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Preparation method of thermosetting polyolefin copper clad laminate with high thermal stability and low water absorption

A technology with high thermal stability and low water absorption, applied in chemical instruments and methods, other household appliances, synthetic resin layered products, etc. The effect of high thermal stability and simple preparation process

Active Publication Date: 2022-04-08
CHINA ELECTRONICS TECH GRP NO 46 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although thermosetting epoxy resin has excellent heat resistance, adhesiveness, electrical insulation and other properties, its dielectric loss factor is relatively large, and after curing, a large number of polar groups such as hydroxyl groups are generated, which makes the water absorption of the board relatively large.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Thermosetting polyolefin copper clad laminates with high thermal stability and low water absorption, the ratio of various raw materials by weight is:

[0033] Thermosetting polyolefin: 20 parts of polybutadiene, 5 parts of styrene-butadiene block copolymer;

[0034] Inorganic filler: 25 parts of silicon dioxide, 5 parts of titanium dioxide;

[0035] Chopped Quartz Fiber: 5 parts Chopped Quartz Fiber;

[0036] Flame retardant: 12 parts of decabromodiphenyl ether;

[0037] Curing agent: 3 parts of dicumyl peroxide;

[0038] Organic solvent: 25 parts of butanone.

[0039] A method for preparing a thermosetting polyolefin copper-clad laminate with high thermal stability and low water absorption, comprising the steps of:

[0040] (1) Surface chemical treatment of inorganic filler and chopped quartz fiber with coupling agent: firstly, 0.5%~3% of the weight part of the inorganic filler and 0.5%~3% of the weight part of the chopped quartz fiber Dissolve the coupling agent ...

Embodiment 2

[0046] Thermosetting polyolefin copper clad laminates with high thermal stability and low water absorption, the ratio of various raw materials by weight is:

[0047] Thermosetting polyolefin: 25 parts of polybutadiene, 10 parts of styrene-butadiene block copolymer;

[0048] Inorganic filler: 25 parts of silicon dioxide, 5 parts of titanium dioxide;

[0049] Chopped Quartz Fiber: 5 parts Chopped Quartz Fiber;

[0050] Flame retardant: 12 parts of decabromodiphenyl ether;

[0051] Curing agent: 3 parts of dicumyl peroxide;

[0052] Organic solvent: 15 parts of butanone.

[0053] A method for preparing a thermosetting polyolefin copper-clad laminate with high thermal stability and low water absorption, comprising the steps of:

[0054] (1) Surface chemical treatment of inorganic filler and chopped quartz fiber with coupling agent: firstly, 0.5%~3% of the weight part of the inorganic filler and 0.5%~3% of the weight part of the chopped quartz fiber Dissolve the coupling agent...

Embodiment 3

[0060] Thermosetting polyolefin copper clad laminates with high thermal stability and low water absorption, the ratio of various raw materials by weight is:

[0061] Thermosetting polyolefin: 20 parts of polybutadiene, 5 parts of styrene-butadiene block copolymer;

[0062] Inorganic filler: 30 parts of silicon dioxide, 10 parts of titanium dioxide;

[0063] Chopped Quartz Fiber: 5 parts Chopped Quartz Fiber;

[0064] Flame retardant: 12 parts of decabromodiphenyl ether;

[0065] Curing agent: 3 parts of dicumyl peroxide;

[0066] Organic solvent: 15 parts of butanone.

[0067] A method for preparing a thermosetting polyolefin copper-clad laminate with high thermal stability and low water absorption, comprising the steps of:

[0068] (1), (1), surface chemical treatment of inorganic filler and chopped quartz fiber with coupling agent respectively: first, 0.5%~3% of the weight part of the inorganic filler and 0.5% of the weight part of the chopped quartz fiber %~3% of the c...

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Abstract

The invention relates to a method for preparing a thermosetting polyolefin copper-clad laminate with high thermal stability and low water absorption. The inorganic filler and chopped quartz fiber are respectively subjected to surface chemical treatment with a coupling agent; the thermosetting polyolefin, inorganic filler, chopped Quartz fiber, flame retardant, and curing agent are evenly dispersed in organic solvent to form polyolefin composite glue; the organic solvent in polyolefin composite glue is removed by vacuum drying and then poured into the mold. Compression molding under the condition of pressure 5-30MPa to obtain the prepreg; after covering the upper and lower surfaces of the cut prepreg with copper foil, hot-pressing and sintering under the condition of temperature 200-280℃ and pressure 8-30MPa for 2-5h, so that the thermosetting polyolefin After cross-linking, curing and final setting, a thermosetting polyolefin copper-clad laminate is prepared.

Description

technical field [0001] The invention relates to the field of a copper-clad laminate and a preparation method thereof, in particular to a preparation method of a thermosetting polyolefin copper-clad laminate with high thermal stability and low water absorption. Background technique [0002] After more than half a century of development, copper clad laminates have gradually become one of the most important basic materials in electronic information products. With the development of electronic information technology, conventional copper clad laminates can no longer meet the needs of high-density interconnection of electronic installations that have developed rapidly in recent years, and microwave substrates with high performance have attracted more and more attention. [0003] Copper-clad laminates are made of glass fiber cloth, fiber paper or glass fiber non-woven fabric, etc., impregnated with resin, covered with copper foil on one or both sides, and hot-pressed. Chinese Pate...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L47/00C08L53/02C08K3/36C08K3/22C08K7/10C08K5/06C08K5/14C08K13/06B32B27/32B32B27/30B32B27/18B32B27/20B32B15/20B32B15/085B32B15/082
CPCC08L47/00B32B27/32B32B27/302B32B27/18B32B27/20B32B15/20B32B15/085B32B15/082B32B2307/308B32B2307/726B32B2262/10B32B2457/00C08L2203/20C08L2201/08C08K2003/2241C08K2201/005C08L53/02C08K3/36C08K3/22C08K7/10C08K5/06C08K5/14C08K13/06
Inventor 张伟高枢健乔韵豪张立欣刘正王浩栋李强洪颖
Owner CHINA ELECTRONICS TECH GRP NO 46 RES INST