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Cooling plate with uniform plenum flow

A technology of cooling plate and air chamber, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., and can solve the condition that the air chamber of the cooling plate is not large enough to establish flow uniformity, the size of the air chamber Issues such as size and spacing limitations, to achieve the effect of enhancing heat transfer, enhancing flow uniformity, and improving flow uniformity

Pending Publication Date: 2022-07-01
IBM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in typical cold plate applications, the plenum size is limited by the size and spacing of the components to be cooled
Often the cold plate plenum is not large enough to establish conditions close enough to isobaric pressure to produce the desired flow uniformity

Method used

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  • Cooling plate with uniform plenum flow
  • Cooling plate with uniform plenum flow
  • Cooling plate with uniform plenum flow

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] figure 1 A cross-sectional view of a prior art cooling plate 100 is shown including a top portion 102 and a bottom portion 104 to which inlet nozzles 106 and outlet nozzles (not shown to avoid confusion) are connected at the top. Top portion 102 and bottom portion 104 enclose inlet plenum 108 , effective volume 110 and outlet plenum 112 . Note the smooth continuous planar outer walls 116 , 118 of the inlet plenum 108 and outlet plenum 112 . Also note the opening of the effective volume 110 along the entire length of the inlet plenum 108 and the outlet plenum 112 . Separate features such as tabs, pins or screens are present within the effective volume 110, but are not shown to avoid confusion; as those skilled in the art will appreciate, the separate features of the effective volume define the flow of fluid from the inlet plenum 108 to the outlet gas The routing of the chamber 112 and generally provide extended surfaces to enhance heat transfer.

[0024] In convention...

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PUM

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Abstract

A cooling plate apparatus includes a wall surrounding an effective volume adjacent an inlet plenum; the wall includes an inlet opening at one end of the top side of the inlet plenum and a plenum opening between the inlet plenum and the effective volume. Also included is a barrier partially separating the inlet plenum from the effective volume. The barrier is structurally configured to preferentially redirect flow from the inlet plenum into the effective volume.

Description

Background technique [0001] The present invention relates to the electrical, electronic, thermal, mechanical and computer fields, and more particularly to apparatus for cooling computer components. [0002] One device used to cool computer components is a "cooling plate," which is a conductive heat sink that is in contact with the components, either directly or through an intermediate thermal interface material (TIM). The cooling plate may be a solid metal block, typically with fins for enhanced air cooling, or it may be a hollow structure through which coolant (eg, water) flows from the inlet to the outlet. [0003] Typically, in heat exchangers, it is desirable to provide plenums on each side of the effective (eg, sheet) volume of the heat exchanger; the plenums are wide and thick enough to establish uniform pressure (isobaric) conditions, which are created by efficient Substantially uniform flow of the area. However, in a typical cooling plate application, the plenum size...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20
CPCH05K7/20145G06F1/20B33Y80/00F28F3/12H01L23/473H05K7/20254F28F9/0248F28F2200/00H05K7/20509
Inventor M·D·舒尔茨P·R·帕里达
Owner IBM CORP