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Method for removing spherical residues after ST250 cleaning

A technology for residues and after cleaning, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of wafer spiral track residues, affecting yield, etc., and achieve product yield increase, sufficient removal, and spiral The effect of shape trajectory reduction

Pending Publication Date: 2022-02-08
SHANGHAI HUALI INTEGRATED CIRCUTE MFG CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a method for solving the spherical residue after ST250 cleaning, which is used to solve the problem of spiral track residues in the prior art after the wafer is cleaned by ST250 liquid, which affects yield problem

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  • Method for removing spherical residues after ST250 cleaning
  • Method for removing spherical residues after ST250 cleaning

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Embodiment Construction

[0020] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0021] see Figure 1 to Figure 2 . It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in actual implementation. Dimensional drawing, the type, quantity and proportion of each component can be changed arb...

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Abstract

The invention provides a method for removing spherical residues after ST250 cleaning. The method comprises the following steps: placing a wafer in an etching cavity; deionizing the wafer to release static electricity; removing the polymer on the wafer by using an ST250 solution; rotating the wafer, and throwing the ST250 solution out of the surface of the wafer; washing the wafer with water to remove residual ST250 on the surface of the wafer; and drying the washed wafer. According to the method, before the ST250 wafer cleaning, deionized water is increased to clean the upper surface of the wafer, and static electricity on the surface of the wafer is released under the action of the deionized water, so that polymer on the wafer can be removed more sufficiently, and finally, a residue spiral track formed on the wafer can be greatly reduced, and the product yield can be greatly increased.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for solving spherical residues after ST250 cleaning. Background technique [0002] In the existing technology, the running goods are directly cleaned by ST250 after the wafer enters the cavity, and the electrostatically charged polymer (Polymer) reunites into a small spherical residue after encountering the ST250 liquid, and the wafer itself is rotating, This causes helical track residue to form spherically on the wafer. Therefore, the process of subsequent wafers is affected, resulting in a decrease in yield. [0003] In this regard, a new method needs to be proposed to solve the above problems. Contents of the invention [0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a method for solving the spherical residue after ST250 cleaning, which is used to solve the problem of spiral track resi...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02
CPCH01L21/0206H01L21/02057
Inventor 张泉杨谊王春伟
Owner SHANGHAI HUALI INTEGRATED CIRCUTE MFG CO LTD