Vibration heat dissipation structure and electronic equipment

Abstract

The embodiment of the invention discloses a vibration heat dissipation structure and electronic equipment. The vibration heat dissipation structure comprises a heat dissipation plate and a plurality of swing blade assemblies. The heat dissipation plate comprises a back plate and a plurality of rows of heat dissipation fins arranged on the back plate in parallel at intervals, mounting groove holes are formed in the end faces, located between the adjacent heat dissipation fins, of the back plate, and the swing blade assemblies are mounted through the mounting groove holes; the swing blade assembly is installed on the back plate and located in the area in front of the adjacent heat dissipation fins and used for making the swing blade assembly swing when a product installed on the heat dissipation plate vibrates. The resonance point of the swing blade assembly is determined according to the vibration frequency spectrum of the carrying tool where the product is installed, and the swing blade assembly is used for generating the maximum energy vibration frequency band of the carrying tool when the product installed on the vibration heat dissipation structure vibrates due to the carrying tool. According to the technical scheme, the problems that the heat dissipation capacity of an existing heat dissipation mode is limited, and the heat dissipation effect on electronic equipment installed on an automobile and an airplane is poor are solved.

Description

technical field [0001] The present invention relates to but not limited to the technical field of electronic equipment structure design, in particular to a vibration heat dissipation structure and electronic equipment. Background technique [0002] When electronic equipment is running, its internal components will generate heat, which is transferred to the surface of the equipment through the internal components of the equipment, and finally taken away by air or other cooling media. [0003] At present, most electronic devices are cooled by natural heat dissipation, that is, the heat is dissipated into the air through the air convection on the surface of the electronic device. However, free cooling has a limited ability to dissipate heat. [0004] Electronic equipment installed on automobiles and airplanes usually face harsh vibration environments. Electronic equipment vibrates with the operation of automobiles and airplanes, which will aggravate the loosening of solder joi...

AI Technical Summary

Problems solved by technology

[0005] Purpose of the present invention: The embodiment of the present invention proposes a vibration heat dissipation structure and electronic equipment to solve the problem of limited heat dissipation capacity of existing heat dissipation methods and poor heat dissipation effect for electronic equipment installed on automobiles and airplanes

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