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Method of forming lead interconnect structure and related wire bonding tool

A technology of interconnection structures and leads, which is applied in the direction of manufacturing tools, metal processing, welding equipment, etc., can solve problems such as lack of consistency, unsatisfactory shape consistency, and mutual interference of adjacent structures

Pending Publication Date: 2022-07-08
KULICKE & SOFFA IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, conventional techniques for forming such wire contacts and interconnects suffer from a lack of uniformity (e.g., height uniformity, shape uniformity, etc.) and non-ideal shapes of the wire contacts and interconnects
Furthermore, modern installations have significant space constraints that create a greater risk of mutual interference between adjacent structures

Method used

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  • Method of forming lead interconnect structure and related wire bonding tool
  • Method of forming lead interconnect structure and related wire bonding tool
  • Method of forming lead interconnect structure and related wire bonding tool

Examples

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Embodiment Construction

[0018] As used herein, the term "interconnect structure" or "lead interconnect structure" is intended to refer to any type of electrical interconnect that may be used to provide electrical interconnect (eg, temporary interconnect such as in contacts for testing, such as semiconductor package interconnect permanent interconnection, electrical shielding, etc.) conductive structures.

[0019] figure 1 A wire bonding tool 100 is illustrated that includes a body portion 102 that defines a through hole 102a extending along a length of the body portion 102 . Via 102a is configured to receive a length of lead (not shown). The body portion 102 extends to a tapered portion 104 (eg, a tapered / constricted portion) and terminates at a tip portion 106 that is configured to contact the leads during wire bonding operations. The wire bonding tool 100 has an outer diameter 118 . figure 1 This is but one example of a wire bonding tool that may have features at its tip in accordance with the p...

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Abstract

A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding site on a substrate using a wire bonding tool; (b) extending a length of lead connected with the lead bonding part to a position above the lead bonding part; (c) moving the wire bonding tool to contact the length of lead at a location along the length of lead to partially cut the length of lead at a location along the length of lead; and (d) separating the length of lead from the lead supply at a location along the length of lead, thereby providing a lead interconnect structure that is bonded to the bonding site.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS [0002] This application claims the benefit of US Provisional Patent Application No. 63 / 127,386, filed December 18, 2020, the contents of which are incorporated herein by reference. technical field [0003] The present invention relates to wire bonding, and more particularly, to an improved method of forming wire interconnect structures. Background technique [0004] A wire bonder (ie, a wire bonder) can form wire loops between the various locations that are to be electrically interconnected. Exemplary wire bonding techniques include ball bonding and wedge bonding. The steps in a solder ball bonding application include: bonding an airless solder ball to a first bonding site (eg, a die pad of a semiconductor wafer); extending a length of lead that is continuous with the bonded airless solder ball to a second bond site (eg, wires of a lead frame); and bond the wire to a second bond site, thereby forming a wire loop between the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/768H01L21/48
CPCH01L21/76895H01L24/78H01L2224/78H01L2924/00014B23K2101/42B23K20/007H01L2224/78306H01L2224/78307H01L2224/85035H01L2224/85047H01L24/85H01L2224/7825H01L2224/78343H01L2224/7855H01L2224/85205H01L2224/78621H01L2224/45099H01L24/43H01L2224/4383H01L2224/43985
Inventor B·米尔顿R·奥利达J·盖勒T·莱文森
Owner KULICKE & SOFFA IND INC