Silicon carbide wafer laser cutting equipment

Abstract

The invention is suitable for the technical field of laser cutting, and provides silicon carbide wafer laser cutting equipment which comprises an operation table, a first threaded rod is rotationally connected to the operation table, and a first threaded block is in threaded connection to the first threaded rod; the mounting plate is mounted on the first threaded block, and a laser automatic cutting assembly is mounted on the mounting plate; and the connecting driving assembly is mounted in the operation table. The silicon carbide wafer laser cutting equipment can automatically sense whether a silicon carbide wafer passes or not, and only when the silicon carbide wafer is located below the laser automatic cutting assembly, the laser automatic cutting assembly can automatically run to carry out laser cutting operation, so that accidents caused by unnecessary laser use are avoided, and the working efficiency is improved. And meanwhile, the device has the effect of automatically adjusting the cutting position and is convenient to use, high in automation degree and convenient to operate.

Description

technical field [0001] The invention belongs to the technical field of laser cutting, in particular to a silicon carbide wafer laser cutting device. Background technique [0002] Laser cutting is the use of a focused high-power-density laser beam to irradiate the workpiece, so that the irradiated material is rapidly melted, vaporized, ablated or reached the ignition point, and at the same time the molten material is blown away by the high-speed airflow coaxial with the beam, so as to realize the cutting of the workpiece. open. Laser cutting is one of the thermal cutting methods. [0003] The material to be cut is irradiated with a high-power-density laser beam, so that the material is quickly heated to the vaporization temperature, and evaporates to form holes. As the beam moves to the material, the holes continuously form narrow slits to complete the cutting of the material. [0004] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its ra...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the embodiment of the present invention is to provide a silicon carbide wafer laser cutting device, which aims to solve the problem that most of the existing laser cutting devices require complicated operations, manual adjustment of the cutting position, and precise positioning of the cutting angle. At the same time, it is necessary to precisely control the start-up of the laser cutting head to avoid damage to the machine caused by excessive cutting. The operation method is complicated, and it is very easy to make operation errors, which will bring unnecessary losses to production.

Images