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Preparation of polyimide moulded by casting

A technology of polyimide and casting molding, which is applied in the field of polyimide preparation, can solve the problems of complicated processing technology, rising cost, and unreported problems, and achieve the effect of reducing cost and difficulty of technology

Inactive Publication Date: 2004-11-24
CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although these methods can also produce materials with excellent performance, they all complicate the processing technology and lead to an increase in cost, and for various reasons, most of them can only prepare relatively simple parts, and it is difficult to prepare parts with more complex structures.
And about the polyimide simple and convenient preparation method that directly carries out casting molding at room temperature, there is no report yet

Method used

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  • Preparation of polyimide moulded by casting
  • Preparation of polyimide moulded by casting

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] The oligomer prepared by 10g 4,4'-diaminodiphenylmethane and N,N'-bismaleimide-4,4'-diphenylmethane in a ratio of 3:2 (molar ratio) After mixing and stirring with 10g N, N`-dimethylacrylamide to dissolve, degas under reduced pressure, pour it into a mold made of glass plate, and 60 The Co source was irradiated at room temperature until the dose reached 50KGy, and post-cured at 180°C for 6 hours after demolding to obtain an amber transparent plate. 5% thermal weight loss is 340°C, flexural strength is 151MPa, flexural modulus is 3.05GPa, compressive strength is 129MPa, compressive modulus is 1.49MPa, impact strength is 35KJ / m 2 , The saturated water absorption rate is 7%.

Embodiment 2

[0015] The oligomer prepared by 10g 4,4'-diaminodiphenylmethane and N,N'-bismaleimide-4,4'-diphenylmethane in a ratio of 4:3 (molar ratio) After mixing and stirring with 10g N, N`-dimethylacrylamide to dissolve, degas under reduced pressure, pour it into a mold made of glass plate, and 60 The Co source was irradiated at room temperature until the dose reached 100KGy, and post-cured at 180°C for 6 hours after demolding to obtain an amber transparent plate. 5% thermal weight loss is 362°C, flexural strength is 114MPa, flexural modulus is 2.86GPa, compressive strength is 116MPa, compressive modulus is 0.98MPa, impact strength is 24KJ / m 2 , The saturated water absorption rate is 10%.

Embodiment 3

[0017] Mix 12g 3,3'-dimethyl-4,4'-diaminodiphenylmethane with N,N'-bismaleimide-4,4'-diphenylmethane at a ratio of 2:1 (mole ratio) prepared oligomer and 10g N, after N`-dimethylacrylamide was stirred and dissolved, degassed under reduced pressure, poured into a mold made of glass plate, 60 The Co source was irradiated at room temperature until the dose reached 100KGy, and post-cured at 180°C for 6 hours after demolding to obtain an amber transparent plate.

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Abstract

A process for preparing the polyimide able to be cast includes such steps as preparing solution or slurry of the active solvent and bimaleimide oligomer, and polymerizing under radiating by 10-200 Kgy or under the triggering azodiisobutanenitrile or diphenylformyl peroxide.

Description

technical field [0001] The invention belongs to the preparation method of castable polyimide. Background technique [0002] As a kind of high temperature resistant polymer material, polyimide has been widely used in aviation, aerospace, various electrical insulation, machinery, separation membrane and microelectronics industries. However, such materials are usually processed by melting solutions or resin powders to make various products. For example, US Patent No. 6,025,460 in 2000 reported the preparation of fiber-reinforced composite material prepreg by high-temperature condensation reaction in polar solution N-methylpyrrolidone. In US Patent No. 4,640,972 in 1987, it was reported that polyimide fibers with high strength and high modulus were prepared by polyamic acid solution. The preparation of thin-layer parts from solution is beneficial to the volatilization of solvent in the solution to obtain products with excellent properties. In 2000, U.S. Patents 6,036,900 and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10
Inventor 王震丁孟贤邓鹏飏李青璇
Owner CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI