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Transmission circuit, interface circuit and memory

A technology of transmission circuit and interface circuit, applied in the fields of transmission circuit, interface circuit and memory, can solve the problem that the performance of DRAM needs to be improved, and achieve the effect of superior structural performance, shortening the clock path and improving the matching degree.

Pending Publication Date: 2022-03-01
CHANGXIN MEMORY TECH (SHANGHAI) INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, current DRAM performance still needs to be improved

Method used

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  • Transmission circuit, interface circuit and memory
  • Transmission circuit, interface circuit and memory
  • Transmission circuit, interface circuit and memory

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] It can be seen from the background art that the performance of the DRAM in the prior art still needs to be improved.

[0037]In the memory, the write data sampling signal (Dqs signal or Wck signal) is used as the clock for writing data; during the write operation, the edge (rising edge and falling edge) of the Dqs signal or Wck should be in timing with the data signal (DQ signal ) (substantially aligned at the center may also be allowed for timing margins). The transmission path of the DQ signal is defined as the data path. The length of the data path will affect the time when the edge of the DQ signal reaches the device port (such as the data port of the register). The transmission path of Dqs or Wck is defined as the clock path. The length of the clock path will affect When the Dqs or Wck signal arrives at a device port (such as the clock port of a register), the difference between the data path of the DQ signal and the clock path of the Dqs or Wck signal (the time be...

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PUM

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Abstract

The embodiment of the invention provides a transmission circuit, an interface circuit and a memory, and the transmission circuit comprises an upper-layer clock bonding pad which is used for transmitting a clock signal; the M upper-layer data bonding pads are used for transmitting data signals; the lower-layer clock bonding pad is electrically connected with the upper-layer clock bonding pad, and the area of the lower-layer clock bonding pad is smaller than that of the upper-layer clock bonding pad; the M lower-layer data bonding pads are electrically connected with the M upper-layer data bonding pads in a one-to-one correspondence manner, and the area of the lower-layer data bonding pads is smaller than that of the upper-layer data bonding pads; the upper-layer clock bonding pad and the upper-layer data bonding pad are located on a first layer, the lower-layer clock bonding pad and the lower-layer data bonding pad are located on a second layer, a dielectric layer is arranged between the first layer and the second layer, and the first layer, the dielectric layer and the second layer are all located on the same substrate. According to the embodiment of the invention, the length of the clock path corresponding to each input buffer circuit is shortened, the time sequence violation is reduced, and the matching degree of the clock path corresponding to each input buffer circuit and the input data path is improved.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of semiconductors, and in particular, to a transmission circuit, an interface circuit, and a memory. Background technique [0002] Dynamic Random Access Memory (Dynamic Random Access Memory, DRAM) is a semiconductor storage device commonly used in computers, and is composed of many repeated storage units. Each memory cell usually includes a capacitor and a transistor. The gate of the transistor is connected to the word line, the drain is connected to the bit line, and the source is connected to the capacitor. The voltage signal on the word line can control the opening or closing of the transistor, and then through the bit line Read the data information stored in the capacitor, or write the data information into the capacitor through the bit line for storage. [0003] DRAM can be divided into Double Data Rate (DDR) DRAM, GDDR (Graphics Double Data Rate) DRAM, and Low Power Double Data R...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11C11/4093H03M9/00H10B12/00
CPCG11C11/4093H03M9/00G11C7/1084G11C7/225G11C5/025G11C2207/105H01L22/32H01L24/06H01L2224/0603H01L2224/06138G11C8/18G11C29/48G11C5/063H10B12/50G11C11/4076H01L2924/1436H01L2224/06051H01L2224/06515
Inventor 林峰
Owner CHANGXIN MEMORY TECH (SHANGHAI) INC