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Preparation method of display panel and display panel

A display panel and exposed surface technology, which is applied in the direction of instruments, nonlinear optics, optics, etc., can solve the problem of poor conduction between the conductive film layer and the metal pad, achieve good conductivity, improve manufacturing yield, and stabilize the connection Effect

Active Publication Date: 2022-07-01
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present application provides a method for preparing a display panel and a display panel, so as to solve the technical problem of poor conduction between the conductive film layer and the metal pad caused by corrosion of the metal pad in the side bonding process, and improve the performance of the side panel. Manufacturing yield of bonded products

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  • Preparation method of display panel and display panel
  • Preparation method of display panel and display panel
  • Preparation method of display panel and display panel

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preparation example Construction

[0038] Please refer to figure 1 , the present application provides a preparation method of a display panel, which comprises the following steps:

[0039] 101. Provide a display panel main body, the display panel main body has a metal pad located in the outer pin bonding area, and the side surface of the metal pad is exposed on the outside;

[0040] 102. forming a protection member covering the metal pad on the side surface of the display panel body;

[0041] 103. Patterning the protective member to expose the metal pad;

[0042] 104, forming a conductive layer on the exposed surface of the metal pad;

[0043] 105. Form a chip on film on the surface of the conductive layer away from the metal pad.

[0044] Therefore, in the preparation method of the display panel of the present application, before forming the conductive layer, firstly, a protective member covering the metal pad is formed on the side surface of the display panel main body, and the protective member can protec...

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Abstract

The invention discloses a preparation method of a display panel and the display panel. The preparation method of the display panel comprises the following steps that a display panel body is provided, the display panel body is provided with a metal bonding pad located in an outer pin bonding area, and the side face of the metal bonding pad is exposed to the outer side; forming a protection piece covering the metal bonding pad on the side surface of the display panel main body; carrying out patterning processing on the protection piece so as to expose the metal bonding pad; forming a conductive layer on the exposed surface of the metal bonding pad; and forming a chip on film on the surface, deviating from the metal bonding pad, of the conductive layer. According to the invention, the conductivity between the conductive film layer and the metal bonding pad is improved, and the manufacturing yield of a side surface binding product is improved.

Description

technical field [0001] The present application relates to the field of display technology, and in particular, to a preparation method of a display panel and a display panel. Background technique [0002] In the field of display technology, in order to obtain the ultimate narrow frame effect, on the basis of the traditional bonding process, the outer pin bonding area of ​​the display panel is removed, and the side bonding process is used to realize the bonding of the metal pad and the chip on film. fixed connection. [0003] In the existing side bonding process route, a conductive film layer is usually used to realize the electrical connection between the metal pad and the chip on film. However, before the conductive material such as silver paste is printed on the side of the panel, since the metal pads are exposed, the exposed metal pads are prone to corrosion, resulting in poor conduction between the conductive film layer formed after printing and the metal pads , thereby...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13G02F1/1345
CPCG02F1/1303G02F1/13452G02F1/13458G02F1/1339G02F1/133514G02F2201/50
Inventor 黄秀洪
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD