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Film coating method and light-emitting device

A light-emitting device and coating technology, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of increasing the amount of phosphors used and the difficulty in improving the distribution density of phosphors, and achieves improved light conversion efficiency, material saving, and high light conversion. The effect of efficiency

Pending Publication Date: 2022-07-29
SKIILEUX ELECTRICITY INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to uniformly disperse the phosphor powder in the resin, it is difficult to increase the distribution density of the phosphor powder in the resin.
In addition, when coating resin on multiple LEDs on the substrate at the same time, it is easy to coat other areas on the substrate that do not need to be coated with resin, increasing the amount of phosphor used
And it is difficult to apply different phosphors to individual LEDs

Method used

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  • Film coating method and light-emitting device
  • Film coating method and light-emitting device
  • Film coating method and light-emitting device

Examples

Experimental program
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no. 1 example

[0051] see Figure 2 to Figure 4 . According to the first embodiment, the film coating method is applied in the manufacture of a light-emitting device. In the first embodiment, as shown in step S200 , the film coating method provides the object to be coated 1 . like image 3 As shown, the object to be coated 1 includes a substrate 12 and a plurality of light emitting components 14a, 14b, 14c. The substrate 12 has an upper surface 122, and the light-emitting elements 14a, 14b, 14c are disposed on the upper surface 122 at intervals, that is, there are gaps between the light-emitting elements 14a, 14b, 14c. The light emitting components 14a, 14b, 14c may be LEDs, but are not limited to LEDs. As shown in step S202, the film coating method provides an accommodating tank 2, and injects a liquid 22 into the accommodating tank 2 (such as Figure 4 shown). As shown in step S204 , the film coating method provides a mask 3 . like Figure 4 As shown, the mask 3 has a pattern 32 (e...

no. 2 example

[0061] In addition, in the first embodiment, the light-emitting elements 14a, 14b, and 14c are coated with the coating layers 50, 51 of the same composition, but in practice, different masks can be used to selectively coat the light-emitting elements 14a, 14b, and 14c. Coating layers are formed on 14b and 14c, and the composition of each coating layer may be different. For example, in the second embodiment, the film coating method coats the light-emitting components 14a and 14b with coating layers of different compositions. In order to simplify the description and the drawings, the following mainly describes the relative arrangement relationship between the masks 3a, 3b, the coating material films 4a, 4b and the object to be coated 1 . For other descriptions of coating, please refer to the above descriptions about the first embodiment and its modifications, and will not be repeated. like Figure 13 As shown, in the second embodiment, the film coating method sets a mask 3a on...

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Abstract

The invention discloses a film coating method. The method comprises the following steps: providing an object to be coated; providing a mask; the mask is arranged on the upper portion of the object to be coated; a coating material film is arranged above the object to be coated and the mask; and enabling the coating material film and the to-be-coated object to be close to each other, so that the coating material film forms a coating layer on the to-be-coated surface area of the to-be-coated object through the pattern of the mask. The invention further discloses a light-emitting device which comprises the substrate and a plurality of light-emitting assemblies. The light-emitting assemblies are arranged on the upper surface of the substrate at intervals. The light-emitting surface of the light-emitting assembly is covered with an optical wavelength conversion layer, and the optical wavelength conversion layer is a compact powder layer and makes contact with the upper surface of the substrate. And the upper surface of the substrate is provided with a region which is not covered with the powder layer between two adjacent light-emitting components.

Description

technical field [0001] The present invention relates to a film coating method and a light-emitting device with a light wavelength conversion layer. Background technique [0002] Light-emitting diodes (LEDs) have the advantages of high luminous efficiency, low power consumption, long service life, and small size of components, and have been widely used in various light-emitting devices. LEDs generally use various phosphors to generate light of different colors. The phosphor is usually added to the resin and stirred so that the phosphor can be uniformly dispersed in the resin. Next, the phosphor-dispersed resin is mixed with a curing agent to coat the light-emitting diode. However, in order to uniformly disperse the phosphor in the resin, it is difficult to increase the distribution density of the phosphor in the resin. In addition, when resin is applied to a plurality of LEDs on the substrate at the same time, other areas on the substrate that do not need to be coated are ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50
CPCH01L33/48H01L33/502H01L2933/0041H01L33/504H01L2933/0025H01L33/44H01L25/0753H01L33/005
Inventor 陈建清
Owner SKIILEUX ELECTRICITY INC