High-hole-thickness-diameter-ratio through hole drilling method for PCB

Abstract

The invention relates to the technical field of PCB drilling, in particular to a high-hole-thickness-diameter-ratio through hole drilling method for a PCB. The through hole drilling method comprises the following steps of: arranging an inner-layer PCB (Printed Circuit Board); a first through hole drilling process is carried out on the inner-layer PCB; filling holes; after the hole filling is completed, performing layer-adding lamination processing to obtain a layer-adding PCB; drilling a positioning hole; recording a relative coordinate file; recording related coordinate values of the positioning holes; the drilling machine reads an X-ray hole filling coordinate record file; the drilling machine is used for drilling A-face blind holes in the layer-adding PVB board; the blind drill drills to reach the filling hole; turning over the added-layer PCB manually to expose the B surface of the added-layer PCB; and repeating the steps to complete the B-side blind hole drilling process of the layer-adding PCB, so that the B-side blind hole is communicated with the A-side blind hole, and after the inner-layer PCB structure is prepared firstly and the filler material is filled, the layer-adding PCB does not deviate under the guidance of the filler material when single-side drilling is carried out on the layer-adding PCB.

Description

technical field [0001] The invention relates to the technical field of PCB drilling, in particular to a high hole aspect ratio through hole drilling method of a PCB board. Background technique [0002] like figure 1 As shown in the figure, it is not easy to make through holes in the existing PCB boards with high hole thickness to diameter ratio, which is often limited by the length of the drill needle, and it is impossible to complete the through hole production in one drilling; [0003] like figure 2 As shown in the figure, the method adopted in the prior art is as follows: first, the through hole to be drilled is performed on the A side of the PCB board to make a blind drilling procedure, and then the PCB board is turned over to the B side, and the holes in the same relative position are carried out. Drill a hole from the B side to the A side, continue to drill until the blind hole on the A side is drilled, and use this method to form a through hole; [0004] However, ...

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Problems solved by technology

[0004] However, the above method is prone to drill deviation when drilling blind holes on side A. When the drilling process on side B is carried out, the blind hole on side A will be deflected and cannot be aligned or drilled partially. The phenomenon of penetration is similar to drilling a wall with an electric drill. Both the electric drill and the drill bit are at a vertical angle to the wall, but they will be skewed when entering the wall. This situation makes the through holes with high hole thickness to diameter ratio unable to meet the requirements.

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