Method for reducing welding porosity of semiconductor device
A semiconductor and porosity technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of reducing the soldering porosity of semiconductor devices, reducing the soldering porosity of electronic devices, etc., so as to reduce the soldering porosity and increase the roughness The effect of the degree and method is simple
Pending Publication Date: 2022-06-10
HANGZHOU DAHE THERMO MAGNETICS CO LTD
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[0004] In order to solve the problem of relatively difficult improvement of soldering porosity at present, the present invention provides a process method for reducing soldering porosity of electronic devices, which solves the problem of soldering voids in the low-cost solder paste reflow soldering process, and reduces the soldering porosity of semiconductor devices. Rate
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Abstract
The invention belongs to the technical field of semiconductor device packaging, and provides a process method for reducing the welding porosity of an electronic device in order to solve the problem that the improvement of welding pores at present is relatively difficult, after a Ni spraying layer is added on a semiconductor substrate, a reflow soldering process is adopted, and the welding porosity of the electronic device is reduced. The problem of welding holes in a low-cost solder paste reflow welding process is solved, and the welding porosity of a semiconductor device is reduced.
Description
A method for reducing soldering porosity of semiconductor devices technical field The invention belongs to the semiconductor device packaging technology field, be specifically related to a kind of reduction semiconductor device welding porosity Methods. Background technique In the production of electronic products, in order to maintain the electrical performance and performance of the components, the components need to be sealed. In the packaging process, the semiconductor components are usually soldered to the substrate by solder. Therefore, the soldering process directly affects the The quality of the soldering interconnection between the component and the substrate, and the air hole is the most common soldering quality problem. At present, solder paste reflow soldering is one of the semiconductor device packaging processes, and the welding porosity of a larger area is the most common. See and one of the most difficult problems to solve, when the void ratio is la...
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IPC IPC(8): H01L21/60H01L21/48
CPCH01L21/4821H01L21/50H01L2021/60135
Inventor 崔博然翟仁爽李明杨驰
Owner HANGZHOU DAHE THERMO MAGNETICS CO LTD