Display panel, display device and preparation method of display panel

Abstract

The invention relates to a display panel, a display device and a preparation method of the display panel, the display panel comprises an array substrate, a plurality of light emitting units, an isolation structure and a packaging layer, the plurality of light emitting units are arranged on the array substrate, the isolation structure is arranged on the array substrate and is used for spacing the light emitting units, and the packaging layer is used for packaging the light emitting units. The packaging layer comprises a first packaging layer arranged on the side, away from the array substrate, of the light-emitting unit, the orthographic projection of the light-emitting unit on the array substrate is located in the orthographic projection of the first packaging layer on the array substrate, and at least part, exceeding the light-emitting unit, of the first packaging layer is in lap joint between the light-emitting unit and the isolation structure. According to the embodiment of the invention, the packaging performance of the display panel can be improved, a better packaging effect is formed for the light-emitting unit, and the overall safety performance of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] Flat display panels such as Organic Light Emitting Display (OLED) panels and display panels using light emitting diode (LED) devices have the advantages of high image quality, power saving, thin body and wide application range. They are widely used in various consumer electronic products such as mobile phones, televisions, personal digital assistants, digital cameras, laptops, desktop computers, etc., becoming the mainstream in display devices.

[0003] However, the encapsulation layer of the display panel in the related art has insufficient performance, which easily causes the leakage of etching solution and eventually leads to damage of the light-emitting unit. Therefore, a new type of display panel is urgently needed. Summary of the invention

[0004] The embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel, which can improve the packaging performance of the display panel, form a better packaging effect for the light-emitting unit, and improve the overall safety performance of the display panel.

[0005] In a first aspect, according to an embodiment of the present application, a display panel is proposed, comprising an array substrate, a plurality of light-emitting units, an isolation structure and a packaging layer, wherein the plurality of light-emitting units are arranged on the array substrate, the isolation structure is arranged on the array substrate and separates the light-emitting units, the packaging layer comprises a first packaging layer arranged on a side of the light-emitting unit away from the array substrate, the orthographic projection of the light-emitting unit on the array substrate is located within the orthographic projection of the first packaging layer on the array substrate, and at least a portion of the first packaging layer that exceeds the light-emitting unit is overlapped between the light-emitting unit and the isolation structure.

[0006] According to one aspect of the embodiments of the present application, adjacent first encapsulation layers are spaced apart from each other.

[0007] According to one aspect of an embodiment of the present application, the light-emitting unit includes a first electrode, a light-emitting functional layer and a second electrode stacked in sequence in a direction away from the array substrate, and the encapsulation layer covers the second electrode and at least a portion of the layer extending beyond the second electrode overlaps the side of the array layer away from the substrate.

[0008] According to one aspect of the embodiment of the present application, the isolation structure is in direct contact with the array substrate and is provided with a plurality of isolation openings for accommodating the light-emitting units, and the encapsulation layer covers the second electrode and at least a portion exceeding the second electrode is directly overlapped on the array substrate;

[0009] Preferably, the first electrode includes a plurality of first electrode portions located on the array substrate, and the isolation structure is arranged between adjacent first electrode portions.

[0010] According to one aspect of the embodiment of the present application, the display panel includes a pixel defining layer disposed on an array layer, adjacent pixel defining layers are provided with a plurality of pixel openings, a light emitting unit is provided in the pixel openings, an isolation structure is provided on a side of the pixel defining layer away from the array layer, a first encapsulation layer covers a second electrode and at least a portion of the first encapsulation layer that exceeds the second electrode is overlapped on the pixel defining layer;

[0011] Preferably, the plurality of pixel openings correspond to the plurality of isolation openings one by one and are interconnected;

[0012] Preferably, the isolation structure is an integrated structure and has a first surface away from the array substrate and a second surface close to the array substrate, and in a cross section perpendicular to the array substrate, a size of the first surface is larger than a size of the second surface;

[0013] Preferably, the isolation structure includes a first isolation portion and a second isolation portion stacked in sequence in a direction close to the array substrate, the second isolation portion is in direct contact with the array substrate, and the orthographic projection of the second isolation portion on the array substrate is within the orthographic projection of the first isolation portion on the array substrate.

[0014] According to one aspect of an embodiment of the present application, the isolation structure includes a first isolation portion, a second isolation portion, and a third isolation portion stacked in sequence in a direction close to the array substrate, the first encapsulation layer covers the second electrode, and at least a portion of the first encapsulation layer that exceeds the second electrode overlaps the third isolation portion;

[0015] Preferably, the third isolation portion is in direct contact with the array substrate, the orthographic projection of the second isolation portion on the array substrate is located within the orthographic projection of the first isolation portion on the array substrate and within the orthographic projection of the third isolation portion on the array substrate, and the second electrode overlaps the third isolation portion.

[0016] According to one aspect of the embodiment of the present application, a portion of the encapsulation layer extending beyond the second electrode overlaps the third isolation portion and another portion overlaps the side wall of the second isolation portion;

[0017] Preferably, the first encapsulation layer is located below the first isolation portion and does not contact the first isolation portion, and an orthographic projection of a portion of the first encapsulation layer on the array substrate is located outside an orthographic projection of the first isolation portion on the array substrate;

[0018] Preferably, the first encapsulation layer extends from the side wall of the second isolation portion to cover the first isolation portion, and a portion of the first encapsulation layer overlaps the first isolation portion and is located on a side of the first isolation portion away from the second isolation portion.

[0019] According to one aspect of the embodiment of the present application, in a cross section of the display panel along its thickness direction, the height of the second isolation portion is 0.4-1.2 μm;

[0020] Preferably, in a cross section of the display panel along its own thickness direction, a ratio of a length of the first isolation portion exceeding the second isolation portion to a height of the second isolation portion is 1.5-3.0.

[0021] According to one aspect of the embodiment of the present application, in a cross section of the display panel along its thickness direction, the length of the third isolation portion exceeding the second isolation portion is 0.4-3.0 μm.

[0022] According to one aspect of an embodiment of the present application, the encapsulation layer includes a second encapsulation layer and a third encapsulation layer stacked with the first encapsulation layer, the first encapsulation layer covers the light-emitting unit and the second encapsulation layer is arranged between the first encapsulation layer and the third encapsulation layer, and at least a portion of the first encapsulation layer that exceeds the light-emitting unit is overlapped between the light-emitting unit and the isolation structure.

[0023] In the second aspect, according to an embodiment of the present application, a display panel is provided, comprising an array substrate, a plurality of light-emitting units, an isolation structure and a packaging layer, wherein the plurality of light-emitting units are arranged on the array substrate; the isolation structure is arranged on the array substrate and separates the light-emitting units, the isolation structure comprises a first isolation portion and a second isolation portion which are stacked in sequence from the direction close to the array substrate, the orthographic projection of the second isolation portion on the array substrate is located within the orthographic projection of the first isolation portion on the array substrate; the packaging layer comprises a first packaging layer which is arranged on the side of the light-emitting unit away from the array substrate, the orthographic projection of the light-emitting unit on the array substrate is located within the orthographic projection of the first packaging layer on the array substrate; wherein the first packaging layer comprises a first portion located below the first isolation portion, and the first portion of the first packaging layer does not contact the first isolation portion.

[0024] According to one aspect of the embodiments of the present application, an orthographic projection of at least part of the first portion of the first encapsulation layer on the array substrate is located outside an orthographic projection of the first isolation portion on the array substrate.

[0025] According to one aspect of the embodiments of the present application, the first encapsulation layer is overlapped on the array substrate between the isolation structure and the light-emitting unit.

[0026] According to one aspect of the embodiments of the present application, adjacent first encapsulation layers are spaced apart from each other.

[0027] According to one aspect of an embodiment of the present application, the light-emitting unit includes a first electrode, a light-emitting functional layer and a second electrode stacked in sequence in a direction away from the array substrate, and the encapsulation layer covers the second electrode and at least a portion of the layer extending beyond the second electrode overlaps the side of the array layer away from the substrate.

[0028] According to one aspect of the embodiment of the present application, the isolation structure is in direct contact with the array substrate and is provided with a plurality of isolation openings for accommodating the light-emitting units, and the encapsulation layer covers the second electrode and at least a portion exceeding the second electrode is directly overlapped on the array substrate;

[0029] Preferably, the first electrode includes a plurality of first electrode portions located on the array substrate, and the isolation structure is arranged between adjacent first electrode portions.

[0030] According to one aspect of the embodiment of the present application, the display panel includes a pixel defining layer disposed on an array layer, adjacent pixel defining layers are provided with a plurality of pixel openings, a light emitting unit is provided in the pixel openings, an isolation structure is provided on a side of the pixel defining layer away from the array layer, a first encapsulation layer covers a second electrode and at least a portion of the first encapsulation layer that exceeds the second electrode is overlapped on the pixel defining layer;

[0031] Preferably, the plurality of pixel openings correspond to the plurality of isolation openings one by one and are interconnected;

[0032] Preferably, the isolation structure is an integrated structure and has a first surface away from the array substrate and a second surface close to the array substrate, and in a cross section perpendicular to the array substrate, a size of the first surface is larger than a size of the second surface.

[0033] According to one aspect of an embodiment of the present application, the isolation structure includes a first isolation portion, a second isolation portion, and a third isolation portion stacked in sequence in a direction close to the array substrate, the first encapsulation layer covers the second electrode, and at least a portion of the first encapsulation layer that exceeds the second electrode overlaps the third isolation portion;

[0034] Preferably, the third isolation portion is in direct contact with the array substrate, the orthographic projection of the second isolation portion on the array substrate is located within the orthographic projection of the first isolation portion on the array substrate and within the orthographic projection of the third isolation portion on the array substrate, and the second electrode overlaps the third isolation portion.

[0035] According to one aspect of the embodiment of the present application, a portion of the encapsulation layer extending beyond the second electrode overlaps the third isolation portion and another portion overlaps the side wall of the second isolation portion;

[0036] Preferably, the first encapsulation layer is located below the first isolation portion and does not contact the first isolation portion, and an orthographic projection of a portion of the first encapsulation layer on the array substrate is located outside an orthographic projection of the first isolation portion on the array substrate;

[0037] Preferably, the first encapsulation layer extends from the side wall of the second isolation portion to cover the first isolation portion, and a portion of the first encapsulation layer overlaps the first isolation portion and is located on a side of the first isolation portion away from the second isolation portion.

[0038] According to one aspect of the embodiment of the present application, in a cross section of the display panel along its thickness direction, the height of the second isolation portion is 0.4-1.2 μm;

[0039] Preferably, in a cross section of the display panel along its own thickness direction, a ratio of a length of the first isolation portion exceeding the second isolation portion to a height of the second isolation portion is 1.5-3.0.

[0040] According to one aspect of the embodiment of the present application, in a cross section of the display panel along its thickness direction, the length of the third isolation portion exceeding the second isolation portion is 0.4-3.0 μm.

[0041] According to one aspect of an embodiment of the present application, the encapsulation layer includes a second encapsulation layer and a third encapsulation layer stacked with the first encapsulation layer, the first encapsulation layer covers the light-emitting unit and the second encapsulation layer is arranged between the first encapsulation layer and the third encapsulation layer, and at least a portion of the first encapsulation layer that exceeds the light-emitting unit is overlapped between the light-emitting unit and the isolation structure.

[0042] In a third aspect, according to an embodiment of the present application, a display device is provided, comprising the display panel as described above.

[0043] In a fourth aspect, according to an embodiment of the present application, a method for manufacturing a display panel is provided, comprising:

[0044] Providing a substrate, the substrate comprising a substrate and an array layer, the array layer is disposed on the substrate, and a first electrode and an isolation structure are formed on a side of the array layer away from the substrate;

[0045] The light-emitting functional layer is evaporated onto the first electrode by using the first evaporation angle, and the light-emitting functional layer is connected to the first electrode;

[0046] Adjusting to a second evaporation angle to evaporate a second electrode onto the light-emitting functional layer, the second electrode is connected to the light-emitting functional layer to form a light-emitting unit, wherein the second evaporation angle is greater than the first evaporation angle;

[0047] Depositing a first encapsulation layer on the light-emitting unit, the first encapsulation layer covers the light-emitting unit, and at least a portion of the first encapsulation layer that exceeds the light-emitting unit overlaps between the light-emitting unit and the isolation structure;

[0048] The above evaporation and deposition processes are repeated to form a plurality of light-emitting units.

[0049] The embodiments of the present application provide a display panel, a display device and a method for preparing a display panel, wherein a first encapsulation layer is arranged on a light-emitting unit so that the first encapsulation layer fully covers the light-emitting unit, and a portion of the edge of the first encapsulation layer that exceeds the light-emitting unit is fully overlapped between the light-emitting unit and the isolation structure, so that the first encapsulation layer and the film layer at its bottom are fully overlapped, thereby avoiding the formation of a gap between the first encapsulation layer and the overlapped film layer, preventing subsequent etching solution from entering the light-emitting unit through the gap and causing damage to the light-emitting unit, improving the encapsulation performance of the first encapsulation layer, improving the encapsulation capacity of the first encapsulation layer, forming better encapsulation protection for the light-emitting unit, improving the safety performance of the light-emitting unit, and providing reliable guarantee for the overall stable light emission of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] The features, advantages and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

[0051] Figure 1 is a schematic plan view of a display panel according to an embodiment of the present application;

[0052] Figure 2 is a schematic structural diagram of a display panel according to an embodiment of the present application;

[0053] Figure 3 is a schematic structural diagram of another display panel according to an embodiment of the present application;

[0054] Figure 4 is a structural schematic diagram of another display panel according to an embodiment of the present application;

[0055] Figure 5 is a structural schematic diagram of another display panel according to an embodiment of the present application;

[0056] Figure 6 is a structural schematic diagram of another display panel according to an embodiment of the present application;

[0057] Figure 7 is a structural schematic diagram of another display panel according to an embodiment of the present application;

[0058] Figure 8 is a structural schematic diagram of another display panel according to an embodiment of the present application;

[0059] Fig. 9 is a structural schematic diagram of another display panel according to an embodiment of the present application;

[0060] Fig.10 is a structural schematic diagram of another display panel according to an embodiment of the present application;

[0061] Fig.11 is a diagram of a manufacturing process of a display panel according to an embodiment of the present application;

[0062] Fig.12 is a diagram of a manufacturing process of a display panel according to an embodiment of the present application;

[0063] Fig.13 is a diagram of a manufacturing process of a display panel according to an embodiment of the present application;

[0064] Fig.14 is a diagram of a manufacturing process of a display panel according to an embodiment of the present application;

[0065] Fig.15 is a diagram of a manufacturing process of a display panel according to an embodiment of the present application;

[0066] Fig.16 This is a diagram of the preparation process of a display panel according to an embodiment of the present application.

[0067] Reference numerals:

[0068] 1-display device; 100-display panel; 10-substrate; 20-array layer; 30-light-emitting unit; 40-isolation structure; 50-first encapsulation layer; 60-pixel defining layer; 61-pixel opening;

[0069] 31-first electrode; 32-light-emitting functional layer; 33-second electrode;

[0070] 41-first isolating portion; 42-second isolating portion; 43-third isolating portion;

[0071] 51 - second packaging layer; 52 - third packaging layer; 70 - photoresist.

[0072] In the drawings, the same reference numerals are used for the same components. The drawings are not drawn to scale. DETAILED DESCRIPTION

[0073] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the known structures and technologies are not shown to avoid unnecessary ambiguity in the present application; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0074] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the display panel, display device and display panel manufacturing method of the present application. In the description of the present application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0075] In order to better understand this application, Figures 1 to 16 The display panel, the display device and the method for manufacturing the display panel according to the embodiments of the present application are described in detail.

[0076] See also Figure 1 and Figure 2 The embodiment of the present application proposes a display panel 100, including an array substrate, a plurality of light-emitting units 30, an isolation structure 40 and a first encapsulation layer 50, wherein the array substrate includes a stacked substrate 10 and an array layer 20, wherein the array layer 20 is disposed on the substrate 10, the plurality of light-emitting units 30 are disposed on a side of the array layer 20 away from the substrate 10, the plurality of light-emitting units 30 are arranged at intervals from each other, the isolation structure 40 is disposed on a side of the array layer 20 away from the substrate 10, the isolation structure 40 is disposed between adjacent light-emitting units 30, the first encapsulation layer 50 is disposed on a side of the light-emitting unit 30 away from the array layer 20, the orthographic projection of the light-emitting unit 30 on the substrate 10 is located within the orthographic projection of the first encapsulation layer 50, and at least a portion of the first encapsulation layer 50 that exceeds the light-emitting unit 30 is overlapped between the light-emitting unit 30 and the isolation structure 40.

[0077] In the above embodiment, the substrate 10 can be a rigid substrate 10 or a flexible substrate 10, and the array layer 20 is the driving circuit layer, which includes a plurality of driving circuits. The driving circuits include driving devices and signal lines, etc. The driving devices include transistors, capacitors, etc., which are not specifically limited in this application.

[0078] It is understandable that the light emitting units 30 may be arranged in an array on the display panel 100 , and the light emitting units 30 may be red sub-pixels, green sub-pixels and blue sub-pixels, which emit red, green and blue (RGB) light and mix them to form a color display.

[0079] Each light-emitting unit 30 may include a first electrode 31, a light-emitting functional layer 32, and a second electrode 33. Optionally, the first electrode 31 is an anode, and the second electrode 33 is a cathode. The light-emitting functional layer 32 may use an organic light-emitting material to form different colors of light. The first electrode 31 injects transport holes into the middle light-emitting functional layer 32, and the second electrode 33 injects transport electrons into the light-emitting functional layer 32. After the holes and electrons combine to form excitons in the light-emitting functional layer 32, the organic light-emitting material emits light to obtain different colors of light.

[0080] Specifically, the first electrode 31 is arranged on the array layer 20, the light-emitting functional layer 32 is arranged on the side of the first electrode 31 away from the array layer 20, and the second electrode 33 is arranged on the side of the light-emitting functional layer 32 away from the first electrode 31. The first electrode 31 is specifically formed on the side of the array layer 20 away from the substrate 10, and is electrically connected to the driving circuit in the array layer 20.

[0081] In the above embodiment, the light-emitting units 30 of different colors can be prepared separately and independently of each other by providing the isolation structure 40. Specifically, the continuous arrangement of the light-emitting functional layer 32 between adjacent light-emitting units 30 will cause lateral crosstalk, causing the adjacent light-emitting units 30 to emit light by mistake, etc., affecting the display quality. By independently arranging each light-emitting unit 30, the problem of lateral crosstalk between adjacent light-emitting units 30 can be improved, thereby improving the display quality of the display panel 100.

[0082] Since the isolation structure 40 is disposed on the array layer 20, when the light-emitting functional layer 32 and the second electrode 33 are evaporated, the light-emitting functional layer 32 is separated at the isolation structure 40, so that the adjacent light-emitting units 30 are independent of each other to avoid crosstalk. Optionally, the second electrode 33 can overlap with the isolation structure 40, so that the second electrode 33 forms a whole layer structure. Of course, the second electrode 33 may not overlap with the isolation structure 40, so that the second electrodes 33 are independent of each other.

[0083] When the display panel 100 includes the isolation structure 40, the light-emitting unit 30 of each color can be prepared as a whole layer first and then patterned, thereby omitting the use of a mask plate to reduce costs. The light-emitting units 30 of different colors are prepared in different orders. During the patterning process of the light-emitting units 30 prepared later, the isolation structure 40 can be used for isolation, thereby improving the yield of the patterning process and reducing the impact of patterning on the yield of the light-emitting units 30.

[0084] Optionally, the isolation structure 40 is a columnar structure. The isolation structure 40 in this embodiment serves to isolate the second electrode 33 and the light-emitting functional layer 32 , thereby eliminating the need for a fine mask and preventing crosstalk between adjacent color lights.

[0085] Optionally, the cross-sectional shape of the isolation structure 40 along the thickness direction of the display panel 100 is a regular trapezoid or an inverted trapezoid, and can be patterned according to a specific deposition and etching process. The isolation structure 40 can be a composite metal titanium-aluminum-titanium (Ti / Al / Ti) structure or a titanium-aluminum-molybdenum (Ti / Al / Mo) structure, or it can be an insulating material. The present application does not specifically limit the specific shape and material of the isolation structure 40.

[0086] The first encapsulation layer 50 is disposed on the second electrode 33 , and the first encapsulation layer 50 can form isolation protection for the second electrode 33 and the light-emitting functional layer 32 , thereby preventing water vapor in the external environment from entering into the screen body and causing adverse effects.

[0087] Considering the overall light transmittance of the display panel 100, the first encapsulation layer 50 needs to adopt a light-transmitting film layer, which can be an inorganic material layer. The specific material can be silicon nitride and other materials. The first encapsulation layer 50 is deposited on the second electrode 33 through a chemical vapor deposition (CVD) process to form a protection.

[0088] In this embodiment, the insufficient encapsulation performance of the first encapsulation layer 50 is taken into consideration, and thus the orthographic projection of the light-emitting unit 30 on the substrate 10 is located within the orthographic projection of the first encapsulation layer 50, so that the first encapsulation layer 50 fully covers the light-emitting unit 30, and at the same time, the excess portion of the first encapsulation layer 50 is overlapped between the light-emitting unit 30 and the isolation structure 40, thereby avoiding the first encapsulation layer 50 overlapping the side wall of the isolation structure 40 to form a gap, resulting in poor encapsulation overlap, and allowing the excess portion of the first encapsulation layer 50 to fully overlap with the film layer at its bottom.

[0089] Optionally, adjacent first encapsulation layers 50 are spaced apart from each other, and a corresponding first encapsulation layer 50 is arranged on each light-emitting unit 30. The first encapsulation layer 50 is an independent encapsulation structure arranged corresponding to each light-emitting unit 30. Adjacent light-emitting units 30 are spaced apart from each other under the action of the isolation structure 40, and their corresponding first encapsulation layers 50 also form partitions at the isolation structure 40, so that adjacent first encapsulation layers 50 do not contact each other, and the first encapsulation layer 50 is a discontinuous encapsulation structure.

[0090] The present application does not impose any special limitation on the position of the film layer where the first encapsulation layer 50 fully overlaps. It is sufficient to ensure that the first encapsulation layer 50 fully overlaps the film layer at its bottom to prevent the occurrence of encapsulation gaps.

[0091] The embodiment of the present application provides a display panel 100, which provides a first encapsulation layer 50 on the light-emitting unit 30 so that the first encapsulation layer 50 fully covers the light-emitting unit 30, and fully overlaps the edge of the first encapsulation layer 50 that exceeds the light-emitting unit 30 to between the light-emitting unit 30 and the isolation structure 40, so that the first encapsulation layer 50 and the film layer at its bottom are fully overlapped, thereby avoiding the formation of a gap between the first encapsulation layer 50 and the overlapping film layer, preventing subsequent etching solution from entering the light-emitting unit 30 through the gap and causing damage to the light-emitting unit 30, improving the encapsulation performance of the first encapsulation layer 50, improving the encapsulation capacity of the first encapsulation layer 50, forming better encapsulation protection for the light-emitting unit 30, improving the safety performance of the light-emitting unit 30, and providing reliable guarantee for the overall stable light emission of the display panel 100.

[0092] As an optional embodiment, the light-emitting unit 30 includes a first electrode 31, a light-emitting functional layer 32 and a second electrode 33 which are stacked in sequence, the second electrode 33 is located on the side of the light-emitting functional layer 32 away from the first electrode 31, and the first encapsulation layer 50 covers the second electrode 33 and extends beyond at least a portion of the second electrode 33 and overlaps the side of the array layer 20 away from the substrate 10.

[0093] Optionally, the specific position of the first packaging layer 50 is deposited on the second electrode 33. After forming, the first packaging layer 50 can be overlapped on any film layer on the array layer 20 to form a sufficiently reliable overlap with the film layer, thereby avoiding forming a package only by overlapping the side wall of the isolation structure 40, resulting in poor packaging.

[0094] The embodiment of the present application provides a display panel 100, which overlaps the portion of the first packaging layer 50 that exceeds the light-emitting unit 30 onto the array layer 20, thereby providing the first packaging layer 50 with a variety of overlapping positions at different thicknesses, forming a more sufficient overlap and providing more possibilities for a reliable packaging effect.

[0095] As an alternative embodiment, see Figure 2 The isolation structure 40 is directly disposed on the array layer 20 and is spaced apart from the light emitting unit 30 . The first encapsulation layer 50 is disposed to cover the second electrode 33 and at least a portion exceeding the second electrode 33 overlaps the array layer 20 .

[0096] In this embodiment, the isolation structure 40 is directly disposed on the array layer 20. The isolation function of the isolation structure 40 is utilized to define different light-emitting units 30. Adjacent light-emitting units 30 are spaced apart from each other by the isolation structure 40 without interfering with each other. The second electrodes 33 are independent of each other, and a cathode potential can be provided to each second electrode 33 individually to turn on the cathode signal.

[0097] At this time, the light-emitting unit 30 is encapsulated, and the portion of the first encapsulation layer 50 that exceeds the light-emitting unit 30 directly overlaps with the array layer 20. The light-emitting unit 30 is reliably encapsulated by utilizing the overlapping portion of the first encapsulation layer 50 and the array layer 20 to provide safety protection for the light-emitting unit 30.

[0098] The embodiment of the present application provides a display panel 100, which uses an isolation structure 40 to define a plurality of light-emitting units 30, separates adjacent light-emitting units 30, and avoids crosstalk. At the same time, the first packaging layer 50 is directly overlapped with the array layer 20, and sufficient contact is formed between the two to form a reliable overlap, thereby providing better packaging protection for the light-emitting units 30 and having a better packaging effect.

[0099] As an alternative embodiment, see Figure 3 The display panel 100 includes a pixel defining layer 60 disposed on the array layer 20, adjacent pixel defining layers 60 enclose a pixel opening 61, the light emitting unit 30 is disposed in the pixel opening 61, the isolation structure 40 is disposed on a side of the pixel defining layer 60 away from the array layer 20 and is spaced apart from the light emitting unit 30, and the first encapsulation layer 50 is disposed to cover the second electrode 33 and at least a portion exceeding the second electrode 33 overlaps the pixel defining layer 60.

[0100] Optionally, the display panel 100 further includes a pixel defining layer 60 and a plurality of pixel openings 61 enclosed therein, the pixel defining layer 60 constitutes the pixel opening 61 , the light emitting unit 30 is disposed in the pixel opening 61 , and the pixel opening 61 is disposed corresponding to the first electrode 31 .

[0101] Optionally, a plurality of pixel openings 61 correspond to isolation openings formed by a plurality of isolation structures 40 in a one-to-one manner and are interconnected.

[0102] Specifically, the pixel defining layer 60 is deposited on the first electrode 31, and the pixel opening 61 is formed by etching the corresponding position of the first electrode 31, so that part of the first electrode 31 is exposed in the pixel opening 61, and the pixel defining layer 60 only covers the edge of the first electrode 31, and the light-emitting functional layer 32 is deposited in the pixel opening 61 to form a connection with the first electrode 31. After etching, the pixel defining layer 60 covers the edge of the first electrode 31, forming an isolation protection for the first electrode 31 to prevent the influence of the external water and oxygen environment. Then, the second electrode 33 is deposited on the light-emitting functional layer 32, and the whole constitutes the light-emitting unit 30.

[0103] In this embodiment, the isolation structure 40 is arranged on the pixel defining layer 60 and isolates the adjacent light-emitting units 30. At this time, the second electrode 33 of each light-emitting unit 30 is disconnected at the isolation structure 40. As an independent structure, the cathode potential can be provided to the second electrode 33 separately to realize the conduction of the cathode signal.

[0104] When the second electrode 33 is encapsulated by the first encapsulation layer 50, in order to fully cover the light-emitting unit 30, the first encapsulation layer 50 can be directly overlapped on the pixel defining layer 60 between the light-emitting unit 30 and the isolation structure 40, so that the first encapsulation layer 50 is in direct contact with the pixel defining layer 60 to encapsulate the light-emitting unit 30.

[0105] Alternatively, if Figure 4 As shown, the isolation structure 40 can be an integrated structure and has a first surface away from the array substrate and a second surface close to the array substrate, and in a cross section perpendicular to the array substrate, the size of the first surface is larger than the size of the second surface. In other words, the isolation structure 40 forms an inverted trapezoidal structure in the above cross section.

[0106] During the process of vapor deposition forming the light-emitting functional layer 32, the inverted trapezoidal structure of the isolation structure 40 can also isolate the light-emitting functional layer 32, and use its relatively long first surface to isolate the light-emitting functional layer 32 to avoid crosstalk between adjacent light-emitting units 30. At this time, under the action of the isolation structure 40, the second electrode 33 is affected by the isolation of the first surface and can not form an overlap with the isolation structure 40. Each second electrode 33 can be provided with a VSS cathode potential through an independent metal structure. After deposition, the first packaging layer 50 is overlapped to the pixel defining layer 60 between the second electrode 33 and the isolation structure 40, thereby forming a stable and reliable overlap there, providing better packaging protection for the light-emitting unit 30.

[0107] The embodiment of the present application provides a display panel 100, by setting a pixel defining layer 60 and using the pixel defining layer 60 to enclose a pixel opening 61, the isolation structure 40 is set on the pixel defining layer 60, and the first encapsulation layer 50 can directly contact the pixel defining layer 60 to better encapsulate the light-emitting unit 30, have a better encapsulation effect, improve the safety performance of the light-emitting unit 30, and prevent the entry of etching solution.

[0108] As an alternative embodiment, see Figure 5 and Figure 6 The isolation structure 40 includes a first isolation portion 41, a second isolation portion 42 and a third isolation portion 43 which are stacked, the second isolation portion 42 is located between the first isolation portion 41 and the third isolation portion 43 and the third isolation portion 43 is arranged on the array layer 20, the orthographic projection of the second isolation portion 42 on the substrate 10 is located within the orthographic projections of the first isolation portion 41 and the third isolation portion 43, the second electrode 33 overlaps the third isolation portion 43, and the first encapsulation layer 50 covers the second electrode 33 and overlaps the third isolation portion 43 beyond at least a portion of the second electrode 33.

[0109] Optionally, the isolation structure 40 is a three-layer composite structure, wherein the second isolation portion 42 is arranged between the first isolation portion 41 and the third isolation portion 43 and has a smaller length than the first isolation portion 41 and the third isolation portion 43. The isolation structure 40 isolates the evaporation of the light-emitting functional layer 32 and the second electrode 33 through the first isolation portion 41, so that adjacent light-emitting units 30 are separated to avoid mutual crosstalk.

[0110] Optionally, the first isolation portion 41 can be made of metal titanium, the second isolation portion 42 can be made of metal aluminum, and the third isolation portion 43 can be made of metal molybdenum. In this embodiment, the second electrode 33 in each light-emitting unit 30 is overlapped with the adjacent isolation structure 40, and the second electrodes 33 of adjacent light-emitting units 30 are connected and conducted by utilizing the conductive properties of the isolation structure 40, so that the second electrodes 33 form a continuous whole layer structure, which can provide a cathode potential for the entire layer of the second electrode 33 and conduct it.

[0111] Specifically, each second electrode 33 is overlapped onto the third isolation portion 43 of the isolation structure 40 to achieve conduction between adjacent second electrodes 33. When the first encapsulation layer 50 is used for encapsulation, the first encapsulation layer 50 fully covers the light-emitting unit 30 and forms direct contact with the third isolation portion 43, thereby achieving sufficient overlap of the first encapsulation layer 50 and ensuring the encapsulation effect of the first encapsulation layer 50.

[0112] The embodiment of the present application provides a display panel 100, mainly considering that when the first encapsulation layer 50 overlaps with the second isolation portion 42, a gap will be formed between the side wall of the second isolation portion 42, resulting in poor encapsulation. Therefore, in this embodiment, the first encapsulation layer 50 is overlapped with the third isolation portion 43 to make the two directly contact, thereby improving the encapsulation effect. On the basis of utilizing the third isolation portion 43 to conduct the second electrode 33, a reliable overlapping position can be provided for the first encapsulation layer 50, thereby improving the performance of the first encapsulation layer 50.

[0113] As an alternative embodiment, see Figure 7 A portion of the first encapsulation layer 50 extending beyond the second electrode 33 overlaps the third isolation portion 43 and another portion overlaps the side wall of the second isolation portion 42 .

[0114] Considering the actual deposition process, a portion of the first encapsulation layer 50 covers the light-emitting unit 30 and overlaps with the third isolation portion 43 , while another portion of the first encapsulation layer 50 is evaporated onto the side wall of the second isolation portion 42 and also forms direct contact with the second isolation portion 42 .

[0115] Optionally, the first encapsulation layer 50 is located below the first isolation portion 41 and does not contact the first isolation portion 41 , and an orthographic projection of a portion of the first encapsulation layer 50 on the array substrate is located outside the orthographic projection of the first isolation portion 41 on the array substrate.

[0116] That is to say, after the first encapsulation layer 50 is evaporated, it is no longer necessary to climb along the side wall of the second isolation portion 42 to the first isolation portion 41, but only overlaps the side wall of the second isolation portion 42 of the isolation structure 40 and the third isolation portion 43. The part that overlaps the third isolation portion 43 mainly plays a reliable encapsulation effect.

[0117] See also Figure 8 Optionally, the first encapsulation layer 50 extends from the side wall of the second isolation portion 42 to cover the first isolation portion 41 , and a portion of the first encapsulation layer 50 overlaps the first isolation portion 41 and is located on a side of the first isolation portion 41 away from the second isolation portion 42 .

[0118] Since the first packaging layer 50 is partially blocked by the first isolation portion 41 during the deposition process, and in order to achieve a more reliable packaging effect, the first packaging layer 50 can continue to climb along the side wall of the second isolation portion 42 to the first isolation portion 41. The first packaging layer 50 covers a portion of the bottom surface of the first isolation portion 41 and is deposited to the top surface of the first isolation portion 41, so that a more sufficient overlap is formed between the first packaging layer 50 and the isolation structure 40, and there is a larger contact area between the two. At the same time, this structure is more in line with the actual structure after the first packaging layer 50 is deposited.

[0119] The embodiment of the present application provides a display panel 100, which increases the contact area between the first encapsulation layer 50 and the isolation structure 40 by disposing the first encapsulation layer 50 on the second isolation portion 42 and the third isolation portion 43, further achieves sufficient coverage of the light-emitting unit 30, improves the overall encapsulation effect, and has better encapsulation capability.

[0120] As an alternative embodiment, see Fig. 9 In the cross section of the display panel 100 along its thickness direction, the height of the second isolation portion 42 is 0.4-1.2 μm; the ratio of the length M of the first isolation portion 41 exceeding the second isolation portion 42 to the height of the second isolation portion 42 is 1.5-3.0, and the length N of the third isolation portion 43 exceeding the second isolation portion 42 is 0.4-3.0 μm.

[0121] The embodiment of the present application provides a display panel 100, which controls the length of the first isolation portion 41 to form an evaporation partition for the light-emitting functional layer 32 and the second electrode 33, while ensuring the deposition effect of the first encapsulation layer 50, so that the first encapsulation layer 50 can more fully cover the light-emitting unit 30. At the same time, by appropriately reducing the length of the second isolation portion 42 and increasing the length of the third isolation portion 43 exceeding the second isolation portion 42, the first encapsulation layer 50 can form a more complete contact with the third isolation portion 43, increase the contact area between the two, have better overlapping stability, and improve the encapsulation capacity of the first encapsulation layer 50.

[0122] As an alternative embodiment, see Fig.10 The encapsulation layer includes a second encapsulation layer 51 and a third encapsulation layer 52 stacked with the first encapsulation layer 50, the first encapsulation layer 50 is arranged to cover the light-emitting unit 30 and the second encapsulation layer 51 is arranged between the first encapsulation layer 50 and the third encapsulation layer 52, and at least a portion of the first encapsulation layer 50 that exceeds the light-emitting unit 30 is overlapped between the light-emitting unit 30 and the isolation structure 40.

[0123] Optionally, the encapsulation layer can be a three-layer stacked structure, in which a first encapsulation layer 50, a second encapsulation layer 51 and a third encapsulation layer 52 are stacked in sequence on the light-emitting unit 30, wherein the first encapsulation layer 50 and the third encapsulation layer 52 can be inorganic materials and are formed by a chemical vapor deposition process, and the second encapsulation layer 51 can be made of organic materials and is formed by inkjet printing. The present application does not make any special limitation on the specific structure of the encapsulation layer, and any structure that can achieve the encapsulation effect is acceptable.

[0124] The embodiment of the present application provides a display panel 100, which further improves the encapsulation performance of the encapsulation layer by setting the encapsulation layer to a three-layer stacked structure, forms better encapsulation protection for the light-emitting unit 30, and improves the overall safety performance.

[0125] The embodiment of the present application also provides a display panel 100, including an array substrate, a plurality of light-emitting units 30, an isolation structure 40 and an encapsulation layer, wherein the plurality of light-emitting units 30 are arranged on the array substrate; the isolation structure 40 is arranged on the array substrate and separates the light-emitting units 30, the isolation structure 40 includes a first isolation portion 41 and a second isolation portion 42 which are stacked in sequence from the direction close to the array substrate, and the orthographic projection of the second isolation portion 42 on the array substrate is located within the orthographic projection of the first isolation portion 41 on the array substrate; the encapsulation layer includes a first encapsulation layer 50 which is arranged on the side of the light-emitting unit 30 away from the array substrate, and the orthographic projection of the light-emitting unit 30 on the array substrate is located within the orthographic projection of the first encapsulation layer 50 on the array substrate; wherein the first encapsulation layer 50 includes a first portion located below the first isolation portion 41, and the first portion of the first encapsulation layer 50 is not in contact with the first isolation portion 41.

[0126] On the display panel provided in the present embodiment, the first portion of the deposited first encapsulation layer 50 is located below the first isolation portion 41. At this time, the first portion does not contact the first isolation portion 41, which is different from the existing structure in which the first encapsulation layer 50 is overlapped to the side wall of the second isolation portion 42 and the top of the first isolation portion 41, which easily forms a gap between the first encapsulation layer 50 and the first isolation portion 41 and the second isolation portion 42, causing poor encapsulation. Therefore, in the present embodiment, a reliable overlap is formed between the first portion of the first encapsulation layer 50 and the film layer below the first isolation portion 41 to form better encapsulation protection for the light-emitting unit 30.

[0127] On this basis, optionally, the orthographic projection of at least part of the first part of the first encapsulation layer 50 on the array substrate is located outside the orthographic projection of the first isolation portion 41 on the array substrate. At this time, the first part of the first encapsulation layer 50 is not only deposited below the first isolation portion 41, but is also shielded by the first isolation portion 41 during the deposition process, so that the first part of the first encapsulation layer 50 is spaced apart from the isolation structure 40, thereby preventing the first encapsulation layer 50 from being affected by the isolation structure 40 to cause a gap between the two, resulting in poor encapsulation. The main purpose of this embodiment is to use the first part of the first encapsulation layer 50 to form a reliable overlap with the film layer between the isolation structure 40 and the light-emitting unit 30, thereby overcoming the influence of the above-mentioned gap on the encapsulation and having a better encapsulation effect on the light-emitting unit 30.

[0128] The embodiment of the present application provides a display device 1, comprising the display panel 100 as described above.

[0129] See also Fig.11 , the present application embodiment provides a method for preparing a display panel 100, comprising:

[0130] S1, providing a substrate, the substrate comprising a substrate 10 and an array layer 20, the array layer 20 is disposed on the substrate 10, and a first electrode 31 and an isolation structure 40 are formed on a side of the array layer 20 away from the substrate 10;

[0131] S2, evaporating the light-emitting functional layer 32 onto the first electrode 31 using a first evaporation angle, so that the light-emitting functional layer 32 is connected to the first electrode 31;

[0132] S3, adjusting to a second evaporation angle to evaporate the second electrode 33 onto the light-emitting functional layer 32, the second electrode 33 is connected to the light-emitting functional layer 32 to form a light-emitting unit 30, wherein the second evaporation angle is greater than the first evaporation angle;

[0133] S4, depositing a first encapsulation layer 50 on the light-emitting unit 30, wherein the first encapsulation layer 50 covers the light-emitting unit 30, and at least a portion of the first encapsulation layer 50 that exceeds the light-emitting unit 30 overlaps between the light-emitting unit 30 and the isolation structure 40;

[0134] S5 , repeating the above evaporation and deposition process to form a plurality of light-emitting units 30 .

[0135] See also Fig.12 and Fig.13 In steps S2 and S3, the light-emitting functional layer 32 is evaporated at a first evaporation angle to connect it to the first electrode 31, and then the angle is increased to a second evaporation angle, and the second electrode 33 is evaporated at the second evaporation angle, so that the second electrode 33 can completely cover the light-emitting functional layer 32 to form a connection, and finally form a complete light-emitting unit 30.

[0136] In step S4, if Fig.14 As shown, the first encapsulation layer 50 is deposited onto the second electrode 33 by a chemical vapor deposition process to form encapsulation protection for the light-emitting unit 30 as a whole, wherein at least a portion of the first encapsulation layer 50 is deposited between the light-emitting unit 30 and the isolation structure 40 to form an overlap, which has better encapsulation protection performance and prevents the etching solution in the subsequent step S5 from corroding and damaging the light-emitting unit 30.

[0137] In step S5, Fig.15 and Fig.16 As shown, photoresist 70 is continuously coated on the first encapsulation layer 50, the display panel 100 is exposed and developed, the film layer in a portion of the pixel openings 61 is removed by photolithography, and then the remaining photoresist 70 is peeled off and the above-mentioned evaporation process is repeated, thereby forming light-emitting units 30 of different colors in adjacent pixel openings 61 to meet a variety of different display requirements and obtain the final display panel 100.

[0138] The embodiments of the present application provide a display panel, a display device and a method for preparing a display panel, wherein a first encapsulation layer is arranged on a light-emitting unit so that the first encapsulation layer fully covers the light-emitting unit, and a portion of the edge of the first encapsulation layer that exceeds the light-emitting unit is fully overlapped between the light-emitting unit and the isolation structure, so that the first encapsulation layer and the film layer at its bottom are fully overlapped, thereby avoiding the formation of a gap between the first encapsulation layer and the overlapped film layer, preventing subsequent etching solution from entering the light-emitting unit through the gap and causing damage to the light-emitting unit, improving the encapsulation performance of the first encapsulation layer, improving the encapsulation capacity of the first encapsulation layer, forming better encapsulation protection for the light-emitting unit, improving the safety performance of the light-emitting unit, and providing reliable guarantee for the overall stable light emission of the display panel.

[0139] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that: include: An array substrate; A plurality of light emitting units are arranged on the array substrate; An isolation structure, disposed on the array substrate and separating the light-emitting units; The encapsulation layer includes a first encapsulation layer arranged on the side of the light-emitting unit away from the array substrate, the orthographic projection of the light-emitting unit on the array substrate is located within the orthographic projection of the first encapsulation layer on the array substrate, and at least a portion of the first encapsulation layer extending beyond the light-emitting unit is located between the light-emitting unit and the isolation structure.

2. The display panel according to claim 1, characterized in that: Adjacent first encapsulation layers are arranged at intervals from each other.

3. The display panel according to claim 1, characterized in that: The light-emitting unit includes a first electrode, a light-emitting functional layer and a second electrode which are stacked in sequence in a direction away from the array substrate. The first packaging layer covers the second electrode and at least a portion of the first packaging layer that exceeds the second electrode overlaps a side of the array substrate close to the light-emitting unit.

4. The display panel according to claim 3, characterized in that: The isolation structure is in direct contact with the array substrate and is provided with a plurality of isolation openings for accommodating the light-emitting units, and the first encapsulation layer covers the second electrode and at least a portion exceeding the second electrode is directly overlapped on the array substrate; Preferably, the first electrode includes a plurality of first electrode portions located on the array substrate, and the isolation structure is arranged between adjacent first electrode portions.

5. The display panel according to claim 3, characterized in that: The display panel comprises a pixel defining layer disposed on the array substrate, the pixel defining layer is provided with a plurality of pixel openings, the light emitting unit is disposed in the pixel openings, the isolation structure is disposed on a side of the pixel defining layer away from the array substrate, the first encapsulation layer covers the second electrode, and at least a portion of the first encapsulation layer that exceeds the second electrode is overlapped on the pixel defining layer; Preferably, the plurality of pixel openings correspond to the plurality of isolation openings one by one and are interconnected; Preferably, the isolation structure is an integrated structure and has a first surface away from the array substrate and a second surface close to the array substrate, and in a cross section perpendicular to the array substrate, a size of the first surface is larger than a size of the second surface; Preferably, the isolation structure includes a first isolation portion and a second isolation portion which are stacked in sequence along a direction close to the array substrate, the second isolation portion is in direct contact with the array substrate, and the orthographic projection of the second isolation portion on the array substrate is within the orthographic projection of the first isolation portion on the array substrate.

6. The display panel according to claim 3, characterized in that: The isolation structure comprises a first isolation portion, a second isolation portion and a third isolation portion which are sequentially stacked in a direction close to the array substrate, the first encapsulation layer covers the second electrode and at least a portion of the first encapsulation layer which exceeds the second electrode overlaps the third isolation portion; Preferably, the third isolation portion is in direct contact with the array substrate, the orthographic projection of the second isolation portion on the array substrate is located within the orthographic projection of the first isolation portion on the array substrate and within the orthographic projection of the third isolation portion on the array substrate, and the second electrode overlaps the third isolation portion.

7. The display panel according to claim 6, characterized in that: A portion of the first encapsulation layer extending beyond the second electrode overlaps the third isolation portion and another portion overlaps the side wall of the second isolation portion; Preferably, the first encapsulation layer is located below the first isolation portion and does not contact the first isolation portion, and the orthographic projection of a portion of the first encapsulation layer on the array substrate is located outside the orthographic projection of the first isolation portion on the array substrate; Preferably, the first encapsulation layer extends from the side wall of the second isolation portion to cover the first isolation portion, and a portion of the first encapsulation layer overlaps the first isolation portion and is located on a side of the first isolation portion away from the second isolation portion.

8. The display panel according to claim 6, characterized in that: In a cross section of the display panel along its thickness direction, the height of the second isolation portion is 0.4-1.2 μm; Preferably, in a cross section of the display panel along its own thickness direction, a ratio of a length of the first isolation portion exceeding the second isolation portion to a height of the second isolation portion is 1.5-3.

0.

9. The display panel according to claim 6, characterized in that: In a cross section of the display panel along its thickness direction, the length of the third isolation portion exceeding the second isolation portion is 0.4-3.0 μm.

10. The display panel according to claim 1, characterized in that: The encapsulation layer includes a second encapsulation layer and a third encapsulation layer stacked with the first encapsulation layer, the first encapsulation layer covers the light-emitting unit and the second encapsulation layer is arranged between the first encapsulation layer and the third encapsulation layer, and at least a portion of the first encapsulation layer that exceeds the light-emitting unit overlaps between the light-emitting unit and the isolation structure.

11. A display panel, characterized in that: include: An array substrate; A plurality of light emitting units are arranged on the array substrate; an isolation structure, disposed on the array substrate and separating the light-emitting units, the isolation structure comprising a first isolation portion and a second isolation portion stacked in sequence from a direction close to the array substrate, the orthographic projection of the second isolation portion on the array substrate being located within the orthographic projection of the first isolation portion on the array substrate; The encapsulation layer comprises a first encapsulation layer disposed on a side of the light emitting unit away from the array substrate, wherein the orthographic projection of the light emitting unit on the array substrate is located within the orthographic projection of the first encapsulation layer on the array substrate; The first encapsulation layer includes a first portion located below the first isolation portion, and the first portion of the first encapsulation layer is not in contact with the first isolation portion.

12. The display panel according to claim 11, characterized in that: An orthographic projection of at least part of the first portion of the first encapsulation layer on the array substrate is located outside an orthographic projection of the first isolation portion on the array substrate.

13. The display panel according to claim 11, characterized in that: The first portion of the first encapsulation layer is overlapped on the array substrate between the isolation structure and the light emitting unit.

14. The display panel according to claim 11, characterized in that: Adjacent first encapsulation layers are arranged at intervals from each other.

15. The display panel according to claim 11, characterized in that: The light-emitting unit includes a first electrode, a light-emitting functional layer and a second electrode which are stacked in sequence in a direction away from the array substrate. The first packaging layer covers the second electrode and at least a portion of the first packaging layer that exceeds the second electrode overlaps a side of the array substrate close to the light-emitting unit.

16. The display panel according to claim 15, characterized in that: The isolation structure is in direct contact with the array substrate and is provided with a plurality of isolation openings for accommodating the light-emitting units, and the first encapsulation layer covers the second electrode and at least a portion exceeding the second electrode is directly overlapped on the array substrate; Preferably, the first electrode includes a plurality of first electrode portions located on the array substrate, and the isolation structure is arranged between adjacent first electrode portions.

17. The display panel according to claim 15, characterized in that: The display panel comprises a pixel defining layer disposed on the array substrate, the pixel defining layer is provided with a plurality of pixel openings, the light emitting unit is disposed in the pixel openings, the isolation structure is disposed on a side of the pixel defining layer away from the array substrate, the first encapsulation layer covers the second electrode, and at least a portion of the first encapsulation layer that exceeds the second electrode is overlapped on the pixel defining layer; Preferably, the plurality of pixel openings correspond to the plurality of isolation openings one by one and are interconnected; Preferably, the isolation structure is an integrated structure and has a first surface away from the array substrate and a second surface close to the array substrate, and in a cross section perpendicular to the array substrate, a size of the first surface is larger than a size of the second surface.

18. The display panel according to claim 15, characterized in that: The isolation structure comprises a first isolation portion, a second isolation portion and a third isolation portion which are sequentially stacked in a direction close to the array substrate, the first encapsulation layer covers the second electrode and at least a portion of the first encapsulation layer which exceeds the second electrode overlaps the third isolation portion; Preferably, the third isolation portion is in direct contact with the array substrate, the orthographic projection of the second isolation portion on the array substrate is located within the orthographic projection of the first isolation portion on the array substrate and within the orthographic projection of the third isolation portion on the array substrate, and the second electrode overlaps the third isolation portion.

19. The display panel according to claim 18, characterized in that: A portion of the first encapsulation layer extending beyond the second electrode overlaps the third isolation portion and another portion overlaps the side wall of the second isolation portion; Preferably, the first encapsulation layer is located below the first isolation portion and does not contact the first isolation portion, and the orthographic projection of a portion of the first encapsulation layer on the array substrate is located outside the orthographic projection of the first isolation portion on the array substrate; Preferably, the first encapsulation layer extends from the side wall of the second isolation portion to cover the first isolation portion, and a portion of the first encapsulation layer overlaps the first isolation portion and is located on a side of the first isolation portion away from the second isolation portion.

20. The display panel according to claim 18, characterized in that: In a cross section of the display panel along its thickness direction, the height of the second isolation portion is 0.4-1.2 μm; Preferably, in a cross section of the display panel along its own thickness direction, a ratio of a length of the first isolation portion exceeding the second isolation portion to a height of the second isolation portion is 1.5-3.

0.

21. The display panel according to claim 18, characterized in that: In a cross section of the display panel along its thickness direction, the length of the third isolation portion exceeding the second isolation portion is 0.4-3.0 μm.

22. A method for preparing a display panel, characterized in that: include: Providing a substrate, the substrate comprising a substrate and an array layer, the array layer being disposed on the substrate, and a first electrode and an isolation structure being formed on a side of the array layer away from the substrate; Using a first evaporation angle to evaporate a light-emitting functional layer onto the first electrode, wherein the light-emitting functional layer is connected to the first electrode; Adjusting to a second evaporation angle to evaporate a second electrode onto the light-emitting functional layer, the second electrode is connected to the light-emitting functional layer to form a light-emitting unit, wherein the second evaporation angle is greater than the first evaporation angle; Depositing a first encapsulation layer on the light-emitting unit, wherein the first encapsulation layer covers the light-emitting unit, and at least a portion of the first encapsulation layer that exceeds the light-emitting unit overlaps between the light-emitting unit and the isolation structure; The above evaporation and deposition process is repeated to form a plurality of the light-emitting units.

23. A display device, characterized in that: The invention comprises the display panel as described in any one of claims 1-10 or the display panel as described in any one of claims 11-21.

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