Technological method for solving inconsistent ink color of glue coated on surface of mini LED COB (Chip On Board)
A process method and ink color technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of affecting the light output effect of mini LED, poor glue injection method, inconsistent ink color on the surface, etc., achieve broad market application prospects, and eliminate chip string light Problem, solve the effect of ink color inconsistency
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Embodiment 1
[0033] as Figure 1-4 As shown, a process method to solve the inconsistency of the surface of mini LED COB coated ink color, wherein: the solution of the mini LED COB surface coated ink color inconsistency process method using the following steps:
[0034] Step 1, solid crystal: the RGB tricolor chip 2 is successively glued to the designated area on the PCB board 1, and the RGB tricolor chip 2 of the solid crystal does not contact each other, and there is a certain gap in the diameter of the adjacent RGB tricolor chip 2;
[0035] Step 2, coating printing: the glue 3 with the usable yellow light process is filled on the outer surface of the RGB tricolor chip 2 by the coating printing method;
[0036]Step 3, string light elimination: the RGB tricolor chip 2 above the corresponding position through the initial baking, exposure, development, post-baking, glue curing, so that the end face of glue 3 flat, to obtain the product, RGB tricolor chip 2 around the uniform filling with glue 3; ...
Embodiment 2
[0040] as Figure 1-2 and Figure 5-6 As shown, a process method to solve the inconsistency of the surface coating ink color of mini LED COB, which is characterized in that: the process method of solving the inconsistency of the surface of the mini LED COB coated ink color can also adopt the following steps:
[0041] Step 1, solid crystal: the RGB tricolor chip 2 is glued to the designated area on the PCB board 1 in turn, the solid crystal RGB tricolor chip 2 does not contact each other, and the adjacent RGB tricolor chip 2 diameter has a certain gap;
[0042] Step 2: Dispense: Glue 3 dots with a usable yellow light process are applied to the outer surface of RGB tricolor chip 2;
[0043] Step three, grinding: the glue 3 above the upper end surface of the RGB tricolor chip 2 is smoothed by grinding, so that the filling height of the glue 3 is the same as the height of the RGB tricolor chip 2, and the product is obtained, and the four sides of the RGB tricolor chip 2 are evenly fille...
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