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Packaging structure of semiconductor device

A packaging structure and semiconductor technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of increased overall product cost, increased size, and complicated packaging process

Pending Publication Date: 2022-04-12
SUZHOU HUNTERSUN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Wafer-level packaging of filters involves many process steps such as lithography, sputtering, etching, bonding, cleaning, grinding, etc., which makes the packaging process extremely complex and requires strict precision of packaging equipment, resulting in an increase in overall product costs
In addition, since the duplexer's Tx filter and Rx filter are flip-chip side by side on the substrate, it leads to an increase in the overall product size

Method used

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  • Packaging structure of semiconductor device
  • Packaging structure of semiconductor device
  • Packaging structure of semiconductor device

Examples

Experimental program
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Embodiment Construction

[0028] In this specification, it will also be understood that when a component is referred to as being “on”, “connected to” or “coupled to” other components with respect to other components, the one component may be directly disposed on the other component. One component, directly connected to or directly coupled to that one component, or there may also be an intervening third component. In contrast, when elements in this specification are referred to as being “directly on,” “directly connected to” or “directly coupled to” other elements with respect to other elements, there is no intervening element disposed between them. parts.

[0029] The present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which various embodiments are shown. However, this disclosure may be implemented in many different ways and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that...

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PUM

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Abstract

The invention provides a packaging structure of a semiconductor device. The packaging structure comprises a substrate, the upper surface of which is provided with a welding area; a first semiconductor device including a first die and a first capping plate bonded to the first die on an upper surface; the first conductive bump is arranged on the bonding pad on the lower surface of the first sealing cover plate; the second semiconductor device is arranged above the first semiconductor device and comprises a second tube core and a second sealing cover plate, the upper surface of the second sealing cover plate is bonded with the second tube core, and a first area of the lower surface of the second sealing cover plate is provided with a groove for accommodating the first semiconductor device; the second conductive bump is arranged on the bonding pad in the second area of the lower surface of the second sealing cover plate, and the length of the second conductive bump is greater than that of the first conductive bump; and an encapsulant covering the first and second semiconductor devices and the first and second conductive bumps. According to the packaging structure of the semiconductor device, the size of the packaging structure of the semiconductor device can be reduced, and the cost of the packaging structure can be reduced.

Description

technical field [0001] The present disclosure relates to the technical field of semiconductors, and in particular, the present disclosure relates to a packaging structure of a semiconductor device. Background technique [0002] With the development of wireless communication applications, the data transmission rate is getting higher and higher, which leads to the continuous improvement of the utilization rate of spectrum resources and the increasingly complex spectrum, thus putting forward strict requirements on the performance of the radio frequency system. Due to the advantages of filters and duplexers based on film bulk acoustic resonators (FBAR), such as low insertion loss, steep transition characteristics, high selectivity, high power capacity, and strong anti-electrostatic discharge (ESD) capabilities, they are increasingly widely used. usage of. [0003] In the prior art, duplexers are generally manufactured by packaging the filter for the transmitting end (Tx) and th...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L25/18H03H3/02H03H3/08
Inventor 郜振豪杨清华
Owner SUZHOU HUNTERSUN ELECTRONICS CO LTD