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Manufacturing method of circuit board

A manufacturing method and technology of circuit boards, which are applied in printed circuit manufacturing, printed circuit, printed circuit drying, etc., can solve the problems of being easily scratched, not being able to lean against each other, and the thickness of solder resist is limited, etc.

Pending Publication Date: 2021-12-10
鹤山市泰利诺电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing process, silk screen solder resist equipment is usually used to pressurize the circuit board, so that the solder resist oil is coated on the surface of the circuit board, and then the circuit board coated with solder resist oil is transported to the baking Baking in the baking box. During the transportation process, the circuit boards coated with solder resist oil need to be placed vertically and separated from each other, and cannot be placed against each other. When in the oven, the circuit boards are also vertical and separated. against each other
[0004] The coating of solder resist oil and the baking of circuit boards require independent equipment to operate. After the coating process of solder resist oil is completed, the circuit board needs to be transported to the position of the baking oven. After other processes of circuit boards are completed, also The circuit board needs to be transported to a baking oven for baking. During the production process, the circuit board is constantly moved around, which seriously affects the production efficiency of the circuit board. Moreover, the circuit board is easily deformed and damaged during the transportation process. It is easy to be scratched. In addition, when the silk screen solder resist equipment coats the circuit board with solder resist oil, the thickness of the coated solder resist oil is limited due to the pressure screen printing. Some circuit boards need to be coated with anti-solder oil twice. Welding oil can meet the process requirements

Method used

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  • Manufacturing method of circuit board
  • Manufacturing method of circuit board

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] figure 1 A flow chart of a method for manufacturing a circuit board according to an embodiment of the present invention is schematically shown.

[0038] refer to figure 1 , a method for manufacturing a circuit board, comprising the following steps:

[0039] S101: making a circuit on the copper clad laminate.

[0040] In this embodiment, the copper-clad laminate adopts a board covered with copper skin on one side;

[0041] The cutting equipment cuts the raw material of the copper clad laminate into the copper clad laminate of the required size, and then uses the grinding machine to clean the cut copper clad laminate to make the surface free of dust, burrs and other debris, and then enters the tunnel furnace for baking. The cleaning and baking of copper clad laminates can be completed on the assembly line;

[0042] The coating method of the circuit can be but not limited to: paste a photosensitive film on the baked copper clad board, and then put it together with the ...

Embodiment 2

[0066] figure 2 A flow chart of a method for manufacturing a circuit board according to another embodiment of the present invention is schematically shown.

[0067] refer to figure 2 , a method for manufacturing a circuit board, comprising the following steps:

[0068] S201: Making a circuit on a copper clad laminate.

[0069] In this embodiment, the copper-clad laminate adopts a board covered with copper skin on both sides;

[0070] The cutting equipment cuts the raw material of the copper clad laminate into the copper clad laminate of the required size, and then uses the grinding machine to clean the cut copper clad laminate to make the surface free of dust, burrs and other debris, and then enters the tunnel furnace for baking. The cleaning and baking of copper clad laminates can be completed on the assembly line;

[0071] The coating method of the circuit can be but not limited to: paste a photosensitive film on the baked copper clad board, and then put it together wi...

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PUM

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Abstract

The invention discloses a manufacturing method of a circuit board, which comprises the steps of manufacturing a circuit on a copper-clad plate, conveying the copper-clad plate on an assembly line, uniformly coating solder mask on the copper-clad plate by a solder mask coating device on the assembly line, horizontally feeding the copper-clad plate into a tunnel furnace for baking, performing solder mask exposure and development on the circuit board, horizontally feeding the circuit board into the tunnel furnace for baking, carrying out silk-screen printing of a mark on the circuit board, horizontally putting the circuit board into the tunnel furnace for baking, and carrying out spray plating on the circuit board. According to the invention, the coating of the solder mask on the copper-clad plate and the subsequent baking are carried out on the assembly line, the copper-clad plate does not need to be moved to a baking oven for baking after being coated with the solder mask, and the copper-clad plate does not need to be moved to the baking oven for baking after being treated by other working procedures, so that the production efficiency of the circuit board can be improved to a great extent; and the circuit board horizontally enters the tunnel furnace to be baked, and does not need to be vertically and separately placed and then carried into the baking oven, so that the circuit board can be prevented from being deformed and scratched in the carrying process.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit board. Background technique [0002] In the process of making circuit boards, it is necessary to cover a layer of film on the surface with copper wires, that is, a solder mask. The solder mask plays an insulating role and can also prevent solder from adhering to some copper wires that do not need to be soldered. To protect the wiring layer to a certain extent, the solder mask layer is generally green or other colors. [0003] In the existing process, silk screen solder resist equipment is usually used to pressurize the circuit board, so that the solder resist oil is coated on the surface of the circuit board, and then the circuit board coated with solder resist oil is transported to the baking Baking in the baking box. During the transportation process, the circuit boards coated with solder resist oil need to be placed vertically and separated from each other, and cannot be placed against e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/12H05K3/22H05K3/24
CPCH05K3/1283H05K3/227H05K3/245
Inventor 詹贵全
Owner 鹤山市泰利诺电子有限公司