Conductive silver paste for LTCC hole electrode and preparation method thereof
A technology of conductive silver paste and hole electrodes, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc. Effects of Inner and Outer Electrode Connectivity
Pending Publication Date: 2022-02-01
大连海外华昇电子科技有限公司
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[0008] In view of the fact that there are few domestic reports on conductive silver paste for LTCC hole electrodes, and most of them are still in the initial research stage, and have not really realized industrialization
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[0044] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples.
[0045] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is only some embodiments of the present invention, but not all embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as any limitation of the invention, its application or uses. Based on the embodiments of the present invention, all other embodiments obtained by persons ...
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Abstract
The invention provides conductive silver paste for an LTCC hole electrode and a preparation method of the conductive silver paste, and the formula of the conductive silver paste comprises the following components, by mass: 80-90% of silver powder, 2-4% of polymer resin, 0.5-5% of glass powder, 0.2-3.0% of an inorganic additive, 8-15% of an organic solvent and 0.2-0.5% of an organic additive; the polymer resin is a combination of ethyl cellulose with different molecular weights, the organic solvent is selected from one or more of alcohols or ethers, and the organic additive at least comprises a flatting agent, a coupling agent and the like. The prepared hole electrode conductive silver paste has good conductivity, continuity of an electrode in a hole and matching performance of co-firing with a substrate, can adapt to ceramic substrates with different thicknesses, and after the conductive silver paste is sintered, the hole is full in distribution, the hole bottom is free of silver leakage, the interior of a silver layer is free of cracks, and the ceramic layers are free of cracks and other defects; and good connectivity of the inner electrode and the outer electrode is achieved.
Description
technical field [0001] The invention relates to the technical field of conductive paste, in particular to a conductive silver paste for LTCC hole electrodes and a preparation method thereof. Background technique [0002] The full English name of LTCC is Low-Temperature Cofired Ceramic, that is, low-temperature co-fired ceramic technology is a method of printing interconnected conductors, components and circuits on unsintered flow-cast ceramic materials, and laminating and pressing the structure together, and then sintering it into An integrated ceramic multilayer material technology, whose printed conductors are silver, copper, gold and other metals, can be made into high-density circuits that do not interfere with each other in three-dimensional space, and can also be made into three-dimensional circuit substrates with built-in passive components. Integrated circuits (ICs) and active devices can be mounted on the surface to make active / passive integrated functional modules ...
Claims
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IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 陈将俊齐亚军李岩高珺范宏圆
Owner 大连海外华昇电子科技有限公司