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Thermally conductive potting composition

A heat-conducting potting and composition technology, applied in the direction of adhesive types, heat exchange materials, adhesive additives, etc., can solve the problems of poor fluidity of potting compositions and difficult potting processing.

Pending Publication Date: 2021-10-29
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after mixing the first part and the second part, the potting composition exhibited poor fluidity and difficult potting process due to the incorporation of fumed silica

Method used

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  • Thermally conductive potting composition
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  • Thermally conductive potting composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-8

[0120] The first part of the adhesive composition sample was prepared according to Table 1 by the following steps.

[0121] i) Mix EPIKOTE 240 with Modifier 48 at 2000rpm for 2 minutes;

[0122] ii) adding Plenact AL-M, ACA-AA2 or ACA-EAA1 to the mixture of step i) and mixing the mixture at 2000 rpm for 2 minutes; and

[0123] iii) Add thermally conductive fillers of BAK 40 and BAK 10 or RY 20 and CF 5 to the mixture of step ii) and mix the mixture for 2 minutes at 2000 rpm.

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Abstract

Provided is a thermally conductive potting composition, comprising a first part comprising at least one epoxy resin; at least one thermally conductive filler; and at least one metal complex; and a second part comprising at least one curing agent. The first part of the thermally conductive potting composition exhibits high thixotropic index and therefore the first part is easily stored. After the first part and the second part is mixed, the thermally conductive potting composition exhibits low thixotropic index and the meets the requirement for potting process.

Description

technical field [0001] The present invention relates to a thermally conductive potting composition comprising: a first part comprising at least one epoxy resin, at least one thermally conductive filler, and at least one metal complex; and a second part comprising Contains at least one curing agent. The first part of the thermally conductive potting composition exhibits a high thixotropic index and is therefore easy to store. After the first part is mixed with the second part, the heat-conducting potting composition exhibits a low thixotropic index and meets the requirements of the potting process. Background technique [0002] With the development of transportation, electronics, and general industry, it is desirable to have smaller and lighter electrical components, such as batteries, motors, and generators. Insulating materials are often used to encapsulate the sensitive components of electrical components, protecting them from moisture and providing cushioning from damag...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C08G59/68C08G59/70C09J11/00C09K3/10
CPCC08G59/68C09J163/00C08G59/70C09K5/14C08K2003/2227C08L63/00C08K3/22C08K3/26C09D163/00C08K2201/001C09D7/69C09D7/61C09D7/68C09D7/70C08G59/685C08K7/18C08K2201/005C09D5/00
Inventor 黄磊武豪谢玄邱雪宇
Owner HENKEL KGAA