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Bonding method of semiconductor wafer

A bonding method and semiconductor technology, applied in the fields of semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of easy bubbles in glue, weak bonding, affecting product quality, etc., to achieve strong bonding and improve product quality. quality, the effect of eliminating bubbles

Pending Publication Date: 2022-07-01
SAE TECH DELEVOPMENT DONGGUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional bonding method is to use shadowless glue (UV glue) for bonding. However, in actual use, air bubbles are prone to appear in the glue, resulting in weak bonding and affecting product quality.

Method used

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  • Bonding method of semiconductor wafer

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Embodiment Construction

[0016] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0017] Embodiments of the present invention provide a method for bonding semiconductor wafers, see figure 1 As shown, it is a flowchart of a preferred embodiment of a method for bonding semiconductor wafers provided by the present invention, and the method includes steps S11 to S14:

[0018] Step S11, before the semiconductor wafer is bonded with UV glue and the UV glue is not cured, the semiconductor wafer is fixed on the rotary ta...

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Abstract

The invention discloses a bonding method of a semiconductor wafer, which comprises the following steps: before the semiconductor wafer is bonded by using UV glue and the UV glue is not cured, fixing the semiconductor wafer on a rotary table in a vacuum chamber; wherein the temperature of the rotary table is stabilized at 75-100 DEG C; the vacuum chamber is vacuumized through a vacuum device, so that the vacuum degree in the vacuum chamber is stabilized at-1.02 MPa to-0.98 MPa; the semiconductor wafer is driven to rotate through the rotating table, and ultrasonic waves are emitted through the ultrasonic wave generating device so as to eliminate bubbles in the UV glue; wherein the rotating speed of the rotating table is 800 rmp, and the working frequency of the ultrasonic generating device is 60 KHz; and carrying out curing treatment on the UV glue subjected to bubble elimination. By adopting the technical scheme of the invention, bubbles in the UV glue can be effectively eliminated, so that the semiconductor wafer is firmly bonded, and the product quality is improved.

Description

technical field [0001] The present invention relates to the technical field of semiconductor manufacturing, in particular to a method for bonding semiconductor wafers. Background technique [0002] During the processing of semiconductor wafers, they usually undergo cutting, grinding and other processes, which all require bonding the semiconductor wafers to a ceramic substrate. [0003] The traditional bonding method is to use shadowless glue (UV glue) to bond. However, in actual use, air bubbles are likely to appear in the glue, resulting in weak bonding and affecting product quality. SUMMARY OF THE INVENTION [0004] The technical problem to be solved by the embodiments of the present invention is to provide a method for bonding semiconductor wafers, which can effectively eliminate air bubbles in the UV glue, so that the semiconductor wafers are firmly bonded, thereby improving product quality. [0005] In order to solve the above technical problems, an embodiment of the...

Claims

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Application Information

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IPC IPC(8): H01L21/683H01L21/02
CPCH01L21/6835H01L21/0201H01L21/02008H01L2221/68327
Inventor 马岳
Owner SAE TECH DELEVOPMENT DONGGUAN