Unlock instant, AI-driven research and patent intelligence for your innovation.

Mounting position detection device for semiconductor equipment

A detection device and semiconductor technology, which is applied in the direction of single semiconductor device testing, measurement device, semiconductor characterization, etc., can solve the problems of radiation heat loss, reduction of semiconductor equipment utilization rate, high labor cost and material cost, etc., to improve production efficiency. The effect of improving the efficiency, avoiding downtime, debugging and restarting, saving labor costs and material costs

Active Publication Date: 2022-05-20
无锡迪渊特科技有限公司
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The cooling liquid channel will affect the temperature of the carrier near the side wall of the cavity, which will easily lead to serious radiation heat loss in the edge area of ​​the carrier, resulting in poor uniformity of the film formed on the substrate, so It is necessary to detect the installation position of the edge ring next to the carrier table. The traditional installation position detection method usually corrects the installation position of the edge ring through the uniformity of thin film deposition after the semiconductor equipment is restarted. The semiconductor equipment needs to be shut down and debugged repeatedly. Parallel recovery requires a lot of labor and material costs, resulting in a decrease in the utilization rate of semiconductor equipment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mounting position detection device for semiconductor equipment
  • Mounting position detection device for semiconductor equipment
  • Mounting position detection device for semiconductor equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Mounting position detection devices for semiconductor equipment such as figure 1 , figure 2 , image 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 15 , Figure 18 , Figure 19 and Figure 20 As shown, it includes a component to be detected 1, a double-rail underframe 21, a special-shaped slotted support frame 22, a push-down component 3 and a levelness detection component 4. The component to be detected 1 is installed on the semiconductor device, and the component to be detected 1 is fixed. A double-track underframe 21 is installed, and a special-shaped slotted support frame 22 is slidably connected to the double-rail underframe 21. A levelness detection component 4 is arranged symmetrically on the upper side.

[0044] The component 1 to be tested includes a mounting slide rail frame 11, a carrying platform 12, a sliding sleeve 13, an edge ring 14, a spine 15, a fi...

Embodiment 2

[0052] On the basis of Example 1, such as Figure 13 , Figure 14 , Figure 15 , Figure 16 and Figure 17 As shown, it also includes an adjustment assembly one 5, the L-shaped slotted carriage 43 is fixedly connected with an adjustment assembly one 5, and the adjustment assembly one 5 includes a special-shaped connecting rod 51, a top block one 52, and a top block two 53. Top block three 54 and the first return spring 55. The L-shaped slotted carriage 43 is fixedly connected with a special-shaped connecting rod 51, and the special-shaped connecting rod 51 is slidably connected with a top block one 52. The top block one 52 is in contact with the edge ring one 14, the top block two 53 is slidably connected to the special-shaped connecting rod 51, the top block three 54 is also slidably connected to the special-shaped connecting rod 51, and the special-shaped connection A first return spring 55 is connected between the rod 51 and the top block one 52, a pair of first return ...

Embodiment 3

[0057] On the basis of Example 2, such as Figure 18 and Figure 19 As shown, an adjustment assembly 7 is also included, and the special-shaped slotted support frame 22 is provided with an adjustment assembly 7, and the adjustment assembly 7 includes a rectangular slotted frame 71, a special-shaped rack frame one 72, an extrusion spring 73, Adjustment gear 74, lower pressing block 75 and compression spring 76, described rectangular slotted frame 71 is affixed to special-shaped slotted support frame 22 top surfaces, described rectangular slotted frame 71 is connected with special-shaped rack frame one 72 in sliding type , two extruding springs 73 are connected on the special-shaped rack frame one 72, one end of the extruding springs 73 is connected with the rectangular slotted frame 71, and an adjusting gear 74 is fixed symmetrically on one edge ring two 18, The adjusting gear 74 is meshed with the special-shaped rack frame one 72, and the two slotted connecting frames 36 are ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the field of semiconductor equipment detection, in particular to an installation position detection device for semiconductor equipment, including a component to be detected, a double-rail underframe, a special-shaped slotted support frame, a push-down component, etc.; the component to be detected is installed on the semiconductor device. A double-track underframe is fixedly installed on the component to be detected, and a special-shaped slotted support frame is slidably connected to the double-rail underframe, and a push-down component is arranged on the special-shaped slotted support frame. Through the set measuring rod, the measuring rod moves on the surface of the wafer to detect its levelness, and the staff judges the levelness of the wafer by observing whether the wedge-shaped detection plate is blocked, so as to know the levelness of edge ring 1 and edge ring 2, The staff can quickly and conveniently judge whether the first edge ring and the second edge ring are installed in place.

Description

technical field [0001] The invention relates to the field of semiconductor equipment detection, in particular to a mounting position detection device for semiconductor equipment. Background technique [0002] In the field of semiconductor manufacturing, the corresponding film formation process is usually performed by chemical vapor deposition, which is a multi-step sequence of chemical processing steps in which electronic circuits are gradually formed on wafers made of pure silicon. material, the side wall of the chamber of the vapor deposition equipment is usually provided with a cooling liquid channel, so as to prevent the temperature of the side wall of the chamber from being too high, which is not conducive to the operation of the vapor deposition equipment by the operator. [0003] The cooling liquid channel will affect the temperature of the carrier near the side wall of the cavity, which will easily lead to serious radiation heat loss in the edge area of ​​the carrier...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01C9/00G01C9/02G01B5/24G01R31/26G01R1/04
CPCG01C9/00G01C9/02G01B5/24G01R31/2648G01R1/04
Inventor 王迪杏王宁王金裕
Owner 无锡迪渊特科技有限公司