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RFID flip packaging chip mounting device

It is a technology of chip mounting and flip packaging, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, and circuits. Realize high-speed and high-precision bonding and reduce the effect of laying

Pending Publication Date: 2021-11-09
SHENZHEN HADESHENG PRECISION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the purpose of this application is to provide an RFID flip-package chip placement device, which solves the technical problems that the traditional placement device is large in size, complex in mechanism, and unable to achieve high-speed and high-precision bonding

Method used

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  • RFID flip packaging chip mounting device
  • RFID flip packaging chip mounting device
  • RFID flip packaging chip mounting device

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Embodiment Construction

[0057] The following will clearly and completely describe the technical solutions of the embodiments of the present application with reference to the accompanying drawings. Apparently, the described embodiments are part of the embodiments of the present application, not all of them. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the embodiments of the present application.

[0058] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer " and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the descr...

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Abstract

The invention discloses an RFID flip packaging chip mounting device, and relates to the technical field of RFID chip processing. The RFID flip packaging chip mounting device comprises a fixed seat, a rotary driving device, a reciprocating driving device and a mounting suction head; the reciprocating driving device is mounted on the fixed seat, is connected with the rotary driving device and is used for driving the rotary driving device to reciprocate; the rotary driving mechanism comprises a rotary motor and a flexible buffering and rotating mechanism; and the flexible buffering and rotating mechanism comprises a motor connecting rod, an air inlet seat, a first connector, a second connector, an elastic piece, a ventilation guide rod and a flexible air pipe. The flexible buffering and rotating mechanism is arranged between the rotating motor and the mounting suction head, so that the rotating control of the rotating motor and the mounting suction head is ensured, the arrangement of external pipelines can be reduced, the whole device is miniaturized and light, the mounting suction head has certain elastic displacement in the reciprocating motion direction, and the high-speed and high-precision lamination can be better realized.

Description

technical field [0001] The present application relates to the technical field of RFID chip processing, in particular to an RFID flip-package chip attaching device. Background technique [0002] Radio Frequency Identification (RFID) is a kind of automatic identification technology. It uses radio frequency to perform non-contact two-way data communication, and uses radio frequency to read recording media (electronic tags or radio frequency cards). Writing, so as to achieve the purpose of identifying targets and data exchange, it is considered to be one of the most potential information technologies in the 21st century. RFID chips are the core components of radio frequency systems. In order to make the quality of RFID chips more reliable, there are more and more researches on the processing of RFID chips. [0003] However, in the RFID flip-package chip placement process, the placement suction head of the traditional placement device is driven by a conventional servo motor or a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/67H01L21/56
CPCH01L21/6838H01L21/67126H01L21/563
Inventor 王毅周佳亮张占平文莲
Owner SHENZHEN HADESHENG PRECISION TECH