Method for conformal protection of abdominal area of printed board BGA device

Abstract

The invention provides a method for conformal protection of an abdominal area of a printed board BGA device, and the method comprises the steps: S1, enabling an immersion assembly to be fixed on a printed board through a pressing plate assembly, and covering the BGA device which needs to be subjected to conformal protection on the printed board; then, the liquid immersion assembly is used for attaching an interface material to the surface of the BGA welding spot; and S2, the BGA device attached with the interface material is sent into a cavity, the cavity is filled with vaporized paint, and plasma vapor deposition is adopted to deposit the paint on the surface of the BGA welding spot attached with the interface material to form a protective film. Through an interface reaction and vapor deposition method, the coating can be deposited on the surface of the BGA welding spot of the BGA device to form a protective film, and the BGA welding spot is effectively protected. Compared with a traditional coating material and a traditional coating process, the three-proofing problem of BGA welding spots in the belly area of a printed board BGA device in electronic equipment is solved, and the performance of the electronic equipment cannot be affected.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a method for conformal protection of the abdomen area of ​​a printed board BGA device. Background technique [0002] At present, in the field of electronic equipment, acrylic (AR type), epoxy (ER type), silicone (SR type), polyurethane (UR type), oligomer mixture, parylene (XY type), etc. are widely used. Coating, through dipping, brushing, spraying or vapor deposition, the coating is attached to the surface of the printed board assembly, and the structures that are vulnerable to environmental stress erosion such as solder joints are protected. However, there are application defects in these coatings and their coating processes: [0003] First, the limitations of the material itself, such as high dielectric constant, large dielectric loss, and film thickness, such as acrylic (AR type), epoxy (ER type), polyurethane (UR type), etc., are not suitable for high-frequenc...

AI Technical Summary

Problems solved by technology

As an important part of electronic equipment, printed board components are also developing towards high frequencies. BGA packaged devices can be used for vertical transmission of high-frequency signals because of their regularity in solder joint arrangement and characteristics of vertical transmission. However, the traditional three-proof coating and its coating process can no longer meet the dual requirements of conformal protection for such solder joints and not affecting the radio frequency transmission performance.

Images