Light-emitting chip packaging ceramic substrate and production process

Abstract

The invention discloses a luminous chip packaging ceramic substrate and a production process, the luminous chip packaging ceramic substrate comprises a silver paste conduction substrate body, an LED luminous chip body, a box dam, a protective inner shell, a base, a heat conduction silica gel sleeve, a protective outer shell and a support plate, the LED luminous chip body is welded at the center of the top of the silver paste conduction substrate body, the LED luminous chip body is embedded in a light hole, and the LED luminous chip body is welded at the center of the bottom of the silver paste conduction substrate body. The light hole penetrates through the center of the sealing plate, limiting mortises are annularly formed in the four corners of the sealing plate, limiting tenon blocks are embedded in the limiting mortises, and the limiting tenon blocks are annularly arranged at the four corners of the inner wall of the box dam; the power distribution cabinet is good in protection performance, long in service life, dual in heat dissipation, high in heat dissipation efficiency, capable of rapidly conducting internal redundant heat to the outside and reducing the risk of overheating short circuit, reliable and safe in work, convenient to mount and dismount, easy to replace, time-saving, labor-saving and low in maintenance cost due to the fact that the mortise and tenon clamping mode is adopted, and the damage degree after external force impact is reduced.

Description

technical field [0001] The invention relates to the technical field of packaging ceramic substrates, in particular to a light-emitting chip packaging ceramic substrate and a production process. Background technique [0002] Light-emitting chip, full name LED light-emitting chip, is a solid-state semiconductor device, which belongs to the core component of LED lights. At present, in the manufacturing process of LED lamps, light-emitting chips are mainly packaged through ceramic substrates. The ceramic substrate has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, has a large current carrying capacity, and is a high-power Basic materials for power electronic circuit structure technology and interconnection technology. [0003] However, the existing packaging ceramic substrates for light-emitting chips have poor protection performance, are severely damage...

AI Technical Summary

Problems solved by technology

[0003] However, the existing packaging ceramic substrates for light-emitting chips have poor protection performance, are severely damaged after external shocks, have a limited service life, and have low heat dissipation efficiency. They cannot quickly transfer excess internal heat to the outside, and are prone to overheating and short circuits Problems, poor reliability, and the welding method is inconvenient for installation and disassembly, difficult to replace, time-consuming and laborious, and high maintenance cost

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