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Simulation method and system for press-fit molding-post processing-reflow soldering of printed circuit board

A printed circuit board and printed circuit technology, applied in CAD circuit design, electrical digital data processing, instruments, etc., can solve the problems of high cost, unknown stress and strain state, long time period, etc.

Pending Publication Date: 2022-03-25
SHANDONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to study the mechanism of PCB warpage or the impact of process and design improvement on the yield, it is necessary to go through the complete process of lamination, post-processing, and reflow soldering, which takes a long time and high cost.
For the optimization process of PCB process and design, it requires continuous attempts and repeated iterations. If each attempt and iteration takes a long period to get the final result, it will seriously restrict the PCB design process.
In addition, the shadow moiré test used to determine the warpage deformation of PCB also requires a long cycle and high test cost, and can only obtain the deformation of specific states such as after pressing and punching, and cannot obtain The evolution process of PCB deformation during these processes, the stress and strain state of PCB is even more unknown
In this way, it is difficult to carry out in-depth research on the deformation mechanism based on only a few deformation results, and it is also difficult to provide reasonable feedback for the optimization design process.

Method used

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  • Simulation method and system for press-fit molding-post processing-reflow soldering of printed circuit board
  • Simulation method and system for press-fit molding-post processing-reflow soldering of printed circuit board
  • Simulation method and system for press-fit molding-post processing-reflow soldering of printed circuit board

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Effect test

Embodiment 1

[0068] Such as figure 1 As shown, Embodiment 1 of the present invention provides a whole-process modeling and analysis method applicable to compression molding-post-processing-reflow soldering of complex, large-size, multi-layer printed circuit boards, through full coupling or sequential coupling The method is used to simulate and analyze the whole process of compression molding, post-processing process and reflow soldering; for the post-processing process, the reduction or enhancement of the stiffness of the partition is used to simulate the hole punching, copper plating in the hole, surface etching and surface etching after compression molding. The effect of these processes of copper plating on the initial mechanical properties of reflow soldering.

[0069] For a specific PCB, first preprocess its design file to obtain the PCB geometric outline, stacking scheme, wiring design diagram of each wiring layer, and punching design diagram. Then determine the process parameters o...

Embodiment 2

[0085]Embodiment 2 of the present invention provides a simulation analysis method for the whole process of PCB compression molding-post-processing-reflow soldering by considering the distribution characteristics of wiring layer copper and hole characteristics, which is realized by means of finite element software and intelligent scripts developed based on Python language The manufacturing process modeling and simulation analysis of PCB partitions are carried out according to the copper distribution characteristics of the wiring layer and the hole distribution characteristics. This implementation method can fully consider the anisotropic material properties brought about by the directional distribution of copper wires in each partition of the PCB and the concentrated arrangement of holes. It has the advantages of high simulation accuracy, but the implementation process is more complicated. The specific implementation process is similar to Embodiment 1, only the partitioning sche...

Embodiment 3

[0100] Embodiment 3 of the present invention provides a printed circuit board compression molding-post-processing-reflow simulation system, including:

[0101] The data acquisition module is configured to: acquire the parameter data of the printed circuit board;

[0102] The partition module is configured to: determine the partition scheme of each wiring layer according to the acquired parameter data;

[0103] The model building module is configured to: identify the circuit characteristic information of each partition according to the partition scheme, and establish a three-dimensional geometric model of the printed circuit board with the partition identification information;

[0104] The model parameter matching module is configured to: calculate the equivalent performance parameters of each partition according to the identified feature information, and configure the equivalent performance calculated based on the feature information for each partition of the three-dimensional...

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PUM

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Abstract

The invention provides a printed circuit board press-fit forming-post-processing-reflow soldering simulation method and system, and the method comprises the steps: determining a partitioning scheme of each wiring layer according to obtained PCB parameter data, recognizing the circuit feature information of each partition, building a PCB three-dimensional geometric model with partition recognition information, and carrying out the recognition of the circuit feature information of each partition; configuring equivalent performance parameters calculated based on the feature information for each partition of the PCB three-dimensional geometric model, and calling a PCB resin curing deformation module for solving to obtain a press-fit forming simulation result; obtaining evolution data of the material performance according to the identified hole feature information of each partition; according to the press-fit forming simulation result, combining evolution data of the material performance to obtain a post-processing simulation result; according to the post-processing simulation result, a reflow soldering simulation result is obtained by combining the evolution data of the material performance; according to the method, the temperature, displacement and stress conditions of the PCB in the whole preparation process from pressing to reflow soldering can be completely reflected, the simulation period is short, and the universality is high.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to a simulation method and system for press-forming-post-processing-reflow soldering of printed circuit boards. Background technique [0002] The statements in this section merely provide background art related to the present invention and do not necessarily constitute prior art. [0003] At present, with the development of integrated circuit design and manufacturing level, the function of printed circuit board (PCB) is increasing day by day, and the number of stacked layers is increasing day by day, which puts forward higher requirements on the preparation process. The PCB will also undergo various processing processes after compression molding and before reflow soldering, such as drilling, copper plating in the hole, copper plating and etching on the surface. During the pressing process of PCB, the PCB is compressed by the upper and lower pressure plat...

Claims

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Application Information

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IPC IPC(8): G06F30/331G06F30/394G06F30/398G06F115/12
CPCG06F30/331G06F30/398G06F30/394G06F2115/12
Inventor 万国顺贾玉玺董琪程梦萱黄斌张通赵志彦
Owner SHANDONG UNIV