High-temperature alloy tube shell and packaging method thereof
A technology of high temperature alloy and packaging method, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of precision crossover, etc., and achieve the effects of good position accuracy, convenient use and improved efficiency.
Pending Publication Date: 2022-03-15
EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE +1
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Problems solved by technology
In the prior art, a technical solution is provided for the high-temperature glass frit sealing of the shell, but the structure of the Pt wire and the shell in the glass insulator is not only reasonable, but also the accuracy is poor.
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[0020] Specific implementation methods: such as figure 1 As shown, a high-temperature alloy tube shell includes an alloy tube base 1, and a glass insulator 2 is prepared on the alloy tube base 1 through the prior art, and the upper and lower end surfaces of the glass insulator 2 are lower than the alloy tube base 1 The upper and lower surfaces of the alloy stem 1 are respectively formed with an upper groove body 2a and a lower groove body 2b.
[0021] A group of through-tubes 3 are inserted upward on the lower surface of the glass insulator 2 . On the upper surface of the glass insulator 2, that is, on the bottom surface of the upper tank body 2a, there are wire holes corresponding to the distribution of the group and the through-heart tube 3, so that the upper end of the electrode 4 arranged in the through-heart tube 3 extends out to the gold tube holder 1 a distance above the surface. The electrode 4 is a Pt wire electrode, the diameter of the Pt wire electrode is 1 mm, an...
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Abstract
The invention provides a high-temperature alloy tube shell and a packaging method thereof. The high-temperature alloy tube shell comprises a high-temperature alloy tube shell composed of an alloy tube base 1, a glass insulator 2, a through tube 3 and a Pt wire electrode 4. A mold is placed on an alloy tube seat 1, the mold comprises a graphite lower mold 8, a graphite bottom support 9, a graphite upper mold 7 and a housing 13, then the whole mold is placed in a vacuum furnace for heating and heat preservation, then the mold is cooled to the room temperature along with the furnace, and then the mold can be taken out and removed. The device is simple in structure and convenient to use, time for selecting, testing and determining glass powder in the prior art is saved, efficiency is improved, the obtained product is good in size precision and position precision, and the expected effect of the product is achieved.
Description
Technical field: [0001] The invention relates to the connection field of electronic devices, in particular to a high-temperature alloy shell and a packaging method thereof. Background technique: [0002] With the further development of engine supporting pressure sensors and silicon piezoresistive cores, the need for chip leadless packaging is proposed, and then the chip is packaged with a glass base. It is required that the high-temperature insulation performance of the packaged product should be greater than or equal to 50MΩ at 500°C. In the prior art, a technical solution is provided for the high-temperature glass frit sealing of the shell, but the structure of the Pt wire and the shell in the glass insulator is not only reasonable, but also the accuracy is poor. Invention content: [0003] The purpose of the present invention is to overcome the deficiencies in the prior art, and provide a high-temperature alloy shell and a packaging method thereof. [0004] The applica...
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IPC IPC(8): H01L23/10H01L23/045H01L23/06H01L21/48
CPCH01L23/10H01L23/045H01L23/06H01L21/4817
Inventor 焦贵忠盛健陈信琦杨国庆祁凤
Owner EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE