Soft package photoelectric coupler method and soft package photoelectric coupler
An optocoupler and soft package technology, which is applied in the field of optocouplers, can solve the problems of contaminating the circuit substrate chip, the limitations of plastic sealing and welding cannot meet the requirements, and the product cannot be used normally, and achieves the effect of preventing light leakage.
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[0055]After long-term research and time, the inventor of the present application found that the way of plastic sealing and welding in the prior art will pollute the circuit board and other chips, and the chip is not allowed to be cleaned due to the particularity of the chip, so the products polluted by plastic sealing and welding can basically not be cleaned. Normal use. In addition, under the premise of not changing the product performance, there are more and more demands for product miniaturization. In order to achieve the layout flexibility of the product, there are certain requirements for the size and connectivity of the product. limitations cannot meet the requirements. In view of this, an embodiment of the present application provides a method for soft-encapsulating an optocoupler. The circuit principle of the soft-encapsulated optocoupler is that a light-emitting device (such as a light-emitting diode) and a photosensitive device (such as a phototransistor) are assemb...
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