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Heat-conducting filler, preparation method, resin composite material containing heat-conducting filler and application of resin composite material

A technology of thermally conductive fillers and composite materials, which is applied in the field of resin composite materials, can solve the problems that the thermal conductivity cannot be effectively improved, and achieve the effects of excellent flexibility, good modification effect, and good combination

Pending Publication Date: 2022-03-08
GLOBAL ENERGY INTERCONNECTION RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defect that the thermal conductivity of the resin composite material in the prior art cannot be effectively improved, thereby providing a thermally conductive filler, a preparation method, a resin composite material containing it and its use, the thermally conductive filler While improving the interface properties of the filler and the resin matrix, the thermal conductivity of the resin composite can be further improved

Method used

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  • Heat-conducting filler, preparation method, resin composite material containing heat-conducting filler and application of resin composite material
  • Heat-conducting filler, preparation method, resin composite material containing heat-conducting filler and application of resin composite material
  • Heat-conducting filler, preparation method, resin composite material containing heat-conducting filler and application of resin composite material

Examples

Experimental program
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Effect test

Embodiment 1

[0052] A solution of piranha (a mixture of concentrated sulfuric acid and 30% hydrogen peroxide) was used to soak the alumina filler, and the mass ratio of the concentrated sulfuric acid and hydrogen peroxide was 7:3.

[0053] The obtained alumina filler is modified, and the modification includes:

[0054] In 100g of alumina filler, 2g of 4-(4-(octanoyloxy)benzoyloxy)benzoic acid, 0.1g of 4-dimethylaminopyridine catalyst and 500mL of acetone solvent, stirred and refluxed at 75°C for 4h, filtered and obtained Modified alumina filler.

Embodiment 2

[0056] A solution of piranha (a mixture of concentrated sulfuric acid and 30% hydrogen peroxide) was used to soak the alumina filler, and the mass ratio of the concentrated sulfuric acid and hydrogen peroxide was 7:3.

[0057] The obtained alumina filler is modified, and the modification includes:

[0058] 100g of alumina filler, 2g of 4-(4-hexylphenyl)benzoic acid, 0.1g of 4-dimethylaminopyridine catalyst and 500mL of toluene solvent, stirred and refluxed for 4 hours, and filtered to obtain modified alumina filler.

Embodiment 3

[0060] A solution of piranha (a mixture of concentrated sulfuric acid and 30% hydrogen peroxide) was used to soak the alumina filler, and the mass ratio of the concentrated sulfuric acid and hydrogen peroxide was 7:3.

[0061] The obtained alumina filler is modified, and the modification includes:

[0062] 100g of alumina filler, 2g of 4-(4-tert-butylphenyl)benzoic acid, 0.1g of 4-dimethylaminopyridine catalyst and 500mL of toluene solvent, stirred and refluxed for 4h, filtered to obtain modified alumina filler.

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Abstract

The invention provides a heat-conducting filler, a preparation method, a resin composite material containing the heat-conducting filler and application of the resin composite material. The surface of the heat-conducting filler is modified with a liquid crystal monomer, and the liquid crystal monomer has a structure as shown in a formula (1). The liquid crystal monomer is grafted on the surface of the filler through functional group reaction, so that the thermal conductivity of the composite material is further improved while the interface performance of the filler and a resin matrix is improved.

Description

technical field [0001] The invention relates to the field of resin composite materials, in particular to a heat-conducting filler, a preparation method, a resin composite material containing it and applications thereof. Background technique [0002] In recent years, with the rapid development of electronic information science and technology, the degree of integration of various electronic products has been increasing, which makes the heat generated by each component during operation highly concentrated, which seriously affects the service life of the equipment and threatens the safety of the equipment. Therefore, high-performance heat-conducting materials are needed to timely export the heat generated by the components to ensure that the equipment works stably at an appropriate temperature. [0003] Polymer materials have been widely studied in the field of thermal conductive materials due to their significant advantages such as low cost and easy processing. However, the th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K9/04C08K9/02C08K3/22C08K3/38C08K3/36C08L63/02
CPCC08K9/04C08K9/02C08K3/22C08K3/38C08K3/36C08K2003/2227C08K2003/385C08L63/00
Inventor 王琨杨威陈赟尹立颜丙越乔健陈新张翀
Owner GLOBAL ENERGY INTERCONNECTION RES INST CO LTD