Patch device for camera production and working method thereof

Abstract

The invention discloses a surface mounting device for camera production and a working method thereof.The surface mounting device comprises a workbench, the end of the workbench is further provided with a material moving butt joint mechanism used for attaching a surface mounting plate and an element, and one side of the workbench is provided with a plate opening; a plate opening is formed in one side of the workbench, a plate jacking part used for conveying patch plates is arranged at the plate opening, an element jacking part used for conveying elements is arranged on the other side of the workbench, the element storage unit comprises a placement frame, and a plurality of element placement grooves are formed in the middle of the placement frame; according to the device, a plurality of elements are stored and limited through a plurality of element placing grooves, a plurality of abutting push rods are driven by an abutting push plate to synchronously ascend and descend, the plurality of elements placed in the element placing grooves are synchronously pushed out to be attached to a patch board, synchronous patch operation of the plurality of elements is achieved, and the element patch efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of component patching, in particular to a chipping device produced by a camera and a working method thereof. Background technique [0002] With the continuous improvement of people's living standards, people are increasingly using a variety of photographic equipment and electronic devices with photographic functions such as mobile phones. Therefore, the production and manufacture of cameras occupies an important position in our daily life. During the processing and production process of the camera module, it is necessary to attach and assemble the finished components and components such as circuit boards. [0003] However, the assembly operation of the existing components and laminated boards is mainly manual assembly. This assembly method can only be assembled and laminated one component at a time, which consumes a lot of manpower, is slow, and has low efficiency. It is difficult to adapt to the high-speed ...

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Problems solved by technology

[0003] However, the assembly operation of the existing components and laminated boards is mainly manual assembly. This assembly method can only be assembled and laminated one component at a time, which consumes a lot of manpower, is slow, and has low efficiency. It is difficult to adapt to the high-speed automated production of modern factories. demand, and the assembly accuracy of manual patch operation is low, and the quality of the products produced is also unstable, so it is necessary to propose improvements

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