Device for TEC test of optical module
A technology of optical modules and temperature control devices, which is applied in the direction of measuring devices, optical instrument testing, and machine/structural component testing, etc., can solve problems such as high energy consumption, inconvenient operation, and low temperature transfer efficiency, and achieve the power consumption of the whole machine Reduce, improve production efficiency, improve the effect of heat transfer efficiency
Pending Publication Date: 2022-04-12
成都市德科立菁锐光电子技术有限公司 +1
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Problems solved by technology
[0003] The technical problem to be solved by the present invention is that the current optical module TEC test has low temperature transfer efficiency, high energy consumption, and inconvenient operation. consumption, easy to operate
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[0038] like Figure 1~10As shown, a device for optical module TEC testing of the present invention includes a temperature insulation base 1, a temperature insulation cover 2, and also includes a temperature control device, a temperature transfer device, and a number of temperature transfer compression shrapnel 5; the temperature transfer device There are several optical module temperature transfer cavities 31 for accommodating optical modules 6, and several optical modules 6 are accommodated in one optical module temperature transfer cavity 31 respectively; Shaped portion 52, any side of the temperature transfer plane portion 51 is connected to one end of the arc portion 52, and the transverse section of the formed temperature transfer compression shrapnel 5 is bow-shaped; the surface of the optical module 6 and the described There are a number of temperature-transfer compression shrapnels 5 squeezed between the inner surfaces of the temperature-transfer chamber 31 of the opti...
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The invention discloses a device for TEC testing of an optical module. The device comprises a thermal insulation base, a thermal insulation cover, a temperature transfer device and a temperature transfer pressing elastic piece. The optical module is accommodated in the optical module temperature transfer cavity by the temperature transfer device, and the temperature transfer pressing elastic sheet is clamped between the optical module and the optical module temperature transfer cavity; the thermal insulation cover covers the thermal insulation base in a sealing manner, and the temperature transfer device is sealed in the interior of the thermal insulation base covered with the thermal insulation cover; the upper face and the lower face of the temperature transfer device are in contact with the temperature control device through the heat insulation cover through hole and the heat insulation base through hole respectively. The beneficial effects of the invention are that the temperature is transmitted to the optical module by adopting the temperature transmission device and the temperature transmission pressing elastic sheet, and the multiple groups of TEC temperature control chips are adopted for heating and refrigeration, so that rapid and efficient high and low temperature testing can be realized, the production efficiency is greatly improved and is several times to dozens of times of the testing speed of a common incubator, the power consumption of the whole machine is greatly reduced, and the cost is reduced. The heat transfer efficiency is improved, the energy consumption is reduced, and the operation is convenient.
Description
technical field [0001] The invention relates to the technical field of optical module testing devices, in particular to a device for optical module TEC testing. Background technique [0002] In order to understand the sensitivity of the optical module to temperature, the optical module generally needs to be tested at high or low temperature. At present, when testing it, it is put into the incubator for testing. There is no contact, the temperature transfer is through the air. This method has low temperature transfer efficiency, high energy consumption and inconvenient operation. Contents of the invention [0003] The technical problem to be solved by the present invention is that the current optical module TEC test has low temperature transfer efficiency, high energy consumption, and inconvenient operation. Consumption, easy to operate. [0004] The present invention realizes through following technical scheme: [0005] A device for optical module TEC testing, includin...
Claims
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Inventor 张绍友黄庆陈硕王光辉蒋涛彭小勇
Owner 成都市德科立菁锐光电子技术有限公司