Manufacturing method of circuit board for LED lamp strip
A technology for circuit board manufacturing and LED light strips, applied in printed circuit manufacturing, removal of conductive materials by chemical/electrolytic methods, printed circuits, etc., can solve problems such as unreliable electrical connections, large environmental pollution, and high manufacturing costs, and achieve The effect of low production cost, little environmental pollution and simple process
Inactive Publication Date: 2021-12-10
江门市鼎峰照明电子科技有限公司
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Problems solved by technology
In the manufacture of circuit boards in the prior art, due to the need to carry out wet etching twice on the circuit substrate, the process is complicated, the manufacturing cost is high and the environment is polluted; Two times of electroplating in the hole, the process is complicated and the electrical connection is unreliable; when connecting the external power supply, it is necessary to weld the wire terminal on the connection circuit, the process is complicated and the electrical connection is not reliable
Method used
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[0016] In order to further understand the features, technical means, specific objectives and functions of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0017] refer to figure 1 and figure 2 . A double-sided circuit board substrate for LED light strips, including an insulating substrate 1, a conductive layer 2 covering the substrate 1 is adhered on one side of the substrate 1, and a circuit board is adhered on the other side. A plurality of conductive strips 3 of the power circuit. A first isolation area S1 is provided between the plurality of conductive strips 3 , and a second isolation area S2 is provided between the edge of the substrate 1 and the conductive strip 3 closest to the edge of the substrate 1 . Since the thickness of the substrate 1 is relatively thin, setting the second isolation region S2 can prevent short circuit or creepage between the conduc...
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The invention relates to a manufacturing method of a circuit board for an LED lamp strip. The method comprises the steps that: a substrate is made of an insulating material; a conductive layer fully distributed on the substrate is formed on one side of the substrate, and a plurality of conductive strips at intervals are formed on the other side of the substrate; anti-corrosion ink is printed on the conductive layer according to a designed circuit pattern, and meanwhile baking and curing are conducted; the part, which is not covered by the anti-corrosion ink, on the conductive layer is etched by using a corrosion liquid agent, and then the anti-corrosion ink is removed, so that the part, which is not corroded, on the conductive layer forms a connecting circuit; a solder resist ink layer is printed on the connecting circuit, meanwhile, first bonding pads for exposing the connecting circuit are reserved at the positions where LED lamp beads and other electronic components need to be welded, and second bonding pads are reserved at the positions where the connecting circuit and the conductive strips need to be conducted; and finally, electric conductors which are electrically connected with the connecting circuit and the conductive strips are inserted into the second bonding pads.
Description
technical field [0001] The invention relates to a method for manufacturing a circuit board, and specifically discloses a method for manufacturing a circuit board for an LED light strip. Background technique [0002] The manufacturing process of the existing lead-free LED light strip includes: first, select the circuit board base material with copper foil attached on both sides, and then make the connection circuit connecting the LED lamp beads on one side of the copper foil by wet etching, and then On the other side of the copper foil, make a power supply circuit for conductive power supply through the second wet etching; then, start a via hole at the place where the connecting circuit and the power supply circuit need to be electrically connected; then; electroplate a palladium metal layer on the inner wall of the via hole As a transition layer, electroplate the copper metal layer connecting the connection circuit and the power circuit on the palladium metal layer; then, co...
Claims
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IPC IPC(8): H05K3/00H05K3/06H05K3/40
CPCH05K3/00H05K3/06H05K3/4007
Inventor 赖思强
Owner 江门市鼎峰照明电子科技有限公司