Glass powder, dielectric material, sintered body, and high-frequency circuit member
A technology of dielectric material and glass powder, which is applied to printed circuit components, circuit substrate materials, circuits, etc., and can solve problems such as slow signal processing speed and large conductor loss
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[0041] Hereinafter, the present invention will be described based on examples. It should be noted that the present invention is not limited by the following examples. The following examples are illustrative only.
[0042] Examples (sample Nos. 1-4, 7-12) and comparative examples (sample No. 5, 6) of the present invention are shown in Tables 1 and 2. It should be noted that the R in the table 2 O means Li 2 O+Na 2 O+K 2 O.
[0043] 【Table 1】
[0044]
[0045] 【Table 2】
[0046]
[0047] Each sample was prepared as follows. First, according to the glass composition in the table, mix glass raw materials of various oxides, mix them uniformly, put them in a platinum crucible and melt them at 1550-1650°C for 3-8 hours, and roll the obtained molten glass into a Thin plate. Next, after roughly pulverizing the obtained glass film, alcohol was added, wet pulverized by a ball mill, and classified so that the average particle diameter became 1.5 to 3 μm, thereby obtaining ...
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Abstract
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