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Component carrier having embedded component connected in cavity by anchored first and second polymers

A component bearing and polymer technology, applied in the direction of electrical components, printed circuits connected with non-printed electrical components, multilayer circuit manufacturing, etc., can solve problems such as reducing the reliability of component carriers

Pending Publication Date: 2022-03-01
AT & S AUSTRIA TECH & SYSTTECHN AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The disadvantage of laminated part carriers with embedded parts is that they may be prone to delamination, warping, and / or other phenomena that can reduce the reliability of the part carrier

Method used

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  • Component carrier having embedded component connected in cavity by anchored first and second polymers
  • Component carrier having embedded component connected in cavity by anchored first and second polymers
  • Component carrier having embedded component connected in cavity by anchored first and second polymers

Examples

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Embodiment approach

[0068]According to an exemplary embodiment of the present invention, polyethersulfone (PES), polyalkylmethacrylate (PAMA), polyphenylene sulfide (PPS), polyurethane (PUR) and polydimethylsiloxane may be used. (PDM) to improve the connection and design flexibility of embedded inlays and other components in printed circuit boards (PCBs). Specifically, exemplary embodiments of the present invention may embed fabricated components (such as semiconductor chips or any other inlays) into layered stacks (such as motherboards) via the deposition of polymers with high miscibility or chemical affinity. )middle. This mechanically anchored connection formed polymer to polymer can improve the attachment of the embedded component within the component carrier via mechanisms such as interdiffusion or self-adhesion.

[0069] In particular, a pre-microetching process can be performed to take advantage of the convex shape of the bottom surface with both via and via configurations, which can faci...

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PUM

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Abstract

A component carrier (100) wherein the component carrier (100) comprises: a stack (102) comprising at least one electrically conductive layer structure (104) and / or at least one electrically insulating layer structure (106) and having a cavity (110), the cavity (110) being at least partially delimited by a first polymer (112); a component (108) embedded in the cavity (110) of the stack (102) and at least partially covered by a second polymer (114), an anchoring junction (116) being formed at the junction between the first polymer (112) and the second polymer (114), at which anchoring junction the first polymer (112) and the second polymer (114) are mechanically anchored to each other.

Description

technical field [0001] The invention relates to component carriers. Furthermore, the invention relates to a method for producing a component carrier. Background technique [0002] In the case of increasing product functions of component carriers equipped with one or more electronic components and the progressive miniaturization of these components and the increasing number of components to be mounted on component carriers such as printed circuit boards, the adoption of Increasingly powerful array-like components or packages with multiple components having multiple contacts or connections with increasingly smaller spacing between the contacts. During operation, the removal of the heat generated by these components and the component carrier itself is an increasingly important issue. At the same time, the component carrier should be mechanically stable and electrically reliable in order to be able to operate even under harsh conditions. [0003] A disadvantage of laminated c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K3/46
CPCH05K1/185H05K3/4697H05K1/0313H05K2201/2072
Inventor 伊玛尼·苏利埃里克·普赖纳马丁·施赖瓦妮莎·洛佩斯·布兰科
Owner AT & S AUSTRIA TECH & SYSTTECHN AG