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Aluminum-silicon alloy-based composite material as well as preparation method and application thereof

A composite material and aluminum-silicon alloy technology, which is applied in the field of aluminum-silicon alloy-based composite materials and their preparation, can solve problems such as difficulty in meeting use requirements, and achieve the effects of reducing self-weight, reducing manufacturing costs, and reducing fuel consumption

Pending Publication Date: 2022-05-27
NONFERROUS METALLIC OF HEBEI NEW LIZHONG GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Aerospace and other industries have more and more demands for materials with high thermal conductivity, light weight, and good processability. However, based on aerospace "gram-by-gram efficiency" (on an aircraft, the cost per 1kg of payload is as high as 50,000 pounds, for communication Satellites are 100 times higher), the existing materials are difficult to meet the use requirements

Method used

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  • Aluminum-silicon alloy-based composite material as well as preparation method and application thereof
  • Aluminum-silicon alloy-based composite material as well as preparation method and application thereof
  • Aluminum-silicon alloy-based composite material as well as preparation method and application thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Prepare raw materials, the total amount is calculated as 100%, and the raw materials are composed of Si: 5%; Ti: 0.25%; Cu: 0.70%; Mg: 0.70%; species, the dosage ratio of D50=80 μm SiC and D50=20 μm SiC is 3:1); the balance is composed of Al.

[0044] The preparation method is as follows:

[0045] In step 1, the raw materials Si, Al, Ti, Cu, and Mg are mixed, and the AlSi alloy spherical powder (particle size is D10=15 μm, D50=35 μm, D90=110 μm) is prepared by vacuum air atomization.

[0046] In step 2, D50=80 μm SiC and D50=20 μm SiC are mixed uniformly, and surface activation is performed under the heating condition of an oil bath at 180° C. for 2.5 h to obtain activated SiC.

[0047] In step 3, the AlSi alloy spherical powder prepared in step 1 is mixed with the activated SiC prepared in step 2, and then hot isostatic pressing is used to form a silicon aluminum alloy based composite material.

[0048] Results: The content of impurity Fe element in the aluminum-sili...

Embodiment 2

[0052] Prepare raw materials, the total amount is calculated as 100%, the raw materials are composed of Si: 50%; Ti: 0.15%; Cu: 0.21%; Mg: 0.18%; The dosage ratio of 30μm SiC is 4:1); the balance is composed of Al.

[0053] The preparation method is as follows:

[0054] In step 1, the raw materials Si, Al, Ti, Cu, and Mg are mixed, and the AlSi alloy spherical powder (particle size is D10=10 μm, D50=25 μm, D90=50 μm) is prepared by vacuum air atomization.

[0055] In step 2, 60 μm SiC and 30 μm SiC are mixed uniformly, and the surface is activated under the heating condition of an oil bath at 170° C. for 2.5 h to obtain activated SiC.

[0056] In step 3, the AlSi alloy spherical powder prepared in step 1 is mixed with the activated SiC prepared in step 2, and then hot isostatic pressing is used to form a silicon aluminum alloy based composite material.

[0057] Result: The content of impurity Fe element in the aluminum-silicon alloy matrix composite material prepared in this...

Embodiment 3

[0061] Prepare raw materials, the total amount is calculated as 100%, the raw materials are composed of Si: 80%; Ti: 0.08%; Cu: 0.08%; Mg: 0.05%; The dosage ratio of 25μm SiC is 2:1); the balance is composed of Al.

[0062] The preparation method is as follows:

[0063] In step 1, the raw materials Si, Al, Ti, Cu, and Mg are mixed, and the AlSi alloy spherical powder (particle size is D10=20 μm, D50=45 μm, D90=150 μm) is prepared by vacuum atomization method.

[0064] In step 2, 100 μm SiC and 25 μm SiC are mixed uniformly, and the surface is activated for 1 h under the heating condition of an oil bath at 120° C. to obtain activated SiC.

[0065] In step 3, the AlSi alloy spherical powder prepared in step 1 is mixed with the activated SiC prepared in step 2, and then hot isostatic pressing is used to form a silicon aluminum alloy based composite material.

[0066] Results: The content of impurity Fe element in the aluminum-silicon alloy matrix composite material prepared in ...

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Abstract

The invention discloses an aluminum-silicon alloy-based composite material as well as a preparation method and application thereof, and relates to the technical field of aluminum-silicon-based composite materials. The alloy comprises the following components in percentage by mass: 5-80% of Si; 0.01 to 0.28 percent of Ti; 0.01 to 0.75 percent of Cu; 0.01 to 0.75 percent of Mg; 5-55% of SiC and the balance of Al. The aluminum-silicon alloy-based composite material has excellent comprehensive properties such as light weight (2.5-2.8 g / cm < 3 >), high rigidity (80-200 GPa), high thermal conductivity (120-220 W / m.K), adjustable expansion coefficient (4-20 * 10 <-6 > / DEG C) and the like, can adapt to various working conditions, greatly improves the reliability and stability of chip packaging, microwave device and module packaging, T / R assembly shells and heat sink products, and has wide application prospects. And meanwhile, the material can also be applied to aerospace and heat-resistant parts.

Description

technical field [0001] The invention relates to the technical field of aluminum-silicon-based composite materials, in particular to an aluminum-silicon alloy-based composite material and a preparation method and application thereof. Background technique [0002] With the development of equipment in industries such as military defense, aerospace, transportation, electronics, and energy, it is becoming lighter, more integrated, and more powerful. At present, the types of commonly used electronic packaging materials mainly include copper, Kovar alloy and ceramic materials. Among them, although copper and copper alloy have good thermal conductivity and electrical conductivity, their density is relatively high; Kovar alloy also has a relatively high density and thermal conductivity. The rate is low; the thermal expansion matching of ceramic materials is not satisfactory. There is an increasing demand for materials with high thermal conductivity, lightweight materials, and good p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C21/02C22C28/00C22C1/05B22F3/15
CPCC22C21/02C22C28/00C22C1/05B22F3/15
Inventor 李海军宗福春胡增武李作平左李庆苑高利齐敬彭文佳李云飞于洋
Owner NONFERROUS METALLIC OF HEBEI NEW LIZHONG GRP CO LTD
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