Drying device for semiconductor cleaning equipment
A technology for cleaning equipment and drying equipment, which is applied in drying, drying machine, drying gas arrangement, etc. It can solve the problems of high temperature, heat accumulation, damage to the internal structure of semiconductors, etc., and achieve the effect of uniform evaporation and avoiding damage
Active Publication Date: 2022-02-08
华林科纳(江苏)半导体设备有限公司
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Problems solved by technology
[0003] However, when the existing technology is actually used, the existing drying technology is to pass hot air on the surface of the semiconductor. However, this method is easy to cause local heat accumulation to generate high temperature and damage the internal structure of the semiconductor.
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[0035]The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0036] see Figure 1-12 , the present invention provides a technical solution: comprising:
[0037] The drying box 1 and the ultrasonic generator 2, the ultrasonic generator 2 is fixedly arranged inside the drying box 1;
[0038] The drying auxiliary assembly 3 is arranged inside the drying box 1 and is used to drive the semiconductor to make a circular motion. The drying auxiliary assembly 3 includes a plurality of first rotating rings 301 and a second rotati...
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The invention discloses a drying device for semiconductor cleaning equipment, comprising: a drying box and an ultrasonic generator, the ultrasonic generator is fixed inside the drying box; a drying auxiliary component is set inside the drying box and uses To drive the semiconductor to perform circular motion, the drying auxiliary assembly includes a plurality of first rotating rings and second rotating rings. The present invention starts the ultrasonic generator, because the ultrasonic wave has a cavitation effect, that is, the ultrasonic wave can generate bubbles in the water, which makes the liquid on the surface of the conductor wafer generate bubbles, and the explosion of the bubbles will cause the liquid to form smaller droplets. When the air pump drives the air inlet component and the air outlet component to form a circulating air duct, the circulation of the air will accelerate the evaporation of the liquid, so that after the explosion, the smaller droplets are either evaporated or taken away by the wind flow, so that it can be achieved without hot air. The drying operation avoids damage to the semiconductor due to excessive temperature.
Description
technical field [0001] The invention relates to the technical field of semiconductor drying equipment, in particular to a drying device for semiconductor cleaning equipment. Background technique [0002] In the manufacturing process of semiconductors, pattern transfer processes are required, including photolithography processes. The photolithography process is a pattern duplication technology, which is a key technology in the semiconductor manufacturing process. In simple terms, lithography is inspired by photographic technology, and uses the photosensitive properties of photoresist to accurately copy the pattern of the photolithography mask onto the photoresist coated on the wafer. Before the photoresist is spin-coated onto the wafer, the wafer surface needs to be baked because the wafer surface is cleaned. [0003] However, when the existing technology is actually used, the existing drying technology is to pass hot air on the surface of the semiconductor. However, this m...
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IPC IPC(8): F26B9/06F26B21/00F26B25/00
CPCF26B9/066F26B21/004F26B25/00
Inventor 徐竹起
Owner 华林科纳(江苏)半导体设备有限公司