A device for removing residual plastic sealant for semiconductors
A technology for removing residual glue and semiconductors, which is applied in the field of plastic sealing residual glue removal devices for semiconductors, which can solve problems such as unfavorable production and inconvenient use, and achieve the effects of improving production efficiency, ease of use, and simplifying structure and operation
Active Publication Date: 2022-03-08
江苏卓远半导体有限公司
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Problems solved by technology
[0003] When the existing glue removal device is in use, it usually can only remove one side of the semiconductor, which makes it necessary to manually adjust the position of the semiconductor so that the removal device can remove the glue on the other side of the semiconductor, which is inconvenient to use. unfavorable for production
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[0036] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0037] see Figure 1-14 As shown, a device for removing residual plastic sealants for semiconductors comprises two conveying modules 1 200 and 2 800 which are in contact with each other, and a drive module 300 is fixedly connected to the top side of conveying module 1 200 and conveying module 2 800. The glue removal module 600 is fixedly connected to the bottom of the module 300, and the driving module 300 can drive the glue removal module 600 to move, so that the glue removal mod...
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The invention relates to the technical field of semiconductor production, in particular to a device for removing residual plastic sealants for semiconductors, comprising two conveying modules 1 and 2 that are in contact with each other, and the top sides of the conveying module 1 and conveying module 2 are fixedly connected with A driving module, the bottom of the driving module is fixedly connected with a glue removal module, the other side of the first conveying module and the second conveying module is fixedly connected with a turning module, and the tops of the first conveying module and the second conveying module are fixedly connected with a limit frame, and the two The two limit frames are in contact with each other. In the present invention, the guide rail is fixedly connected by the fixing rod. After removing the glue on one surface of the semiconductor, the guide rail can make the placing plate 2 fit on the placing plate 1, and then the semiconductor can be flipped onto the placing plate 2 through the turning module. In this way, the other side of the semiconductor can be degummed without manually adjusting the position of the semiconductor, which is conducive to speeding up the degumming speed, thereby improving production efficiency.
Description
technical field [0001] The invention relates to the technical field of semiconductor production, in particular to a device for removing residual plastic sealant for semiconductors. Background technique [0002] A semiconductor refers to a material whose electrical performance is between that of a conductor and an insulator. Most electronic products, such as computers, have a lot to do with the core unit of the semiconductor. During the production of a semiconductor, the semiconductor needs to be plastic-encapsulated. Packaging. After the plastic packaging is completed, some plastic may remain on the surface of the semiconductor. At this time, in order to ensure product quality, the residual glue on the semiconductor needs to be removed. [0003] When the existing glue removal device is in use, it usually can only remove one side of the semiconductor, which makes it necessary to manually adjust the position of the semiconductor so that the removal device can remove the glue o...
Claims
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IPC IPC(8): B08B1/00B08B1/02B08B13/00H01L21/56B08B1/20
CPCB08B13/00H01L21/56B08B1/20B08B1/12
Inventor 张新峰黄宏嘉帝玛陈善亮杨祚宝王霖龙安泽曹金星杜陈应艳阳
Owner 江苏卓远半导体有限公司