Preparation method of corrosion-resistant and hydrophobic micro-nano part
A technology of micro-nano parts, applied in the field of micro-forming manufacturing, can solve the problems of large residual internal stress, poor performance, poor thickness uniformity of micro-nano parts, etc., achieve uniform surface, good hydrophobicity, improve surface uniformity and corrosion resistance performance effect
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Embodiment 1
[0034] This example provides a method for preparing corrosion-resistant and hydrophobic micro-nano parts. For the 400-600 μm thick rubber mold prepared by UV-LIGA, electroforming technology is used to cast a full-glue model cavity to obtain electroformed graphene-nickel micro-nano parts. , and then use electrochemical polishing technology to remove the surface burrs of micro-nano parts, greatly improving its surface accuracy; finally, use heat treatment technology to eliminate the internal force of micro-nano parts, and obtain corrosion-resistant and hydrophobic graphene-nickel micro-nano parts.
[0035] This embodiment provides a rubber mold, which uses photoresist SU-8 to etch to prepare a microstructure adhered to a conductive gold-plated silicon wafer as a rubber mold for electroforming micro parts, with a thickness of 400-600 μm;
[0036] A method for preparing a corrosion-resistant and hydrophobic micro-nano part provided in this embodiment includes the following steps: ...
Embodiment 2
[0047] This example provides a method for preparing corrosion-resistant and hydrophobic micro-nano parts. For the 400-600 μm thick rubber mold prepared by UV-LIGA, electroforming technology is used to cast a full-glue model cavity to obtain electroformed graphene-nickel micro-nano parts. , and then use electrochemical polishing technology to remove the surface burrs of micro-nano parts, greatly improving its surface accuracy; finally, use heat treatment technology to eliminate the internal force of micro-nano parts, and obtain corrosion-resistant and hydrophobic graphene-nickel micro-nano parts.
[0048] This embodiment provides a rubber mold, which uses photoresist SU-8 to etch to prepare a microstructure adhered to a conductive gold-plated silicon wafer as a rubber mold for electroforming micro parts, with a thickness of 400-600 μm;
[0049] A method for preparing a corrosion-resistant and hydrophobic micro-nano part provided in this embodiment includes the following steps: ...
Embodiment 3
[0060] This example provides a method for preparing corrosion-resistant and hydrophobic micro-nano parts. For the 400-600 μm thick rubber mold prepared by UV-LIGA, electroforming technology is used to cast a full-glue model cavity to obtain electroformed graphene-nickel micro-nano parts. , and then use electrochemical polishing technology to remove the surface burrs of micro-nano parts, greatly improving its surface accuracy; finally, use heat treatment technology to eliminate the internal force of micro-nano parts, and obtain corrosion-resistant and hydrophobic graphene-nickel micro-nano parts.
[0061] This embodiment provides a rubber mold, which uses photoresist SU-8 to etch to prepare a microstructure adhered to a conductive gold-plated silicon wafer as a rubber mold for electroforming micro parts, with a thickness of 400-600 μm;
[0062] A method for preparing a corrosion-resistant and hydrophobic micro-nano part provided in this embodiment includes the following steps: ...
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Abstract
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