Defect detection device and method for semiconductor chip
A defect detection and semiconductor technology, applied in the direction of measuring device, material defect test, optical test defect/defect, etc., can solve the problem that the detection effect cannot be realized automatically
Active Publication Date: 2022-03-25
SHENZHEN SINONE CHIP ELECTRONIC CO. LTD.
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[0003] Today's semiconductor chips are rapidly developing towards miniaturization, chipping and high performance. The defect detection of semiconductor chips is a necessary prerequisite. Other appearance defect detection is the quality assurance of semiconductor chips. At present, many production lines still use traditional manual removal of unqualified products. , can not achieve automatic detection effect
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[0049] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0050] The specific implementation of the present invention will be described in detail below in conjunction with specific embodiments.
[0051] In one embodiment, a semiconductor chip defect detection device and method, see Figure 1 ~ Figure 4 , comprising a conveyor belt 1, placing semiconductor chips to be detected on the conveyor belt 1, characterized in that it also includes:
[0052] A detection platform 6, a detection module 7 is arranged in the detection platform 6, and the detection module 7 is used to detect semiconductor chips;
[0053] A clamping mechanism 4, the clamping mechanism 4...
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The invention discloses a defect detection device and method for a semiconductor chip, and belongs to the technical field of chip detection equipment, the technical key points are that the defect detection device comprises a conveyor belt on which a to-be-detected semiconductor chip is placed, a detection table in which a detection module is arranged, and the detection module is used for detecting the semiconductor chip; the clamping mechanism is used for clamping the semiconductor chip to the detection module for detection; the taking mechanism comprises a support, a supporting assembly, a power assembly, a pushing assembly, a rotating assembly and a transmission assembly, the support is arranged on one side of the conveying belt, the right side of the support is fixedly connected with the supporting assembly, and the supporting assembly is connected with the power assembly, the pushing assembly, the rotating assembly and the transmission assembly; the power assembly is connected with the pushing assembly and the rotating assembly, the rotating assembly is connected with the transmission assembly, and one side of the transmission assembly is connected with the clamping mechanism.
Description
technical field [0001] The invention relates to the technical field of chip testing equipment, in particular to a semiconductor chip defect testing device and method. Background technique [0002] Semiconductor chip: Etching and wiring on a semiconductor sheet to make a semiconductor device that can achieve a certain function. Not only silicon chips, but also common semiconductor materials such as gallium arsenide and germanium. In order to meet the requirements of mass production, the electrical properties of the semiconductor must be predictable and stable, so the purity of the dopant and the quality of the semiconductor lattice structure must be strictly required. Common quality problems include lattice dislocations (dislocation), twins (twins) or stacking faults (stacking fault), which will affect the characteristics of semiconductor materials. For a semiconductor device, defects in the material lattice (Crystal defects) are often the main cause of component performanc...
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IPC IPC(8): G01N21/95G01N25/72
CPCG01N21/9501G01N25/72
Inventor 张文臣孙成平
Owner SHENZHEN SINONE CHIP ELECTRONIC CO. LTD.