductor device or multiple semiconductor devices can be facilitated, the application range is wide, and the reliability is high.
Description
technical field [0001] The present invention mainly relates to the field of semiconductor structures, in particular to a semiconductor device and its components. Background technique [0002] The application of high-power semiconductor devices and integrated semiconductor devices in industrial and civil fields is becoming more and more extensive and in-depth. In the high-power applications that traditional vacuum electronic devices are good at, semiconductor devices have a tendency to gradually replace them. With the increasing integration of semiconductor devices and the penetration of semiconductor devices in high-power applications, the internal power density of semiconductor devices and integrated semiconductor devices naturally presents an increasing trend. [0003] Among the common failure models of electronic products, there are generally failures caused by overheating, failures caused by vibration, failures caused by moisture, and failures caused by dust accumulatio...
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IPC IPC(8): H01L23/34G01K11/00
CPCH01L23/34G01K11/00
Inventor 陈娜杨梅王廷云刘勇庞拂飞陈振宜
Owner SHANGHAI UNIV