Automatic gluing mechanism
A glue application, automatic technology, applied in the direction of coating, device for coating liquid on the surface, climate sustainability, etc., can solve the problems of different thickness of glue layer, affecting the photolithography process, uneven distribution of coating glue, etc. , to achieve the effect of uniform thickness
Inactive Publication Date: 2022-07-08
上海图双精密装备有限公司
View PDF8 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] However, since the vacuum chuck on the working platform may not be in a horizontal state when installed, when the motor rotates, the centrifugal force generated by the suction cup is not in the direction of the horizontal plane, which will cause the uneven distribution of the coating glue, resulting in a glue layer on the wafer. The thickness is different, which greatly affects the subsequent photolithography process
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0023] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but it is not intended to limit the present invention.
[0024] figure 1 It is a schematic diagram of the overall structure of an automatic gluing mechanism of the present invention, figure 2 It is a schematic structural diagram of an adjustment component of an automatic gluing mechanism of the present invention, image 3 It is a schematic structural diagram of an infrared laser detection group of an automatic gluing mechanism of the present invention, Figure 4 It is a structural schematic diagram of a gear adjustment group of an automatic gluing mechanism of the present invention, such as Figure 1 to Figure 4 As shown, an automatic gluing mechanism of a preferred embodiment is shown, including: a plane seat 1, a rotating mechanism 2, an adjusting mechanism 3 and a suction cup assembly 4, and the rotating mechanism 2 includes: a first driving ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses an automatic gluing mechanism which comprises a plane base, a rotating mechanism, an adjusting mechanism and a suction cup assembly. The rotating mechanism comprises a first driving part and a rotating disc, the first driving part drives the rotating disc to rotate, and the rotating disc is rotationally arranged on the plane seat; the adjusting mechanism is arranged on the rotating disc, the adjusting mechanism comprises at least three adjusting assemblies, the three adjusting assemblies are arranged in the circumferential direction of the rotating disc at equal intervals, the suction cup assemblies are arranged on the three adjusting assemblies, the suction cup assemblies and the rotating disc are coaxially arranged, and the suction cup assemblies are arranged on the rotating disc. The three adjusting assemblies are used for adjusting the levelness of the suction cup assembly. It can be guaranteed that the suction cup is in a horizontal state, and the thickness of an adhesive layer on a wafer is consistent.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to an automatic gluing mechanism. Background technique [0002] The photolithography process includes the steps of wafer homogenization and development, that is, coating adhesive layer, pre-baking, exposure, and development. The photoresist on the wafer surface can be properly sensitized. [0003] Among them, the motor is usually used to drive the wafer adsorbed on the vacuum chuck to rotate during the glue distribution, so that the glue is evenly distributed on the wafer under the action of centrifugal force, and the coating thickness of the glue film can be controlled according to the speed of the motor rotating shaft. . [0004] However, since the vacuum suction cup on the working platform may not be in a horizontal state during installation, when the motor rotates, the centrifugal force generated by the suction cup is not in the direction of the horizontal plane, which ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): B05C13/02B05C11/08
CPCB05C13/02B05C11/08Y02P70/50
Inventor 钟敏
Owner 上海图双精密装备有限公司