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Pressure-sensitive adhesive layer-forming polyorganosiloxane composition and use thereof

A polyorganosiloxane, adhesive layer technology, applied in other household appliances, pressure-sensitive films/sheets, applications, etc., can solve problems such as inability to fully solve technical problems, and achieve improved performance, easy industrialization, and high stress. Effect

Pending Publication Date: 2022-04-01
DOW TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, some of the compositions specifically disclosed in the Examples and the like disclose a combination of resin components having different weight average molecular weights, but cannot sufficiently solve the technical problems of the present invention.

Method used

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  • Pressure-sensitive adhesive layer-forming polyorganosiloxane composition and use thereof
  • Pressure-sensitive adhesive layer-forming polyorganosiloxane composition and use thereof
  • Pressure-sensitive adhesive layer-forming polyorganosiloxane composition and use thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0079] The preparation method of the polyorganosiloxane composition of the present invention is not particularly limited, and is carried out by uniformly mixing the respective components. A solvent may be added as needed, and it may be prepared by mixing at a temperature of 0 to 200°C using a known stirrer or kneader.

[0080] The organopolysiloxane composition of the present invention is applied on a substrate to form a coating film, and heated at a temperature of 80 to 200°C, preferably at a temperature of 90 to 190°C, thereby producing a cured product. . As the coating method, gravure coating (gravure coat), offset coating (offset coat), indirect gravure (offset gravure), roll coating, reverse roll coating, air knife coating, curtain coating and comma knife coating can be exemplified cloth. The amount of application can be designed with a desired thickness according to the application such as a display device. As an example, the thickness of the pressure-sensitive adhesiv...

Embodiment 1~7、 comparative example 1~5

[0131] The compositions of the following Examples 1 to 7 and Comparative Examples 1 to 5 were cured by the above-mentioned method, and the adhesive force, viscoelasticity, and stress-strain with respect to the PMMA plate were measured by the method shown above, and the evaluation results were etc. are shown in Table 2.

Embodiment 1

[0133] 32.3 parts by weight of vinyl functional polydimethylsiloxane of component a1, 100.8 parts by weight of MQ silicone resin of component b1, 4.3 parts by weight of MQ silicone resin of component b2, 84.9 parts by weight of toluene, and methyl alcohol of component c2 0.287 parts by weight of hydropolysiloxane, 0.409 parts by weight of 20% solution of curing retarder of component e are fully mixed at room temperature, and 0.355 parts by weight of platinum-based hydrosilylation reaction catalyst of component d are added to the mixture to form a curing reaction non-toxic polyorganosiloxane composition. The molar ratio (SiH / Vi ratio) of the amount of SiH groups in component c2 to the amount of alkenyl groups in component a1 was 29.2, and the content relative to the solid content of platinum metal was 22 ppm.

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Abstract

Provided are: a polyorganosiloxane composition having curing reactivity, which forms a pressure-sensitive adhesive layer having high shear storage modulus and stress at 500% strain, and having strong adhesion to a substrate; and a use thereof. This pressure-sensitive adhesive layer-forming polyorganosiloxane composition contains: (A) a chain polyorganosiloxane having an alkenyl group; (B) a polyorganosiloxane resin having a hydroxyl group content of 9 mol% or less, said polyorganosiloxane resin being a mixture of (b1) a polyorganosiloxane resin having a molecular weight (Mw) of 4500 or more and (b2) a polyorganosiloxane resin having a molecular weight (Mw) of less than 4500; the pressure-sensitive adhesive composition is characterized in that the mass ratio of the resin component to the chain siloxane component is in the range of 1.4-3.0, and the pressure-sensitive adhesive layer obtained by curing the composition has a shear storage modulus G'at 25 DEG C of 3.5 MPa or more and a stress at 500% strain of 0.25 MPa or more.

Description

technical field [0001] The present invention relates to a cure-reactive polyorganosiloxane composition for forming a pressure-sensitive adhesive layer and its use. Background technique [0002] Compared with acrylic and rubber-based pressure-sensitive adhesive compositions, polysiloxane-based pressure-sensitive adhesive compositions are superior in electrical insulation, heat resistance, cold resistance, and adhesion to various adherends. , Since it is excellent in transparency as needed, it is especially widely used as an additional reaction hardening type pressure-sensitive adhesive composition. In addition, in recent years, applications to cutting-edge electronic materials such as smart devices, display elements, speakers, etc. are being studied, and heat / cold resistance is expected for the purpose of protecting electrode layers and display layers and improving the adhesion between layers. Excellent silicone-based pressure-sensitive adhesives work effectively. [0003] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J183/04C09J7/38B32B7/12H04R31/00
CPCC09J183/04C09J7/38C09J7/10C09J2483/00C09J2301/312C09J2203/326C08G77/12C08G77/20C08G77/16C08G77/18C08L83/04C08L83/00C08K5/56C08L83/02C08L83/06B32B7/12B32B27/283H04R9/06B32B2457/00
Inventor 伊藤真树中村昭宏须藤通孝
Owner DOW TORAY CO LTD