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Device for chemical metallization of target surface of at least one workpiece, and method and diffusion plate therefor

A technology of chemical metal and diffusion plate, applied in metal material coating process, liquid chemical plating, coating, etc., can solve problems such as differences between wafers and changes in deposited metals

Pending Publication Date: 2022-07-29
AP&S国际股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In the prior art it has proven disadvantageous that the layer thickness of the deposited metal varies across the wafer and also varies from wafer to wafer within a batch

Method used

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  • Device for chemical metallization of target surface of at least one workpiece, and method and diffusion plate therefor
  • Device for chemical metallization of target surface of at least one workpiece, and method and diffusion plate therefor
  • Device for chemical metallization of target surface of at least one workpiece, and method and diffusion plate therefor

Examples

Experimental program
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Embodiment Construction

[0043] Identical or functionally identical components are denoted by the same reference numerals below. For the sake of clarity, not all identical or functionally identical components are provided with reference numbers in the various figures.

[0044] figure 1 An apparatus 1 for chemically metallizing a target surface of at least one workpiece 5 is shown. Such workpieces are (not shown) wafers that are widely used as substrates or substrates for electronic components, including integrated circuits (ICs), micromechanical components or optoelectronic coatings.

[0045] The apparatus 1 essentially comprises a vessel 10 for receiving (not shown) a metallizing solution, into which a workpiece 5 can be immersed for metallization.

[0046] In the embodiment shown as an example, a plurality of workpieces 5 are arranged vertically in a holder 20 which is designed as a so-called wafer carrier.

[0047] The container 10 has a bottom side 11 and a top side 12 and is formed by a liquid...

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PUM

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Abstract

The invention relates to a device (1) for the chemical metallization of a target surface of at least one workpiece (5), comprising a container (10) for accommodating a metallization solution, which container has an inlet (15) and an outlet (16) for the metallization solution, and a holder (20) for accommodating the at least one workpiece (5), which holder (20) can be arranged in the container (10), wherein at least one diffuser plate (30) is arranged between the at least one inlet opening (15) and the support (20), said diffuser having a plurality of diffuser openings (35) spaced apart in the middle of the plate plane (E), and wherein a movement device (40) is provided, which can move the diffuser plate (30) in the container (10) in at least one spatial direction. The invention further relates to a method for chemically metallizing a target surface of at least one workpiece (5).

Description

technical field [0001] The invention relates to a device for chemically metallizing a target surface of at least one workpiece in order to improve the uniformity of the deposited metal layer of said workpiece, having the features of patent claim 1, a device having the features of claim 13 for A method of chemically metallizing at least one workpiece and a diffuser plate having the features of claim 16 . Background technique [0002] Apparatus and methods for chemically metallizing a target surface of at least one workpiece are known in various configurations in the prior art. Electroless metal deposition from electrolyte solutions is well known in semiconductor, solar or nanotechnology. Chemical metallization of objects such as structured wafers has distinct advantages over electroplating metallization in terms of durability, uniformity and consistency of deposition techniques, and characterization of achievable layers. Advantageously, the workpiece to be coated does not r...

Claims

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Application Information

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IPC IPC(8): C23C18/16
CPCC23C18/1628C23C18/1669C23C18/163C23C18/31
Inventor H·帕泽福尔
Owner AP&S国际股份有限公司