IC finished product small-batch test equipment and test method thereof

Abstract

The invention discloses IC finished product small-batch test equipment and a test method thereof, and the equipment comprises a rack, and a flexible vibration disc, a first chip suction positioning camera, a four-axis manipulator, a chip installation positioning camera, a chip test seat and a second chip suction positioning camera which are disposed on the rack. The first chip suction positioning camera is arranged above the flexible vibration disc and collects the positive and negative, position and direction information of a chip on the flexible vibration disc, and the chip installation positioning camera is arranged between the flexible vibration disc and the chip testing seat and used for collecting the installation position and direction of the sucked chip. A chip sucking disc is arranged at the end part of the four-axis manipulator and is used for sucking a chip; and a second chip sucking and positioning camera is arranged at the end part of the four-axis manipulator and is used for accurately acquiring the position and direction of the sucked chip. According to the invention, full-automatic testing of different types of IC finished products is realized, automatic operation is completed in the whole process, manual participation is not needed, manpower is saved, and the chip testing efficiency is greatly improved at the same time.

Description

technical field [0001] The invention relates to a testing device and a testing method thereof, in particular to a small-batch testing device for IC finished products and a testing method thereof, belonging to the field of semiconductor testing equipment. Background technique [0002] In the production process of the semiconductor back-end packaging and testing process, there are many different types of small-batch products that need to be tested. At present, the usual methods mainly include manual testing and targeted transformation of product lines. Manual testing relies on manually grabbing the chip to be tested and then placing the chip to be tested in the test base for testing. Since some types of IC chips are small in size, less than 5mm in length, and very thin in thickness, when manually grabbing Very inconvenient, resulting in very low test efficiency. In addition, because it is easy to carry static electricity on human hands, it is necessary to eliminate static el...

AI Technical Summary

Problems solved by technology

Manual testing relies on manually grabbing the chip to be tested and then placing the chip to be tested in the test base for testing. Since some types of IC chips are small in size, less than 5mm in length, and very thin in thickness, when manually grabbing Very inconvenient, resulting in very low test efficiency

In addition, since it is easy to carry static electricity on human hands, it is necessary to eliminate static electricity before operation. If the static electricity is not eliminated, grabbing the chip will easily cause the chip to be broken down by static electricity and cause economic losses.

Moreover, in the process of grabbing by hand, improper operation can easily cause problems such as deformation of the pins of the chip, resulting in test failure.

The product line transformation method requires the transformation of the original product line, and directly integrates the test equipment into the original product production line. On-site transformation is difficult and costly. One production line needs to be transformed to add a set of test equipment, which greatly increases the overall cost. production cost

Images