A method for conformal protection of belly area of printed board bga device
A technology for printed boards and devices, which is applied in the field of conformal protection in the abdominal area of printed board BGA devices, and can solve problems such as inability to meet the requirements of conformal protection for radio frequency transmission performance
Active Publication Date: 2022-05-17
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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Problems solved by technology
As an important part of electronic equipment, printed board components are also developing towards high frequencies. BGA packaged devices can be used for vertical transmission of high-frequency signals because of their regularity in solder joint arrangement and characteristics of vertical transmission. However, the traditional three-proof coating and its coating process can no longer meet the dual requirements of conformal protection for such solder joints and not affecting the radio frequency transmission performance.
Method used
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Embodiment
[0043] like figure 1 As shown, the present embodiment proposes a method for conformal protection of the abdomen area of a printed board BGA device, including:
[0044] Step S1, fix the immersion component 10 on the printed board 100 through the pressing plate component 20, and cover the BGA device 200 on the printed board 100 that requires conformal protection; then use the immersion component 10 to attach the interface material 400 on the the surface of the BGA solder joint 300 of the BGA device 200;
[0045] Step S2, the BGA device 200 with the interface material 400 attached is sent into the chamber, the chamber is filled with vaporized coating 500, and the coating 500 is deposited on the BGA solder joint of the BGA device 200 with the interface material 400 attached by plasma vapor deposition 300 forms a protective film on the surface.
[0046] Therefore, the present invention enables the coating 500 to be deposited on the surface of the BGA solder joint 300 of the BGA...
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Abstract
The invention provides a method for conformal protection of the abdominal area of a BGA device on a printed board, comprising: step S1, fixing the liquid-immersion component on the printed board through the pressing plate assembly, and covering the printed board to perform conformal protection Protected BGA device; then use the immersion component to attach the interface material to the surface of the BGA solder joint; step S2, send the BGA device with the interface material into the chamber, which is filled with vaporized coating, and plasma vapor deposition is used The paint is deposited on the surface of the BGA solder joints to which the interface material is attached to form a protective film. The invention enables the paint to be deposited on the surface of the BGA solder joint of the BGA device to form a protective film through the method of interface reaction and vapor phase deposition, and effectively protects the BGA solder joint. Compared with the traditional coating material and coating process, the invention solves the three-defense problem of the BGA solder joints in the abdomen area of the printed board BGA device in the electronic equipment, and does not affect the performance of the electronic equipment.
Description
technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a method for conformal protection of the abdomen area of a printed board BGA device. Background technique [0002] At present, in the field of electronic equipment, acrylic (AR type), epoxy (ER type), silicone (SR type), polyurethane (UR type), oligomer mixture, parylene (XY type), etc. are widely used. Coating, through dipping, brushing, spraying or vapor deposition, the coating is attached to the surface of the printed board assembly, and the structures that are vulnerable to environmental stress erosion such as solder joints are protected. However, there are application defects in these coatings and their coating processes: [0003] First, the limitations of the material itself, such as high dielectric constant, large dielectric loss, and film thickness, such as acrylic (AR type), epoxy (ER type), polyurethane (UR type), etc., are not suitable for high-frequenc...
Claims
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IPC IPC(8): H05K3/28
Inventor 张婧亮陈波李琳胡雅婷廖旭李立金涛刘正勇常义宽
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP